Patents by Inventor Hideo Isii

Hideo Isii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7579554
    Abstract: A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: August 25, 2009
    Assignee: Sansha Electric Manufacturing Company Limited
    Inventors: Kenzo Danjo, Hideo Isii, Masao Katooka, Shuji Yokoyama
  • Patent number: 7457139
    Abstract: A power supply apparatus for use with arc-utilizing apparatuses includes a plurality of power supply blocks of the same capacity. Each power supply block includes an input-side rectifying circuit, an inverter, a transformer, and an output-side rectifying circuit. The inverter is controlled by a control circuit in such a manner that high-frequency current flowing the inverter or current flowing through the output-side rectifying circuit can correspond to a reference signal provided by a reference signal generator. The outputs of the output-side rectifying circuits of the power supply blocks are connected in parallel with each other. The values of the reference signals generated by the reference signal generators are made always equal by the action of equipotential lines.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: November 25, 2008
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventors: Hideo Isii, Tetsuro Ikeda, Kenzo Danjo, Yuji Ikejiri
  • Publication number: 20060267180
    Abstract: A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
    Type: Application
    Filed: May 22, 2006
    Publication date: November 30, 2006
    Inventors: Kenzo Danjo, Hideo Isii, Masao Katooka, Shuji Yokoyama
  • Publication number: 20040246755
    Abstract: An input rectifier of a power supply apparatus rectifies a selected one of two, higher and lower AC voltages applied to it. First and second inverters are connected in the output of the input rectifier. A high-frequency transformer is connected to the output of each of the first and second inverters. An output rectifier is connected to the output of each of the high-frequency transformers. When the higher one of the two AC input voltages is applied to the input rectifier, a switching circuit connects the first and second inverters in series between output terminals of the input rectifier. When the lower AC voltage is applied to the input rectifier, the switching circuit connects the first and second inverters in parallel between the output terminals of the input rectifier. When the first and second inverters are connected in series between the output terminals of the input rectifier, a voltage balancing control unit operates to suppress imbalance between input voltages to the first and second inverters.
    Type: Application
    Filed: June 4, 2004
    Publication date: December 9, 2004
    Inventors: Hideo Isii, Tetsuro Ikeda, Kenzo Danjo, Yuji Ikejiri