Patents by Inventor Hideo Takimoto

Hideo Takimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin film covered with metal foil and flexible printed wiring board
    Patent number: 4882216
    Abstract: A film comprising a metal foil and a flexible epoxy resin layer covered therewith, wherein the flexible epoxy resin layer is formed from a flexible epoxy resin composition containing one or more polythiol compounds as a hardener, and a flexible printed wiring board produced therefrom.
    Type: Grant
    Filed: August 9, 1988
    Date of Patent: November 21, 1989
    Assignee: Kashima Industries Co.
    Inventors: Hideo Takimoto, Katsuji Tokuda, Koji Yamamoto