Patents by Inventor Hideo Kubo

Hideo Kubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125561
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Applicant: FUJITSU LIMITED
    Inventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
  • Patent number: 11892246
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: February 6, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
  • Publication number: 20240032251
    Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.
    Type: Application
    Filed: April 19, 2023
    Publication date: January 25, 2024
    Applicant: Fujitsu Limited
    Inventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
  • Publication number: 20230320029
    Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.
    Type: Application
    Filed: February 1, 2023
    Publication date: October 5, 2023
    Applicant: Fujitsu Limited
    Inventors: Yuki Kanai, Kenji Sasabe, Keita Hirai, Hideo Kubo, Atsushi Endo, Masahide Kodama, Takashi Urai
  • Publication number: 20230240046
    Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.
    Type: Application
    Filed: October 31, 2022
    Publication date: July 27, 2023
    Applicant: Fujitsu Limited
    Inventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
  • Publication number: 20220346278
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.
    Type: Application
    Filed: January 25, 2022
    Publication date: October 27, 2022
    Applicant: FUJITSU LIMITED
    Inventors: Masahide KODAMA, Hideo Kubo, KENJI SASABE, Nobumitsu Aoki, ATSUSHI ENDO, Keita Hirai
  • Publication number: 20220322564
    Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.
    Type: Application
    Filed: January 4, 2022
    Publication date: October 6, 2022
    Applicant: FUJITSU LIMITED
    Inventors: Hideo KUBO, Kenji SASABE, Shinnosuke FUJIWARA, Nobumitsu AOKI, Keita HIRAI, Atsushi ENDO, Masahide KODAMA, Kento OHGA
  • Publication number: 20220307772
    Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.
    Type: Application
    Filed: December 2, 2021
    Publication date: September 29, 2022
    Applicant: FUJITSU LIMITED
    Inventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
  • Publication number: 20220299273
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Application
    Filed: January 4, 2022
    Publication date: September 22, 2022
    Applicant: FUJITSU LIMITED
    Inventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
  • Publication number: 20210372707
    Abstract: A cooling device includes a vessel having a refrigerant sealed inside, an evaporator that receives heat to evaporate a liquid phase of the refrigerant inside the vessel, a condenser that dissipates heat to condense a vapor phase of the refrigerant inside the vessel, a tube shaped transporter that transports the liquid-phase refrigerant inside the vessel to the evaporator by capillary action, and a gap generator that generates a gap between the transporter and the evaporator for the liquid-phase refrigerant to move from the transporter to the evaporator.
    Type: Application
    Filed: February 22, 2021
    Publication date: December 2, 2021
    Applicant: FUJITSU LIMITED
    Inventors: Hideo Kubo, ATSUSHI ENDO, Masahide KODAMA, Shinnosuke FUJIWARA
  • Patent number: 11064631
    Abstract: A liquid immersion cooling device for information processing apparatuses. The liquid immersion cooling device includes an immersion tank, a refrigerant liquid that is retained in the immersion tank, and a plurality of fillers that are filled in the immersion tank and that float on a surface of the refrigerant liquid to cover the surface of the refrigerant liquid.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: July 13, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Hideo Kubo, Masayuki Watanabe, Shinnosuke Fujiwara
  • Patent number: 10881019
    Abstract: A cooling apparatus includes an immersion-tank configured to store a refrigerant, a refrigerant suction port formed at a lower portion of the immersion-tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion-tank into an inside of the immersion-tank, an electronic device immersed in the refrigerant, the electronic device including, a first heat-generation portion, a second heat-generation portion having a heat-generation amount smaller than a heat-generation amount of the first heat-generation portion, and a refrigerant inlet positioned below the first heat-generation portion and the second heat-generation portion and being open downward, and a block positioned below the first heat-generation portion and the second heat-generation portion, the block including a through-hole through which a region positioned below the first heat-generation portion in the refrigerant inlet is open, and a closing portion that closes a region positioned below the second heat-ge
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: December 29, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Shinnosuke Fujiwara, Nobumitsu Aoki, Hideo Kubo, Keita Hirai
  • Publication number: 20190281727
    Abstract: A cooling apparatus includes an immersion-tank configured to store a refrigerant, a refrigerant suction port formed at a lower portion of the immersion-tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion-tank into an inside of the immersion-tank, an electronic device immersed in the refrigerant, the electronic device including, a first heat-generation portion, a second heat-generation portion having a heat-generation amount smaller than a heat-generation amount of the first heat-generation portion, and a refrigerant inlet positioned below the first heat-generation portion and the second heat-generation portion and being open downward, and a block positioned below the first heat-generation portion and the second heat-generation portion, the block including a through-hole through which a region positioned below the first heat-generation portion in the refrigerant inlet is open, and a closing portion that closes a region positioned below the second heat-ge
    Type: Application
    Filed: March 4, 2019
