Abstract: Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board 12, a base 13, and a cover 14. In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12, and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.

Abstract: The present invention relates to a power module obtained by connecting the opposite sides of a chip with solder, and prevents the side surfaces of a base portion from becoming wet with solder, which would otherwise cause connection failures of the solder or chip displacement, and also prevents peeling of molding resin, which would otherwise break the chip or shorten the life of the solder. The base portion is integrally formed with one of lead frames, and the side surfaces of the base portion and the surface of the main body of the lead frame are roughened so as to have reduced solder wettability. Meanwhile, the solder connection surface of the base portion is not roughened so as to ensure the solder wettability. Accordingly, it is possible to reduce failures that may occur during solder connection and obtain a highly reliable power module (FIG. 5).

Abstract: Sealing force between a metal case and a power semiconductor module is improved. In a power semiconductor module 3, peripheral side surfaces of power semiconductor devices 31U and 31L and conductor plates 33 to 36 are integrated by being covered with a first sealing resin 6. An oxide layer (rough surface layer) 46 is formed on an inner surface of a metal case 40. A fluid resin material is injected into a space S between the oxide layer 46 provided to the metal case 40 and a power semiconductor module 30, and then a second sealing resin 52 is formed. The second sealing resin 52 fills dents of the oxide layer 46, and therefore sealing force improves.

Abstract: Each of a plurality of power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.

Abstract: Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board 12, a base 13, and a cover 14. In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12, and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.

Abstract: A power module includes a semiconductor device having at least one electrode surface on each side thereof, a first conductive member connected to the electrode surface provided on one side of the semiconductor device with solder, and a second conductive member connected to the electrode surface provided on the other side of the semiconductor device with solder, with at least one of the electrode surfaces provided on the one side of the semiconductor device being double comb-shaped.

Abstract: The present invention relates to a power module obtained by connecting the opposite sides of a chip with solder, and prevents the side surfaces of a base portion from becoming wet with solder, which would otherwise cause connection failures of the solder or chip displacement, and also prevents peeling of molding resin, which would otherwise break the chip or shorten the life of the solder. The base portion is integrally formed with one of lead frames, and the side surfaces of the base portion and the surface of the main body of the lead frame are roughened so as to have reduced solder wettability. Meanwhile, the solder connection surface of the base portion is not roughened so as to ensure the solder wettability. Accordingly, it is possible to reduce failures that may occur during solder connection and obtain a highly reliable power module.

Abstract: Sealing force between a metal case and a power semiconductor module is improved. In a power semiconductor module 3, peripheral side surfaces of power semiconductor devices 31U and 31L and conductor plates 33 to 36 are integrated by being covered with a first sealing resin 6. An oxide layer (rough surface layer) 46 is formed on an inner surface of a metal case 40. A fluid resin material is injected into a space S between the oxide layer 46 provided to the metal case 40 and a power semiconductor module 30, and then a second sealing resin 52 is formed. The second sealing resin 52 fills dents of the oxide layer 46, and therefore sealing force improves.

Abstract: Reliability of power semiconductor modules that excel in cooling performance is to be improved. To achieve the above object, each power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.

Abstract: A power module includes a semiconductor device having at least one electrode surface on each side thereof, a first conductive member connected to the electrode surface provided on one side of the semiconductor device with solder, and a second conductive member connected to the electrode surface provided on the other side of the semiconductor device with solder, with at least one of the electrode surfaces provided on the one side of the semiconductor device being double comb-shaped.

Abstract: A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract: The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.

Abstract: An engine control unit for controlling an automobile engine, which is equipped with a booster circuit for boosting the voltage of battery power source, an injector driving circuit for driving an injector by making use of a boosted high voltage, and a microcomputer for controlling the engine; wherein the engine control unit is featured in that an LC module mounted with a booster coil constituting the booster circuit and with an electrolytic capacitor, a power module mounted with a rectifying device constituting the booster circuit and the injector driving circuit and with a switching device, and a control circuit board mounted with the microcomputer and with a connector acting as an interface for an external member of the engine control unit are laminated each other.

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract: To prevent any uneven solder wetting in a main surface of electrodes of a semiconductor connected with a main surface of a planar lead and any displacement of the lead vis-a-vis the electrodes due to the reflow of the solder in a semiconductor module having the semiconductor element mounted on a substrate and the planar lead electrically connected therewith, the present invention provides an improved semiconductor module characterized in that the width of at least a part of the region of the main surface of the lead facing the semiconductor element is expanded wider than or equal to the width of the electrodes formed on the semiconductor element, and preferably the other part of the main surface of the lead soldered to an electrode formed on the substrate is split in the extending direction thereof.

Abstract: A power module includes a heat radiation layer having the first main surface and the second main surface of reverse side opposed to the first main surface, an insulation layer disposed on the first main surface of a radiation layer, a wiring portion of current circuit disposed on the insulation layer and a plurality of switching elements disposed on the insulation layer and electrically connected to the wiring portion of current circuit. A plurality of external terminals are electrically connected to the wiring portions of current circuit. Furthermore, the module has a resin sealing all of the insulation layer, a wiring portion for current circuit, switching elements and the first main surface of the radiation layer, and a resin sealing a portion of the second main surface of the radiation layer with the resin.

Abstract: A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.