Abstract: An imaging device includes: a first pad portion that is connected to a voltage supply line in an aperture pixel region, and to which a reference voltage from outside of the semiconductor substrate is supplied; and a second pad portion that is connected to the voltage supply line in the light-shielded pixel region, and to which the reference voltage from outside of the semiconductor substrate is supplied, the second pad portion being separated from the first pad portion.

Abstract: A circuit includes a comparator configured to compare an input signal and another signal and output a signal indicating a result of a comparison, and an element configured to limit an amplitude of the signal indicating the result of the comparison. In a case where a current flowing through the circuit is changed, the element is able to make an adjustment of a range of a change in the amplitude due to the change in the current.

Abstract: A fiber collection tool for collecting a fiber spun by electrospinning is described. The fiber collection tool has a size holdable by the hand of a user, and includes, in its interior, an electroconductive section. Preferably, the fiber collection tool further includes a surface section outside the electroconductive section. In a fiber deposit production method, a user collects, with the fiber collection tool, a fiber spun by the user by performing electrospinning using an electrospinning device having a size holdable by the hand of the user, and thereby produces a film including a deposit of the fiber on a surface of the fiber collection tool. The fiber collection tool, having the deposit formed thereon, is pressed against a surface of an object, and the deposit is transferred onto the surface of the object, to form a film including the fiber deposit on the surface of the object.

Abstract: A photoelectric conversion device includes a pixel, a signal line connected to the pixel, and a first signal holding unit to which a signal is input from the pixel via the signal line. The first signal holding unit includes a first capacitor element and a second capacitor element each configured to hold a signal input from the signal line to a first terminal, an amplifier circuit in which a second terminal of the first capacitor element and a second terminal of the second capacitor element is connected to an input terminal, a first switch connected between the first terminal of the first capacitor element and an output terminal of the amplifier circuit, a second switch connected between the first terminal of the second capacitor element and the output terminal of the amplifier circuit, and a third switch connected to the input terminal of the amplifier circuit.

Abstract: A fiber collection tool for collecting a fiber spun by electrospinning is described. The fiber collection tool has a size holdable by the hand of a user, and includes, in at least a portion of the surface thereof, an electroconductive section having a surface electrical resistivity of 1011 ?/cm2 or less, or a hydrophilic section having a water contact angle of preferably from 15° to 90° at 25° C. A user collects, with the fiber collection tool, a fiber spun by the user by electrospinning using an electrospinning device having a size holdable by the hand of the user, and thereby produces a film including a deposit of the fiber on a surface of the fiber collection tool. The fiber collection tool, having the deposit formed thereon, is pressed against a surface of an object, and the deposit is transferred onto the surface of the object, to form a film including the fiber deposit on the surface of the object.

Abstract: An imaging device according to the present disclosure is provided with: a pixel array having a plurality of pixels arranged in a matrix and outputting pixel signals corresponding to the amount of light received; a first column signal line and a second column signal line respectively provided corresponding to the columns of the pixel array; a first column circuit connected to the first column signal line; a second column circuit connected to the second column signal line; a first control line for controlling the first column circuit; a second control line for controlling the second column circuit; and a plurality of switches provided between the first control line and the second control line, and are controlled by a common signal.

Abstract: A photoelectric conversion device includes a plurality of pixels arranged to form a plurality of columns, a plurality of comparison circuits provided corresponding to the plurality of columns and including a first input node to which a pixel signal output from a pixel of a corresponding column is input and a second input node to which a reference signal is input, a plurality of buffer circuits provided between a reference signal line to which the reference signal is supplied and each of the second input nodes of the plurality of comparison circuits, and a first switch circuit configured to set a connection state between output nodes of the plurality of buffer circuits.

Abstract: A photoelectric conversion apparatus includes a pixel which includes a photoelectric conversion element; a signal line connected with the pixel; a voltage-current conversion unit configured to convert a voltage signal of the signal line into current; and a conversion unit that includes an oversampling type analog-to-digital conversion circuit that converts the current outputted from the voltage-current conversion unit into digital signals. The voltage-current conversion unit converts the voltage signal of the signal line into the current without sampling and holding and outputs the converted current to the conversion unit.

Abstract: A photoelectric conversion device includes a light receiving circuit configured to convert light into an electrical signal, a first hold circuit configured to hold a data signal which represents the electrical signal, a second hold circuit configured to hold a noise signal read out from the light receiving circuit in a reset state, a first resistive element to which a voltage corresponding to a difference between the data signal held by the first hold circuit and the noise signal held by the second hold circuit is applied, an A/D converter configured to convert an analog current flowing in the first resistive element into digital data, a second resistive element, and a temperature detection circuit configured to generate, based on a current flowing in the second resistive element, an analog output corresponding to an internal temperature of the photoelectric conversion device.

Abstract: A nanofiber sheet includes: a substrate layer; and a nanofiber layer located on one surface side of the substrate layer and containing nanofibers of a polymer compound. A peripheral edge of the nanofiber layer has a thickness of from 0.1 to 10 ?m. The nanofiber layer includes a gradation region having a thickness that gradually increases inward from the peripheral edge. The distance W1 between the peripheral edge of the nanofiber layer and a maximum thickness portion where the thickness becomes the greatest in the gradation region is at least 3 mm. A nanofiber sheet manufacturing method involves depositing nanofibers onto a collecting unit by moving at least either a nozzle or the collecting unit, to thereby manufacture a predetermined nanofiber sheet including a gradation region.

