Patents by Inventor Hideo Hada
Hideo Hada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090130597Abstract: A compound represented by general formula (I); and a compound represented by general formula (b1-1). X-Q1-Y1—SO3?M+??[Chemical Formula 1] (I) X-Q1-Y1—SO3?A+ (b1-1) wherein Q1 represents a divalent linkage group or a single bond; Y1 represents an alkylene group which may have a substituent or a fluorinated alkylene group which may have a substituent; X represents a cyclic group of 3 to 30 carbon atoms which may have a substituent, and has an —SO2— bond in the structure thereof; M+ represents an alkali metal ion; and A+ represents an organic cation.Type: ApplicationFiled: November 5, 2008Publication date: May 21, 2009Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takehiro Seshimo, Yoshiyuki Utsumi, Akiya Kawaue, Hideo Hada, Hiroaki Shimizu, Tsuyoshi Nakamura
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Publication number: 20090130605Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.Type: ApplicationFiled: October 15, 2008Publication date: May 21, 2009Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
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Publication number: 20090117488Abstract: The present invention provides a positive resist composition and a resist pattern forming method that are capable of forming a resist pattern with a reduced level of roughness. The positive resist composition includes the compound represented by the general formula (I) below. The present invention also provides the resist pattern forming method using the positive resist composition above. [wherein, in formula (I), R11 and R12 each represents, independently, an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, and may include a hetero atom in the structure thereof; R21 to R24 each represents, independently, a hydrogen atom or an acid dissociable, dissolution inhibiting group, and two of the R21 to R24 represents a hydrogen atom and the others represents an acid dissociable, dissolution inhibiting group; X is a group represented by general formulas (Ia) or (Ib) below].Type: ApplicationFiled: June 30, 2006Publication date: May 7, 2009Applicant: TOKYO CHKA KOGYO CO., LTDInventors: Takako Hirosaki, Daiju Shiono, Taku Hirayama, Hideo Hada
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Patent number: 7527909Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.Type: GrantFiled: January 10, 2007Date of Patent: May 5, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
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Publication number: 20090104563Abstract: There is provided a compound represented by a general formula (B1-1) shown below, an acid generator composed of the above compound, a resist composition containing an acid generator composed of the above compound, and a method of forming a resist pattern: (wherein RX represents a hydrocarbon group which may contain a substituent group; Q1 represents an alkylene group of 1 to 12 carbon atoms which may contain a substituent group, or a single bond; n represents an integer of 0 or 1; Y1 represents an alkylene group of 1 to 4 carbon atoms, or a fluorinated alkylene group of 1 to 4 carbon atoms; and A+ represents an organic cation which contains a nitrogen atom).Type: ApplicationFiled: October 14, 2008Publication date: April 23, 2009Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Keita Ishiduka, Yoshiyuki Utsumi, Akiya Kawaue, Takehiro Seshimo, Hideo Hada
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Publication number: 20090087625Abstract: A method of producing a structure, including: a composite film formation step that forms a composite film composed of a coating film and an organic film or inorganic film on top of a substrate by conducting Steps (1) to (3) below: (1) forming the coating film composed of a metal layer or a metal oxide layer on the surface of a template provided on top of the substrate, (2) forming the organic film or inorganic film on the surface of the coating film, and (3) removing a portion of the organic film or inorganic film and the coating film; a second coating film formation step that forms a second coating film composed of a metal layer or a metal oxide layer on the surface of the composite film; a coating step that, following formation of the second coating film, forms an organic coating film on the substrate that covers the surface of the substrate; a removal step that removes a portion of the second coating film, the side surfaces of which are at least partially supported by the organic coating film; and a strType: ApplicationFiled: September 2, 2008Publication date: April 2, 2009Applicants: TOKYO OHKA KOGYO CO., LTD., RIKENInventors: Shigenori Fujikawa, Toyoki Kunitake, Hiromi Takemoto, Mari Koizumi, Hideo Hada, Sanae Furuya
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Publication number: 20090081580Abstract: A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.Type: ApplicationFiled: April 17, 2006Publication date: March 26, 2009Applicant: TOKYO OHKA KOGYO CO., LTDInventors: Daiju Shiono, Taku Hirayama, Toshiyuki Ogata, Shogo Matsumaru, Hideo Hada
