Patents by Inventor Hideo Kumita

Hideo Kumita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150197834
    Abstract: The present invention is to provide metal material for electric/electronic devices, which is comprised of 20 to 50 mass % of Ag or 20 to 50 mass % of Pd to 10 to 40 mass % of Cu, 5 to 30 mass % of Co, said alloy has low contact resistance, good oxidation resistance, high hardness, good workability, and low wettability and anti-erosion property to Sn alloy solder.
    Type: Application
    Filed: March 27, 2015
    Publication date: July 16, 2015
    Inventors: Hideo Kumita, Ryu Shishino, Keiju Uruu
  • Publication number: 20140253281
    Abstract: [Problem to be solved] For an Ag—CuO alloy based electrode material for thermal fuses, rolling workability is significantly decreased as the content of CuO is increasing, and the reduction of a plate thickness is difficult in the rolling process after internal oxidation. [Solution] An electrode material for thermal fuses comprising 50 to 99 mass % of Ag and 1 to 50 mass % of Cu is provided, the material having a structure in which an internal oxidation layer is formed at each of the front and back surfaces, and having a non-oxidized layer in the central portion.
    Type: Application
    Filed: July 5, 2012
    Publication date: September 11, 2014
    Applicant: Tokuriki Honten Co., Ltd.
    Inventors: Naoshi Suzaki, Hideo Kumita
  • Patent number: 7189656
    Abstract: Although an Ag—CdO-based material has excellent electric properties such as deposition resistance, arc resistance and low contact resistance, which are required for an electric contact, the discharge standard provision in Japan, EC Directive on Waste from Electrical and Electronic Equipment (WEEE) and the like have been directed toward disuse of Cd, as already known. Thus, the present invention is characterized in that after an atmosphere in a pressured oxidation furnace is replaced with oxygen, the temperature of an internal-oxidative Ag alloy prepared under a condition of a cold roll rate of 50 to 95% is gradually raised from a temperature of 200° C. or less in a pressured oxygen atmosphere with an oxygen pressure of 5 to 50 kg/cm2 and internal oxidation processing is performed with an upper limit temperature of 700° C.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: March 13, 2007
    Assignee: Tokuriki Honten Co. Ltd.
    Inventors: Sadao Sato, Hideo Kumita, Kohei Tsuda, Mitsuo Yamasita, Kunio Shiokawa, Kenichi Kamiura, Kiyoshi Sekiguchi
  • Publication number: 20050202610
    Abstract: Although an Ag—CdO-based material has excellent electric properties such as deposition resistance, arc resistance and low contact resistance, which are required for an electric contact, the discharge standard provision in Japan, EC Directive on Waste from Electrical and Electronic Equipment (WEEE) and the like have been directed toward disuse of Cd, as already known. Thus, the present invention is characterized in that after an atmosphere in a pressured oxidation furnace is replaced with oxygen, the temperature of an internal-oxidative Ag alloy prepared under a condition of a cold roll rate of 50 to 95% is gradually raised from a temperature of 200° C. or less in a pressured oxygen atmosphere with an oxygen pressure of 5 to 50 kg/cm2 and internal oxidation processing is performed with an upper limit temperature of 700° C.
    Type: Application
    Filed: August 15, 2002
    Publication date: September 15, 2005
    Inventors: Sato Sadeo, Hideo Kumita, Kohei Tsuda, Mitsuo Yamasita, Kunio Shiokawa, Kenichi Kamiura, Kiyoshi Sekiguchi
  • Patent number: 6724292
    Abstract: An object is to provide a thermal fuse that is free of a trouble of welding contact between a movable electrode (4) and a lead (2) even when temperature of an equipment to which the thermal fuse is connected rises gradually and that has small electric resistance at the time of conduction.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: April 20, 2004
    Assignees: NEC Schott Components Corporation, Tokuriki Honten Co., Ltd.
    Inventors: Ikuhiro Miyashita, Tokihiro Yoshikawa, Michihiko Nishijima, Hideo Kumita
  • Publication number: 20030112117
    Abstract: An object is to provide a thermal fuse that is free of a trouble of welding contact between a movable electrode (4) and a lead (2) even when temperature of an equipment to which the thermal fuse is connected rises gradually and that has small electric resistance at the time of conduction.
    Type: Application
    Filed: November 14, 2002
    Publication date: June 19, 2003
    Inventors: Ikuhiro Miyashita, Tokihiro Yoshikawa, MIchihiko NIshijima, Hideo Kumita