Patents by Inventor Hideo Machida
Hideo Machida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11752549Abstract: A coil component includes: a magnetic body part and a cover part covering one side of a magnetic layer part; and a coil part embedded in the magnetic body part. The magnetic body part is comprised of the following two types of layers: (A) an oblate soft magnetic grain-containing layer, and (B) a spherical grain-containing layer, wherein layer (A) extends over the entire range of the magnetic body part except for a portion including the coil part in a direction perpendicular to an axis direction of the coil part, layer (B) adjoins layer (A) in the axis direction. The cover part is constituted by multiple layers including one or more of layer(s) (A) and one or more of layer(s) (B) and extending over the entire range of the magnetic body part in the direction perpendicular to the axis direction.Type: GrantFiled: January 15, 2021Date of Patent: September 12, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Masahiro Hachiya, Hitoshi Matsuura, Takayuki Arai, Shuhei Kurahashi, Hideo Machida, Hidekazu Teshigawara, Naoya Honmo
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Publication number: 20210134506Abstract: A coil component includes: a magnetic body part and a cover part covering one side of a magnetic layer part; and a coil part embedded in the magnetic body part. The magnetic body part is comprised of the following two types of layers: (A) an oblate soft magnetic grain-containing layer, and (B) a spherical grain-containing layer, wherein layer (A) extends over the entire range of the magnetic body part except for a portion including the coil part in a direction perpendicular to an axis direction of the coil part, layer (B) adjoins layer (A) in the axis direction. The cover part is constituted by multiple layers including one or more of layer(s) (A) and one or more of layer(s) (B) and extending over the entire range of the magnetic body part in the direction perpendicular to the axis direction.Type: ApplicationFiled: January 15, 2021Publication date: May 6, 2021Inventors: Masahiro HACHIYA, Hitoshi MATSUURA, Takayuki ARAI, Shuhei KURAHASHI, Hideo MACHIDA, Hidekazu TESHIGAWARA, Naoya HONMO
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Patent number: 10930420Abstract: A coil component includes a magnetic body part and a coil part. The magnetic body part has first and second magnetic layers stacked together alternately in one axis direction, and cover parts covering the first and second magnetic layers from the one axis direction. The coil part has conductor patterns provided on the second magnetic layers. The magnetic body part includes: oblate soft magnetic grain-containing layers extending over the entire range of the magnetic body part in the direction perpendicular to the one axis direction, exposed in the direction perpendicular to the one axis direction, and formed by oblate soft magnetic grains whose thickness direction is oriented in the one axis direction; and spherical grain-containing layers adjoining the oblate soft magnetic grain-containing layers in the one axis direction, and formed by insulative spherical grains.Type: GrantFiled: November 30, 2017Date of Patent: February 23, 2021Assignee: TAIYO YUDEN CO., LTD.Inventors: Masahiro Hachiya, Hitoshi Matsuura, Takayuki Arai, Shuhei Kurahashi, Hideo Machida, Hidekazu Teshigawara, Naoya Honmo
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Publication number: 20180166199Abstract: A coil component includes a magnetic body part and a coil part. The magnetic body part has first and second magnetic layers stacked together alternately in one axis direction, and cover parts covering the first and second magnetic layers from the one axis direction. The coil part has conductor patterns provided on the second magnetic layers. The magnetic body part includes: oblate soft magnetic grain-containing layers extending over the entire range of the magnetic body part in the direction perpendicular to the one axis direction, exposed in the direction perpendicular to the one axis direction, and formed by oblate soft magnetic grains whose thickness direction is oriented in the one axis direction; and spherical grain-containing layers adjoining the oblate soft magnetic grain-containing layers in the one axis direction, and formed by insulative spherical grains.Type: ApplicationFiled: November 30, 2017Publication date: June 14, 2018Inventors: Masahiro HACHIYA, Hitoshi MATSUURA, Takayuki ARAI, Shuhei KURAHASHI, Hideo MACHIDA, Hidekazu TESHIGAWARA, Naoya HONMO
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Patent number: 7799403Abstract: An optical disc has a first transparent substrate, a second substrate, and at least a first and a second recording layer formed between the substrates. The first substrate has a first surface and an opposing second surface, the first surface is a beam incidence surface for a laser beam, the second surface having a first concave section and a first convex section formed adjacent to each other thereon, the first concave section being farther than the first convex section from the incidence surface, first pre-pits being formed on the first concave section. The second substrate has a second concave section and a second convex section formed adjacent to each other thereon, the second concave section being farther than the second convex section from the incidence surface, second pre-pits being formed on the second concave section, a top surface of each second pre-pit being closer than a top surface of the second convex section to the beam surface.Type: GrantFiled: July 3, 2007Date of Patent: September 21, 2010Assignee: Victor Company of Japan, Ltd.Inventors: Katsunori Ohshima, Koji Tsujita, Hideo Machida, Masanori Takahashi, Kenichi Shimomai
