Patents by Inventor Hideto Imajo

Hideto Imajo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10247759
    Abstract: A current sensor includes a first current pathway, a first magnetic sensor arranged near the first current pathway, a second magnetic sensor arranged opposite the first magnetic sensor with the first current pathway in between, a second current pathway, a third magnetic sensor arranged near the second current pathway, a fourth magnetic sensor arranged opposite the third magnetic sensor with the second current pathway in between, and a signal processor that generates a signal based on a quantity of the first measured current from output of the first magnetic sensor and output of the second magnetic sensor, and also generates a signal based on a quantity of the second measured current from output of the third magnetic sensor and output of the fourth magnetic sensor.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: April 2, 2019
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Hidenori Hasegawa, Kenji Kai
  • Patent number: 10215781
    Abstract: To provide a current sensor excellent in insulation resistance. A current sensor (1) includes a conductor (10); a support part (30) for supporting a signal processing IC (20); a magnetoelectric conversion element (13) configured to be electrically connectable to the signal processing IC (20), and arranged in a gap (10a) of the conductor (10) so as to detect a magnetic field generated by a current flowing through the conductor (10); and an insulation member (14) supporting the magnetoelectric conversion element (13).
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: February 26, 2019
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Daigo Takagi
  • Patent number: 10101368
    Abstract: A current sensor includes: a conductor through which a current to be measured flows; magnetoelectric conversion elements disposed near the conductor; and an isolating member for supporting the magnetoelectric conversion elements, and the conductor is disposed so as not to contact with the isolating member and not to support the isolating member.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: October 16, 2018
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Yosuke Koiwa, Toshinori Takatsuka, Hideto Imajo, Kenji Suzuki
  • Publication number: 20170160313
    Abstract: A current sensor includes: a conductor through which a current to be measured flows; magnetoelectric conversion elements disposed near the conductor; and an isolating member for supporting the magnetoelectric conversion elements, and the conductor is disposed so as not to contact with the isolating member and not to support the isolating member.
    Type: Application
    Filed: June 26, 2015
    Publication date: June 8, 2017
    Applicant: Asahi Kasei Microdevices Corporation
    Inventors: Yosuke Koiwa, Toshinori Takatsuka, Hideto Imajo, Kenji Suzuki
  • Patent number: 9448256
    Abstract: It is intended to reduce manufacturing cost in a current sensor including a primary conductor having a U-shaped current path. A current sensor includes a primary conductor having a U-shaped current path, a support portion for supporting a magneto-electric conversion element, and a lead terminal connected to the support portion, and wherein the current path is not overlapped with the support portion in a plan view, while being formed so as to have a height different from that of the support portion in a side view.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: September 20, 2016
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Daigo Takagi
  • Publication number: 20160223594
    Abstract: A current sensor includes a first current pathway, a first magnetic sensor arranged near the first current pathway, a second magnetic sensor arranged opposite the first magnetic sensor with the first current pathway in between, a second current pathway, a third magnetic sensor arranged near the second current pathway, a fourth magnetic sensor arranged opposite the third magnetic sensor with the second current pathway in between, and a signal processor that generates a signal based on a quantity of the first measured current from output of the first magnetic sensor and output of the second magnetic sensor, and also generates a signal based on a quantity of the second measured current from output of the third magnetic sensor and output of the fourth magnetic sensor.
    Type: Application
    Filed: August 29, 2014
    Publication date: August 4, 2016
    Applicant: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Hidenori Hasegawa, Kenji Kai
  • Publication number: 20160187388
    Abstract: To provide a current sensor excellent in insulation resistance. A current sensor (1) includes a conductor (10); a support part (30) for supporting a signal processing IC (20); a magnetoelectric conversion element (13) configured to be electrically connectable to the signal processing IC (20), and arranged in a gap (10a) of the conductor (10) so as to detect a magnetic field generated by a current flowing through the conductor (10); and an insulation member (14) supporting the magnetoelectric conversion element (13).
    Type: Application
    Filed: November 21, 2013
    Publication date: June 30, 2016
    Applicant: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Daigo Takagi
  • Publication number: 20140167736
    Abstract: It is intended to reduce manufacturing cost in a current sensor including a primary conductor having a U-shaped current path. A current sensor includes a primary conductor having a U-shaped current path, a support portion for supporting a magneto-electric conversion element, and a lead terminal connected to the support portion, and wherein the current path is not overlapped with the support portion in a plan view, while being formed so as to have a height different from that of the support portion in a side view.
    Type: Application
    Filed: July 11, 2012
    Publication date: June 19, 2014
    Applicant: ASAHI KASEI MICRODEVICES CORPORATION
    Inventors: Kenji Suzuki, Hideto Imajo, Daigo Takagi