    Publication date: September 12, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Shinnosuke FUJIWARA, Nobumitsu Aoki, Hideo Kubo, Keita Hirai
  • Patent number: 10225951
    Abstract: The present application discloses a liquid immersion tank of an electronic equipment, which restrains a gas from being mixed in a circulation path even when an outflow port to a circulation path exists in the vicinity of a liquid surface. The liquid immersion tank of the electronic equipment, which is disclosed in the present application, includes a tank body being receivable of the electronic equipment and being connected to the circulation path of a coolant for liquid-cooling the electronic equipment by being immersed in the liquid coolant, and an enclosure including inside an outflow port to the circulation path and receiving an inflow of the coolant overflowing from a liquid surface in the tank body.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: March 5, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Shinnosuke Fujiwara, Hideo Kubo
  • Patent number: 10212849
    Abstract: The present application discloses a liquid immersion tank capable of withstanding, though made of a resin, a load of coolants and keeping dimensional accuracy. The liquid immersion tank including: a tank body being receivable of an electronic equipment and filled with a fluorine-series insulating coolant; and a fixing portion being provided on an inner wall surface of the tank body and receiving fixation of the electronic equipment, the tank body being equal to or smaller than 2% in modulus of volume change when immersed in the fluorine-series insulating coolant, and being composed of a resin material being equal to or smaller than 15×10?5/K in coefficient of linear expansion.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: February 19, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yoshio Matsumoto, Hideo Kubo
  • Publication number: 20190014685
    Abstract: A liquid immersion cooling device for information processing apparatuses. The liquid immersion cooling device includes an immersion tank, a refrigerant liquid that is retained in the immersion tank, and a plurality of fillers that are filled in the immersion tank and that float on a surface of the refrigerant liquid to cover the surface of the refrigerant liquid.
    Type: Application
    Filed: June 26, 2018
    Publication date: January 10, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Hideo Kubo, Masayuki Watanabe, Shinnosuke FUJIWARA
  • Patent number: 10149408
    Abstract: A liquid immersion bath for an electronic device includes: a bath body that is capable of housing the electronic device, is coupled to a circulation path through which a liquid coolant which cools the electronic device immersed in the liquid coolant circulates, and includes a gas phase portion corresponding to a space free from the liquid coolant; and a container that is disposed in the gas phase portion and has a volume which changes in accordance with a pressure of the gas phase portion, wherein an inside of the container is coupled to an outside of the bath body.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: December 4, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Shinnosuke Fujiwara, Hideo Kubo
  • Patent number: 10098264
    Abstract: An air-conditioning apparatus is an air-conditioning apparatus, for an air-conditioning target space in which a rack including a device as a heat-producing object is provided and which is separated by the rack into a cold space and a hot space, that makes return air from the hot space flow in so as to cool the return air and supplies an arbitrary air volume of the supplied air which is obtained by cooling the return air to the cold space by using a supply fan. The air-conditioning apparatus includes a processor. The processor executes a process including conducting control so that a temperature of the supplied air is equal to a prescribed value that is set in advance, and adjusting an air volume of the supplied air by controlling the supply fan so that a temperature of the return air is equal to a target value that is set in advance.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: October 9, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Takehisa Matsuda, Akira Minegishi, Hideo Kubo, Hiroyuki Fukuda, Toshio Sugimoto, Masaki Takahashi, Syunsuke Ohga
  • Patent number: 10080308
    Abstract: An immersion cooling apparatus includes: a refrigerant tank configured to store a non-boiling fluorine-based insulating refrigerant in which an electronic device is to be immersed; a circulation passage of the fluorine-based insulating refrigerant that is located between the refrigerant tank and a refrigerant cooling device; and a sealed pump that is arranged in the circulation passage, is configured to seal a rotor shaft with an impeller and a bearing portion for the rotor shaft in a sealed case while the rotor shaft and the bearing portion are immersed in the fluorine-based insulating refrigerant, and is configured to circulate the fluorine-based insulating refrigerant between the refrigerant tank and the refrigerant cooling device.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: September 18, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Hideo Kubo, Naofumi Kosugi
  • Patent number: 10015905
    Abstract: An immersion cooling device includes a refrigerant tank configured to accommodate a refrigerant liquid in which an electronic device is immersed; a seal tank configured to accommodate a sealing material and communicate with the refrigerant tank through an upper space of the seal tank, a cable connected to the electronic device being disposed in the upper portion space; and a partition member that, in a state in which a portion of the cable disposed in the upper portion space is immersed in the sealing material in a liquid state, partitions the upper portion space into a first space that is in communication with the refrigerant tank, and a second space that is in communication with an outside of the seal tank.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: July 3, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Masayuki Watanabe, Hideo Kubo