Patents by Inventor Hidetoshi Kaneo

Hidetoshi Kaneo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10299414
    Abstract: [Problem to be Solved] A technical object is to develop a novel cooling mechanism for a data center that can be operated at low running costs, can eliminate dust penetration, water droplet occurrence, and water leakage, can reduce temperature unevenness in the indoor space, and can achieve prompt fire extinction with little damage even in the case where a fire breaks out. [Solution] Provided is a cooling mechanism for a data center, including: an evaporative condenser and a liquid receiver arranged outside of the data center; and an evaporator arranged in an indoor space of the data center. The indoor space is cooled by evaporating a refrigerant in the evaporator, and the refrigerant is condensed by the evaporative condenser.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: May 21, 2019
    Assignees: INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY
    Inventors: Hiroyuki Shiraiwa, Hidetoshi Kaneo
  • Publication number: 20180299168
    Abstract: An evaporative condenser for use in a refrigeration system includes an inclined plate-like refrigerant cooling portion for cooling and condensing refrigerant, an inclined plate-like water spraying portion for spraying the cooling portion with cooling water to cool the refrigerant cooling portion, a casing having an air inlet for taking in air, an air outlet for discharging air, and a draft fan for generating airflow from the air inlet to the air outlet inside the casing. The refrigerant cooling portion has multiple condenser coils arranged in an inclined manner with respect to the horizontal direction to cool the refrigerant while causing the refrigerant to flow downward therethrough. The water spraying portion has multiple water spraying nozzles arranged in an inclined manner along the condenser coils to spray the condenser coils with cooling water. The evaporative condenser efficiently condenses and devolatilizes gaseous refrigerant delivered sequentially after circulating in a condensing cooling cycle.
    Type: Application
    Filed: October 14, 2016
    Publication date: October 18, 2018
    Inventor: Hidetoshi KANEO
  • Publication number: 20160014934
    Abstract: [Problem to be Solved] A technical object is to develop a novel cooling mechanism for a data center that can be operated at low running costs, can eliminate dust penetration, water droplet occurrence, and water leakage, can reduce temperature unevenness in the indoor space, and can achieve prompt fire extinction with little damage even in the case where a fire breaks out. [Solution] Provided is a cooling mechanism for a data center, including: an evaporative condenser and a liquid receiver arranged outside of the data center; and an evaporator arranged in an indoor space of the data center. The indoor space is cooled by evaporating a refrigerant in the evaporator, and the refrigerant is condensed by the evaporative condenser.
    Type: Application
    Filed: February 7, 2014
    Publication date: January 14, 2016
    Inventors: Hiroyuki SHIRAIWA, Hidetoshi KANEO
  • Publication number: 20100089091
    Abstract: The present invention is directed to developing a new absorption refrigerating apparatus that can be miniaturized and can be mounted on a mover such as an automobile or the like. The absorption refrigerating apparatus is characterized in that a semi-permeable membrane is interposed between a refrigerant positioned in an evaporator and an aqueous solution of a moisture absorbent positioned in an absorber and/or between an aqueous solution of a moisture absorbent positioned in a regenerator and a refrigerant positioned in a condenser.
    Type: Application
    Filed: February 6, 2008
    Publication date: April 15, 2010
    Inventor: Hidetoshi Kaneo
  • Patent number: 6619066
    Abstract: A heat pump system for cooling (refrigeration) or heating is provided by employing a combination of natural media such as ammonia and CO2. The heat pump system (1) combines an ammonia cycle (2) and a CO2 cycle (3), and the CO2 medium in the CO2 cycle (3) is circulated, by natural circulation due to a difference of fluid heads of the CO2 medium in the cycle without the necessity of incorporating a compressor, and by partial heating or cooling of the cycle. The structural elements of the ammonia cycle (2) are located away from the devices for the desired refrigeration and heating.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: September 16, 2003
    Assignee: Hachiyo Engineering Co., Ltd.
    Inventor: Hidetoshi Kaneo