Patents by Inventor Hideo Ohta

Hideo Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7892694
    Abstract: An electrolytic membrane comprising a porous membrane substrate containing a cross-linked polymer electrolyte having at least a structural component shown by following chemical formula 1: wherein A represents a repeating unit having an aromatic hydrocarbon group substituted by at least a sulfonic acid group, B represents a repeating unit having one of a nitrogen-containing hetero ring compound residue, and the sulfate, hydrochloride or organic sulfonate thereof, C represents a repeating unit having a cross-linked group, and X, Y and Z represent mol fractions of respective repeating units in the chemical formula 1, with 0.34?X?0.985, 0.005?Y?0.49, 0.01?Z?0.495 and Y?X and Z?X, provided that, in the repeating unit A, a ratio of the aromatic hydrocarbon group substituted by at least a sulfonic acid group is 0.3 to 1.0, and the number of the sulfonic acid group in the aromatic hydrocarbon group is 1 to 3.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: February 22, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiko Nakano, Hideo Ohta, Kazuhiro Yasuda, Jun Tamura
  • Publication number: 20070166590
    Abstract: An electrolytic membrane comprising a porous membrane substrate containing a cross-linked polymer electrolyte having at least a structural component shown by following chemical formula 1: wherein A represents a repeating unit having an aromatic hydrocarbon group substituted by at least a sulfonic acid group, B represents a repeating unit having one of a nitrogen-containing hetero ring compound residue, and the sulfate, hydrochloride or organic sulfonate thereof, C represents a repeating unit having a cross-linked group, and X, Y and Z represent mol fractions of respective repeating units in the chemical formula 1, with 0.34?X?0.985, 0.005?Y?0.49, 0.01?Z?0.495 and Y?X and Z?X, provided that, in the repeating unit A, a ratio of the aromatic hydrocarbon group substituted by at least a sulfonic acid group is 0.3 to 1.0, and the number of the sulfonic acid group in the aromatic hydrocarbon group is 1 to 3.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 19, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshihiko Nakano, Hideo Ohta, Kazuhiro Yasuda, Jun Tamura
  • Patent number: 6964975
    Abstract: The present invention relates to novel isoxazole and thiazole compounds having an excellent lysophosphatidic acid (LPA) receptor antagonistic activity represented by general formula [1] or salts thereof: wherein R1 and R2 represents an optionally substituted alkyl group or the like; R3 represents a hydrogen atom or the like; R4 represent a group selected from the group consisting of (I) optionally substituted phenyl, aryl, or heterocycle, (II) substituted or nonsubstituted alkyl, and (III) substituted or nonsubstituted alkenyl, alternatively, R3 and R4 may form a ring structure together with a carbon atom to which they bind; and X represents an oxygen atom or a sulfur atom, provided that, when R3 is a hydrogen atom, R4 represents a group other than methyl, and the use thereof as a medicine.
    Type: Grant
    Filed: February 19, 2001
    Date of Patent: November 15, 2005
    Assignee: Kirin Beer Kabushiki Kaisha
    Inventors: Akihiro Ueno, Rika Nagao, Tomoko Watanabe, Hideo Ohta, Mikio Yagi
  • Publication number: 20030114505
    Abstract: The present invention relates to novel isoxazole and thiazole compounds having an excellent lysophosphatidic acid (LPA) receptor antagonistic activity represented by general formula [1] or salts thereof: 1
    Type: Application
    Filed: August 19, 2002
    Publication date: June 19, 2003
    Inventors: Akihiro Ueno, Rika Nagao, Tomoko Watanabe, Hideo Ohta, Mikio Yagi
  • Patent number: 6228688
    Abstract: A method of manufacturing a resin-encapsulated semiconductor device, which includes the steps of, mounting a semiconductor element facedown on a substrate provided with a wiring circuit with a main surface of the semiconductor element being faced to the substrate, positioning the substrate bearing the semiconductor element in a mold together with a sealing resin, and applying a pressure onto the sealing resin to move the sealing resin to a space between the semiconductor element and the substrate, to the sides of the semiconductor element and to the bottom surface of the semiconductor element, thereby sealing the semiconductor element with the sealing resin.