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Patent number: 7504196Abstract: A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) contains a compound (A1), in which either a portion of, or all of, hydrogen atoms of phenolic hydroxyl groups within a polyhydric phenol compound, which has two or more phenolic hydroxyl groups, a molecular weight of 300 to 2,500, and is represented by a general formula (I) shown below, have been substituted with an acid-dissociable, dissolution-inhibiting group (II) represented by a general formula (II) shown below.Type: GrantFiled: February 9, 2006Date of Patent: March 17, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Daju Shiono, Taku Hirayama, Hideo Hada
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Publication number: 20090068591Abstract: A compound represented by formula (I); and a compound represented by formula (b1-1): wherein X represents —O—, —S—, —O—R3— or —S—R4—, wherein each of R3 and R4 independently represents an alkylene group of 1 to 5 carbon atoms; R2 represents an alkyl group of 1 to 6 carbon atoms, an alkoxy group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, a halogen atom, a hydroxyalkyl group of 1 to 6 carbon atoms, a hydroxyl group or a cyano group; a represents an integer of 0 to 2; Q1 represents an alkylene group of 1 to 12 carbon atoms or a single bond; Y1 represents an alkylene group of 1 to 4 carbon atoms or a fluorinated alkylene group; M+ represents an alkali metal ion; and A+ represents an organic cation.Type: ApplicationFiled: September 10, 2008Publication date: March 12, 2009Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Takeshi Iwai, Hideo Hada, Shinichi Hidesaka, Tsuyoshi Kurosawa, Natsuko Maruyama, Kensuke Matsuzawa, Takehiro Seshimo, Hiroaki Shimizu, Tsuyoshi Nakamura
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Patent number: 7501221Abstract: There is provided a positive type resin composition comprising (A) a resin component comprising within the principal chain a structural unit derived from a (meth)acrylate ester and incorporating an acid dissociable, dissolution inhibiting group containing a polycyclic group on an ester side chain section, for which the solubility in alkali increases under the action of acid, (B) an acid generator component which generates acid on exposure, and (C) an organic solvent, wherein the component (A) comprises both a structural unit derived from a methacrylate ester and a structural unit derived from an acrylate ester. According to such a resist composition, a resist pattern can be formed which displays little surface roughness and line edge roughness on etching, and also offers excellent resolution and a wide depth of focus range.Type: GrantFiled: February 2, 2006Date of Patent: March 10, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takeshi Iwai, Naotaka Kubota, Satoshi Fujimura, Miwa Miyairi, Hideo Hada
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Patent number: 7501220Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.Type: GrantFiled: May 13, 2004Date of Patent: March 10, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
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Publication number: 20090061170Abstract: An anisotropic film is disclosed in which a line-shaped nanostructure is disposed inside a resin film. Also disclosed is a method of producing an anisotropic film that includes: forming a metal nanostructure on a substrate, forming a resin film that embeds the metal nanostructure, and detaching the resin film from the substrate, wherein the step of forming the metal nanostructure on the substrate includes: at least, forming a coating film on the surface of a template provided on the substrate, the coating film including a metal layer formed by electroless plating; and removing a portion or all of the template while retaining a portion or all of the coating film, or removing a portion of the coating film. Also disclosed is an anisotropic film produced using the method of producing an anisotropic film.Type: ApplicationFiled: August 27, 2008Publication date: March 5, 2009Applicants: Tokyo Ohka Kogyo Co., Ltd., RikenInventors: Shigenori Fujikawa, Wakana Kubo, Toyoki Kunitake, Hideo Hada, Sanae Furuya
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Patent number: 7494759Abstract: A positive resist composition comprising (A) a resin component and (B) an acid generator component, wherein the component (A) is a copolymer which comprises constituent units (a1) derived from a mono(?-lower alkyl)acrylate having an acid-dissociable dissolution-inhibiting group, constituent units (b1) derived from a mono ?-lower alkyl)acrylate having a lactone ring, and constituent units (c1) derived from a poly(?-lower alkyl)acrylate; and a positive resist composition comprising (A) a resin component and (B) an acid generator component, wherein the component (A) is a star polymer having a core containing acid-dissociable dissolution-inhibiting groups and arms bonded to the core.Type: GrantFiled: May 24, 2005Date of Patent: February 24, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hideo Hada, Masaru Takeshita, Satoshi Yamada
