Abstract: Provided is a bipolar storage battery in which an electrolytic solution is less likely to enter the interface between a positive electrode and an adhesive layer. Thus, battery performance is less likely to be reduced even if growth occurs in the positive electrode due to corrosion by sulfuric acid contained in the electrolytic solution. The bipolar storage battery includes a bipolar plate including a support column configured to support adjacent plates to each other when stacked, a positive current collector bonded to one surface of the bipolar plate by an adhesive, a positive active material layer placed on the positive current collector, a negative current collector bonded to another surface of the bipolar plate by an adhesive, a negative active material layer placed on the negative current collector, and a cover plate covering a peripheral edge portion of the positive current collector.

Abstract: A bipolar battery includes a plurality of cell members, each including a positive electrode having a positive active material layer, a negative electrode having a negative active material layer, and an electrolyte layer interposed between the positive electrode and the negative electrode. The bipolar battery also includes a plurality of frame units respectively forming a plurality of cells respectively incorporating the plurality of cell members. Each of the plurality of frame units is a frame unit made of a light transmissive resin material. Two of the frame units made of the light transmissive resin material adjacent in a stacking direction of the cell members are welded and joined at a welded portion via a joining member made of a light absorbing resin material. This configuration can provide a bipolar battery capable of reliably preventing electrolytic solution leakage out of a cell by means of a simple seal structure.

Abstract: A bipolar battery includes a plurality of cell members and a plurality of frame units respectively forming a plurality of cells respectively incorporating the plurality of cell members. The plurality of frame units includes frame units made of a light transmissive resin material and frame units made of a light absorbing resin material that are alternately arranged in a stacking direction of the cell members. The frame units made of a light transmissive resin material and the frame units made of a light absorbing resin material adjacent in the stacking direction of the cell members are joined at welded portions. This configuration can provide a bipolar battery capable of reliably preventing electrolytic solution leakage out of a cell by means of a simple seal structure.

Abstract: A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

Abstract: The purpose of the invention is to obtain a negative electrode for a large-capacity nonaqueous electrolyte rechargeable battery having good cycle characteristics. In the present invention, a negative electrode for a nonaqueous electrolyte rechargeable battery is used as a solution, said negative electrode being characterized by having an active material layer on a current collector, said active material layer containing at least granules, and one or more types of coating binder comprising any of a polyimide, polybenzimidazole, polyamide-imide and polyamide. The negative electrode is further characterized in that the granules contain at least active material particles containing: at least one type of element selected from a group comprising Si, Sn, Al, Pb, Sb, Bi, Ge, In and Zn; and a granulation binder.

Abstract: In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).

Abstract: A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

Abstract: In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).

Abstract: A method for producing a fine particle dispersion includes the steps of reducing a metal ion to form a fine particle dispersion aqueous solution; adding an aggregation accelerator into the fine particle dispersion aqueous solution so that agglomerated or precipitated fine particles are separated to obtain fine particles; and re-dispersing the fine particles into an organic solvent containing an organic solvent having an amide group, a low boiling point organic solvent having a boiling point between 20° C. and 100° C. at a normal pressure, and an organic solvent having a boiling point higher than 100° C. at a normal pressure and containing an alcohol and/or a polyhydric alcohol.

Abstract: Disclosed is a fine particle dispersion which is superior in dispersibility and storage stability. Specifically disclosed is a fine particle dispersion in which a fine particle (P) comprised of one type or not less than two types of a metal, an alloy, and/or a metallic compound, having a mean particle diameter of between 1 nm and 150 nm for primary particles thereof, with being coated at least a part of a surface thereof with a polymer dispersing agent (D), is dispersed in a mixed organic solvent. This fine particle dispersion is characterized in that a weight ratio of (D/P) between the polymer dispersing agent (D) coating the surface of the fine particle (P) and the fine particles (P) in the dispersion is between 0.001 and 10, and the mixed organic solvent is one of: (i) a mixed organic solvent which contains an organic solvent (A) as between 50% and 95% by volume having an amide group, and a low boiling point organic solvent (B) as between 5% and 50% by volume having a boiling point of between 20° C.

Abstract: Disclosed is a method for producing a fine particle dispersion such as a dispersion of metal fine particles which is superior in dispersibility and storage stability. Specifically disclosed is a method for producing a fine particle dispersion wherein fine particles of a metal or the like, having a mean particle diameter of between 1 nm and 150 nm for primary particles, are dispersed in an organic solvent.

Abstract: The electromagnetic wave shielding wiring circuit forming method of the present invention comprises the steps of: preparing a fine copper particle dispersion, by dispersing fine copper particles into a disperse medium (S) including an organic solvent (A) having an amide-based compound, an organic solvent (B) having a boiling point of 20° C. or higher at an ordinary pressure and having a donor number of 17 or more, an organic solvent (C) having a boiling point exceeding 100° C. at an ordinary pressure and comprising alcohol and/or polyhydric alcohol, and an organic solvent (E) having an amine-based compound, at specific ratios; coating or printing the fine copper particle dispersion onto a substrate, to form a wiring pattern comprising a liquid film of the fine copper particle dispersion; and firing the liquid film of the fine copper particle dispersion, to form a sintered wiring layer.