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Publication number: 20080008851Abstract: An optical disc has a first transparent substrate, a second substrate, and at least a first and a second recording layer formed between the substrates. The first substrate has a first surface and an opposing second surface, the first surface is a beam incidence surface for a laser beam, the second surface having a first concave section and a first convex section formed adjacent to each other thereon, the first concave section being farther than the first convex section from the incidence surface, first pre-pits being formed on the first concave section. The second substrate has a second concave section and a second convex section formed adjacent to each other thereon, the second concave section being farther than the second convex section from the incidence surface, second pre-pits being formed on the second concave section, a top surface of each second pre-pit being closer than a top surface of the second convex section to the beam surface.Type: ApplicationFiled: July 3, 2007Publication date: January 10, 2008Applicant: Victor Company of Japan, Ltd.Inventors: Katsunori Ohshima, Koji Tsujita, Hideo Machida, Masanori Takahashi, Kenichi Shimomai
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Patent number: 6164023Abstract: A compressive/tensile-load-type lead damper absorbs vibration energy by elastic-plastic deformation through bending of lead. The lead damper has a semicircular structural portion at a central portion, and compressive/tensile load input points at opposite ends of the semicircular structural portion. The center of an imaginary circle that overlaps the semicircular structural portion is located on a line connecting the load input points. The lead damper deforms by only a small amount upon receipt of compressive/tensile load and has a compact structure.Type: GrantFiled: December 16, 1998Date of Patent: December 26, 2000Assignees: Japan Nuclear Cycle Development Institute, Mitsubishi Heavy Industries, Ltd.Inventors: Morito Horikiri, Makoto Ooka, Hideo Machida, Syuichi Ishikura
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Patent number: 5823868Abstract: When the built-in contacts of an actuator for driving a mode switching door malfunction or when a control unit for controlling a stepping motor actuator for driving a mode switching door malfunctions, the actuator is turned to a ventilation mode position or a defrost mode position and then turned reversely from the above position as a starting point to be set to another mode position.Type: GrantFiled: April 10, 1997Date of Patent: October 20, 1998Assignee: Zexel CorporationInventors: Masashi Ohkubo, Hideo Machida
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Patent number: 5647794Abstract: When a fault occurs in the setting unit for setting the position of an actuator or when the control unit for controlling a stepping motor actuator goes out of order, the mode switch door cannot be set to a foot mode or the like other than a ventilation mode and a defrost mode. Therefore, when a fault occurs in the built-in contacts of the actuator for driving the mode switch door or when the control unit for controlling the stepping motor actuator for driving the mode switch door goes out of order, another mode position can be set by moving the actuator to a ventilation mode position or a defrost mode position and then reversing it with the moved position as a starting point.Type: GrantFiled: May 20, 1996Date of Patent: July 15, 1997Assignee: Zexel CorporationInventors: Masashi Ohkubo, Hideo Machida
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Patent number: 4806706Abstract: A printed wiring board includes a dielectric base plate, a circuit pattern at least on one surface of the base plate, and a solder resist film containing silicon series and/or fluorine series and covering the base plate except a desired soldering area of the circuit pattern. The solder resist film has solder repelling property to prevent bridging of solder across adjacent circuits. However, the solder repelling property apts to form dots on the solder resist film. Accordingly, at least one flux accumulating portion is formed on said one surface of the base plate to accumulate flux repelled by the solder resist film. The flux accumulating portion may be a recess and/or through-hole arranged on the surface of the solder resist film.Type: GrantFiled: October 21, 1987Date of Patent: February 21, 1989Assignee: Nippon CMK Corp.Inventors: Hideo Machida, Shin Kawakami, Satoshi Haruyama, Hirotaka Okonogi, Katutomo Nikaido, Norito Mukai
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Patent number: 4185378Abstract: A printed circuit base board comprising an insulating substrate having a thin electric circuit layer composed of an electrically conductive material on one surface is disclosed. This printed circuit base board is drilled at parts of the insulating substrate contiguous to component lead attaching land-forming portions of the electric circuit layer from the opposite surface of the printed circuit base board, while leaving the land-forming portions undrilled, so that composite lead-inserting holes having a size sufficient to insert component leads exactly therein and having one end closed on the side of the land-forming portions of the electric circuit layer and the other end opened are formed.Type: GrantFiled: February 10, 1978Date of Patent: January 29, 1980Assignee: Chuo Meiban Mfg. Co., LTD.Inventor: Hideo Machida
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Patent number: 3947560Abstract: A process for oxidizing sulfur dioxide which comprises contacting a gas containing sulfur dioxide and a gas containing oxygen with an aqueous solution containing at least 3 ppm each of a pentavalent vanadium ion and a divalent manganese ion.Type: GrantFiled: March 5, 1974Date of Patent: March 30, 1976Assignee: Nippon Oil Company, Ltd.Inventors: Masao Nambu, Syunichi Yamamoto, Hideo Machida