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Patent number: 7488568Abstract: A resist composition including a base component (A) and an acid-generator component (B), the acid-generator component (B) including an acid generator (B1) including a compound represented by general formula (b1-8) shown below (wherein R401 represents an acid dissociable, dissolution inhibiting group; R41 to R43 each independently represents a halogen atom, a halogenated alkyl group, an alkyl group, an acetyl group, an alkoxy group, a carboxy group or a hydroxyalkyl group; Q represents a divalent linking group or a single bond; and X? represents an anion) or an acid generator (B1?) including a compound represented by general formula (b1-9) shown below (wherein R402 and R403 each independently represents a hydrogen atom, an alkyl group or a halogenated alkyl group; R404 represents an alkyl group or a halogenated alkyl group, wherein R403 and R404 may be bonded to each other to form a ring structure; and X? represents an anion).Type: GrantFiled: April 1, 2008Date of Patent: February 10, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takeshi Iwai, Hideo Hada, Masaru Takeshita, Akiya Kawaue, Keita Ishiduka, Hiroaki Shimizu, Kyoko Ohshita, Tsuyoshi Nakamura, Komei Hirahara, Yuichi Suzuki, Takehiro Seshimo, Kensuke Matsuzawa
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Publication number: 20090035691Abstract: A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) contains a compound (A1), in which either a portion of, or all of, the hydrogen atoms of phenolic hydroxyl groups within a polyhydric phenol compound with a molecular weight of 300 to 2,500 represented by a general formula (I) shown below have been substituted with at least one group selected from the group consisting of acid-dissociable, dissolution-inhibiting groups represented by a general formula (II) shown below and acid-dissociable, dissolution-inhibiting groups represented by a general formula (III) shown below.Type: ApplicationFiled: February 20, 2006Publication date: February 5, 2009Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Daiju Shiono, Taku Hirayama, Hideo Hada
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Publication number: 20090029284Abstract: There are provided a coating material which improves an etching resistance of a pattern in an etching process using a pattern formed on a substrate as a mask. The material is a pattern coating material for an etching process using a pattern formed on a substrate as a mask, including a metal compound (W) which can produce a hydroxyl group on hydrolysis.Type: ApplicationFiled: June 16, 2006Publication date: January 29, 2009Applicants: Tokyo Ohka Kogyo Co., Ltd., RikenInventors: Shogo Matsumaru, Toshiyuki Ogata, Kiyoshi Ishikawa, Hideo Hada, Shigenori Fujikawa, Toyoki Kunitake
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Patent number: 7482108Abstract: The invention provides a polymer compound capable of forming a positive resist composition that can form a high-resolution pattern with a reduced level of LER, an acid generator formed from such a polymer compound, a positive resist composition that includes such a polymer compound, and a method for forming a resist pattern that uses such a positive resist composition.Type: GrantFiled: July 1, 2005Date of Patent: January 27, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Shogo Matsumaru, Masaru Takeshita, Takeshi Iwai, Hideo Hada
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Publication number: 20090023095Abstract: There are provided a novel compound represented by a general formula (b1-1) shown below, which is useful as an acid generator for a resist composition and a manufacturing method thereof, a compound useful as a precursor of the novel compound and a manufacturing method thereof, an acid generator, a resist composition and a method of forming a resist pattern.Type: ApplicationFiled: July 16, 2008Publication date: January 22, 2009Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hideo Hada, Takeshi Iwai, Takehiro Seshimo, Akiya Kawaue, Keita Ishiduka
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Publication number: 20080311522Abstract: A compound represented by general formula (b-14); and acid generator consisting of the compound; and a resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1-14): wherein R7? to R9? each independently represents an aryl group or an alkyl group, wherein two of R7? to R9? may be bonded to each other to form a ring with the sulfur atom, and at least one of R7? to R9? represents a substituted aryl group in which a portion or all of the hydrogen atoms are substituted with an alkoxyalkyloxy group or an alkoxycarbonylalkyloxy group; and X? represents an anion.Type: ApplicationFiled: June 9, 2008Publication date: December 18, 2008Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takeshi Iwai, Hideo Hada, Keita Ishiduka, Akiya Kawaue, Hiroaki Shimizu, Kyoko Ohshita, Tsuyoshi Nakamura, Komei Hirahara, Yuichi Suzuki, Takehiro Seshimo
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Patent number: 7435530Abstract: A positive type resin composition comprising (A) a resin component comprising within the principal chain a structural unit derived from a (meth)acrylate ester and incorporating an acid dissociable, dissolution inhibiting group containing a polycyclic group on an ester side chain section, for which the solubility in alkali increases under the action of acid, (B) an acid generator component which generates acid on exposure, and (C) an organic solvent, wherein the component (A) comprises both a structural unit derived from a methacrylate ester and a structural unit derived from an acrylate ester. According to such a resist composition, a resist pattern can be formed which displays little surface roughness and line edge roughness on etching, and also offers excellent resolution and a wide depth of focus range.Type: GrantFiled: January 9, 2007Date of Patent: October 14, 2008Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takeshi Iwai, Naotaka Kubota, Satoshi Fujimura, Miwa Miyairi, Hideo Hada