Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

Abstract: A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member and a part of the recessed metallic member into a solid solution.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).

Abstract: A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

Abstract: A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

Abstract: A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.

Abstract: In a method for manufacturing of an electronic component device in which an electronic component and a heat dissipating member are connected through a heat conducting member, the method for manufacturing a semiconductor device characterized by comprising the steps of forming one of a plate shape metallic member and a recessed metallic member on the electronic component by vapor deposition processing or plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by the vapor deposition processing or the plating processing, and filling a liquid metal in the recessed part of the recessed metallic member to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).

Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.

Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.