    Type: Grant
    Filed: February 2, 1998
    Date of Patent: May 8, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideo Ohta, Tetsuo Okuyama
  • Patent number: 6189449
    Abstract: A web width adjusting device comprises a pressure force applying unit for applying pressure force to one side surface of a paper web which is successively traveled through two or more printing sections. Further the web width adjusting device may also include a counter pressure applying unit to apply counter pressure to the other side surface of the paper web. The pressure applying unit (and the counter pressure applying unit) deformes the paper web in a wavy surface which causes the width of the paper web to be shortened. The adjusting factors for the web width are controlled by automatic control system which detects traveling condition of the paper web, the generation of shears in printing, etc.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: February 20, 2001
    Assignee: KabushikiGaisha Tokyo Kikai Seisakusho
    Inventors: Yuko Tomita, Masayoshi Sato, Takashi Iijima, Hideo Ohta
  • Patent number: 5641997
    Abstract: A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
    Type: Grant
    Filed: September 13, 1994
    Date of Patent: June 24, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideo Ohta, Tetsuo Okuyama, Shinetsu Fujieda, Sadao Kajiura, Akira Yoshizumi
  • Patent number: 5619921
    Abstract: A web width adjusting device can adequately adjust the width of paper web which travels through at least two printing sections. The travelling web is sandwiched by a pair of wave forming devices including a plurality of fluid ejectors which are aligned in the width direction of the paper web. The fluid ejectors of one alignment face alternately the other alignment to alternately eject fluid to both sides of the web.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: April 15, 1997
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Takashi Iijima, Hideo Ohta
  • Patent number: 5611275
    Abstract: A web width adjusting device can adequately adjust the width of paper web which is travelled through at least two printing sections. The travelling web is sandwitched by a pair of contact means including a plurality of contact members which are aligned in parallel to the axis of cylinders for driving the paper web. The contact members of one alignment are alternatively in contact with the web surface with respect to the other alignment.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: March 18, 1997
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Takashi Iijima, Hideo Ohta
  • Patent number: 5598778
    Abstract: A web width adjusting device can adequately adjust the width of paper web which is travelled through at least two printing sections. The travelling web is sandwitched by a pair of contact means including a plurality of contact members which are aligned in parallel to the axis of cylinders for driving the paper web. The contact members of one alignment are alternatively in contact with the web surface with respect to the other alignment.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 4, 1997
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Takashi Iijima, Hideo Ohta
  • Patent number: 5487335
    Abstract: A web width adjusting device can adequately adjust the width of paper web which is travelled through at least two printing sections. The travelling web is sandwitched by a pair of contact means including a plurality of contact members which are aligned in parallel to the axis of cylinders for driving the paper web. The contact members of one alignment are alternatively in contact with the web surface with respect to the other alignment.
    Type: Grant
    Filed: August 17, 1994
    Date of Patent: January 30, 1996
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Takashi Iijima, Hideo Ohta
  • Patent number: 5454316
    Abstract: A printing plate lock-up apparatus for a plate cylinder in a printing press comprises a groove defined in the plate cylinder and having an essentially circular cross section, the groove having an opening end opening to the outer periphery of the plate cylinder and having a width in the circumferential direction smaller than the internal diameter, the opening end having one edge engageable with a turned back edge of the printing plate, an engaging member disposed along the groove and having mating surfaces slidably contacting with the inner periphery of the groove for permitting rotation of the engaging member relative to the groove, the engaging member having an engaging hook engageable with a turned back edge, and having a thickness permitting withdrawal and installation through the opening end, and an operation assembly cooperating with the engaging member for operating the latter to rotate within the groove, the operation assembly maintaining an angular phase of the engaging means at least in the position
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: October 3, 1995
    Assignee: Kabushiki Kaisha Tokyo Kikai Seisakusho
    Inventors: Hideo Ohta, Masahiko Miyoshi
  • Patent number: 5402098
    Abstract: The invention provides a coil comprising a plurality of stacked coil elements connected together at conductor ends to form at least one series of spiral conductors, the coil being characterized in that each of the coil elements includes a sheet insulator, a first conductor in a planar spiral form and provided on one surface of the insulator and a second conductor in a planar spiral form and provided on the other surface of the insulator, the conductors on the respective surfaces of the insulator being wound spirally in directions opposite to each other when seen from above at the same side of the insulator.