Abstract: A photoelectric conversion apparatus comprising: pixels; processors; and a controller. Each of the processors comprise a first column circuit and a second column circuit, each of which perform A/D conversion of converting, into a digital signal, one pixel signal output from the pixel arranged in a corresponding column of the plurality of columns. The controller comprises a generator configured to generate a first signal used in the A/D conversion, and a second signal different from the first signal and used in the A/D conversion. The apparatus further comprises a selector configured to receive the first signal and the second signal, and select and supply one of the first signal and the second signal to the second column circuit in a period in which the first signal is supplied to the first column circuit.

Abstract: A photoelectric conversion device includes a first substrate and a second substrate laminated one on another. The first substrate has a pixel region having a photoelectric conversion element for acquiring a pixel signal, the second substrate has a processing circuit for processing the pixel signal, a first wire, which includes a plurality of wire layers and which is a common wire to be connected in common with a plurality of pixels in the pixel region, is arranged, and a second wire, which includes a plurality of wire layers and which is a wire for supplying a power supply voltage to the processing circuit, is arranged. At least a part of a shield wire, which is not to be electrically connected with any of the first wire and the second wire, is arranged between the first wire and the second wire.

Abstract: A photoelectric conversion apparatus included pixel circuits, signal lines, current sources, a switching circuit configured to switch a connection state among the plurality of signal lines and the plurality of current sources, and a control circuit configured to control the connection state of the switching circuit. The switching circuit can implement a first connection state in which a first signal line and a second signal line are insulated from each other, a first current source is electrically connected to the first signal line, and a second current source is electrically connected to the second signal line, and a second connection state in which at least the first current source is electrically connected to at least the second signal line. The control circuit selects the first and second connection states in first and second operation modes, respectively.

Abstract: A photoelectric conversion device includes a structure in which first and second substrates are stacked. The first substrate includes pixels, first vertical signal lines extending parallel to a first direction, and first joints respectively electrically connected to the first vertical signal lines. The second substrate includes second joints respectively electrically connected to the first joints, second vertical signal lines arranged so as to extend parallel to the first direction, column circuits respectively electrically connected to the second vertical signal lines, connecting lines respectively electrically connected to the second joints, and extending parallel to a second direction orthogonal to the first direction, and an interlayer connection configured to electrically connect each of the second vertical signal lines and the corresponding connecting line of the connecting lines.

Abstract: An embodiment includes: a semiconductor substrate including a pixel well region and a peripheral well region; a pixel ground line arranged above the pixel well region; a pixel well contact between the pixel ground line and the pixel well region; pixels arranged to form columns in the pixel well region; a reference signal generation circuit arranged in the peripheral well region; and comparator units arranged in the peripheral well region, provided to respective columns, and each configured to receive the pixel signal from the pixels on a corresponding column and the reference signal. Each comparator unit includes a comparator having a first input node that receives the pixel signal and a second input node that receives the reference signal, a first capacitor unit between the reference signal generation circuit and the second input node, and a second capacitor unit between the second input node and the pixel ground line.

Abstract: A disclosed comparator includes a comparison circuit including a differential unit that compares an input signal with a reference signal and changes a level of a signal output to a first node in accordance with a result of comparison and an amplifier unit that includes a load element and outputs a signal in accordance with a potential of the first node to a second node, and a positive feedback circuit that is connected to the second node and a third node and changes a level of a signal at the third node at a rate higher than a change rate of a level of a signal at the second node in accordance with a change in a level of a signal at the second node.

Abstract: A photoelectric conversion device includes a pixel array including a plurality of pixels, a signal processor including an A/D conversion device configured to convert an analog signal output from the pixel array into a digital signal, and an output device configured to output, based on a signal output from the signal processor, an amplitude modulated signal having an amplitude value selected from three or more amplitude values.

Abstract: A photoelectric conversion apparatus comprises a first substrate having a light-receiving array and a plurality of driving lines for supplying control signals to the array and a second substrate having a first circuit that includes a driver circuit group configured to generate the control signals and is configured to function as a vertical scanning circuit which supplies the control signals to at least some of the driving lines and a second circuit including a circuit group having the same arrangement as that of the driver circuit group. The second circuit overlaps the at least some driving lines. The at least some driving lines include a driving line not electrically connected to the second circuit. The second substrate includes, at a position overlapping the second circuit, an electrically conductive line used for power supply or transfer of a signal different from the control signals.

Abstract: A solid-state imaging device comprising: a pixel array including pixels arranged in a plurality of rows and in a plurality of columns; a first column circuit group; a second column circuit group disposed in the same side with respect to the pixel array as that in which the first column circuit group is disposed; a first counter configured to supply a count signal to the first column circuit group; and a second counter configured to supply a count signal to the second column circuit group, wherein the first column circuit group and the second column circuit group are arranged to be separate from each other in a direction along the columns, wherein the first column circuit group and the second column circuit group are configured to process pixel signals for different colors.

Abstract: A photoelectric conversion device comprising: a pixel signal line configured to transmit a pixel signal; a ramp wire configured to transmit a ramp signal; a comparator configured to compare the pixel signal to the ramp signal; and a capacitive element disposed to have at least a part thereof overlapping the ramp wire in plan view.