    Type: Grant
    Filed: March 23, 1992
    Date of Patent: March 28, 1995
    Assignee: Satosen Co., Ltd.
    Inventors: Hideo Ohta, Chen W. Ping, Sinji Ohki, Yoshiro Morishita, Teruyoshi Sonoda
  • Patent number: 5388513
    Abstract: This invention relates to an offset type rotary press adapted for a color printing system, with printing sections, which prevents print-shears and produces printed matter in high quality. The system of this invention includes an extending area which supplies to the travelling paper web the power to extend in width direction, and at least two printing sections arranged in sequence at the position where the paper web travels after passing through the extending area.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: February 14, 1995
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventor: Hideo Ohta
  • Patent number: 5357864
    Abstract: An offset printing apparatus provides good adhesion of ink onto the roller of the feeding route by efficiently fractionizing the dampening fluid supplied to the ink device. An ink device has an ink feeding route including an ink metering roller and an ink storage device whose distance toward the revolving direction of the upstream roller of said ink feeding route gradually decreases.
    Type: Grant
    Filed: March 7, 1991
    Date of Patent: October 25, 1994
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Hideo Ohta, Masahiko Miyoshi
  • Patent number: 5325583
    Abstract: There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method.
    Type: Grant
    Filed: October 8, 1992
    Date of Patent: July 5, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seizaburo Shimizu, Osamu Sasaki, Akira Yoshizumi, Hideo Ohta
  • Patent number: 5285726
    Abstract: This invention relates to an offset type rotary press adapted for a color printing system, with printing sections, which prevents print-shears and produces printed matter in high quality. The system of this invention includes an extending area, which supplies to the travelling paper web the power to extend in the width direction, and at least two printing sections arranged in sequence at the position where the paper web travels after passing through the extending area.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: February 15, 1994
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventor: Hideo Ohta
  • Patent number: 5277112
    Abstract: A lithographic press includes a plate cylinder having an outer surface which includes a first outer section and a second outer section, and at least one printing plate disposed around one of the first and second outer sections in parallel to a rotational axis of the plate cylinder. The other of the first and second outer sections is uncovered and exposed to the ambient environment. The lithographic press also includes an ink supplying device which feeds ink to the at least one printing plate and the other of the first and second outer sections, and an ink removing device having a contact member which contacts the other of the first and second outer sections of the plate cylinder and removes ink therefrom. A method for removing ink from the other of the first and second outer sections includes removing the ink by way of contact between the ink removing device and the other of the first and second section of the outer surface of the plate cylinder.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: January 11, 1994
    Assignee: Kabushikigaisha Tokyo Kikai Seisakusho
    Inventors: Hideo Ohta, Masahiko Miyoshi
  • Patent number: 5255606
    Abstract: A drag roller device for a printing apparatus comprises a cleaning means for cleaning a drag roller. The cleaning means is in contact with a part of the circumferential surface of the drag roller except for the circumferential area around which a printed continuous sheet fed from a printing section is wound. The cleaning means may be movable within the circumferential area of the drag roller or separable from it. The cleaning means may be supplied with a cleaning liquid.In the drag roller device thus constructed, the cleaning means can remove various stains and/or spots of ink transferred from the circumferential surface of the drag roller and/or additional rollers at each revolution of the drag roller. This cleaning operation of the cleaning means ensures to prevent the printed surface of the continuous sheet succeedingly fed from damaging with the stains and spots of ink from the drag roller and so on.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: October 26, 1993
    Assignee: Kabushikikaisha Tokyo Kikai Seisakusho
    Inventors: Takashi Iijima, Mitsuo Kitai, Hideo Ohta
  • Patent number: D347731
    Type: Grant
    Filed: May 1, 1992
    Date of Patent: June 14, 1994
    Assignee: Makita Corporation
    Inventors: Naohiro Hayakawa, Hideo Ohta