Patents by Inventor Hidetoshi Nishiyama
Hidetoshi Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8508727Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.Type: GrantFiled: June 21, 2012Date of Patent: August 13, 2013Assignee: Hitachi High-Technologies CorporationInventors: Sachio Uto, Minori Noguchi, Hidetoshi Nishiyama, Yoshimasa Ohshima, Akira Hamamatsu, Takahiro Jingu, Toshihiko Nakata, Masahiro Watanabe
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Publication number: 20130194579Abstract: In a conventional art, vibrations of compositions (for example, a Z-stage, a ?-stage, a wafer chuck, and a detection optical system mounted above a stage linear scale) within a device are not precisely fed back to a coordinate value.Type: ApplicationFiled: July 19, 2011Publication date: August 1, 2013Inventors: Yukihisa Mohara, Hidetoshi Nishiyama, Shuichi Chikamatsu, Eiji Imai, Koichi Taniguchi
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Patent number: 8482728Abstract: An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. In a foreign matter anti-adhesive means 180, a transparent plate 187 is placed on a placement table 34 through a frame 185. In the foreign matter anti-adhesive means 180, a shaft 181 which is rotatably supported by two columnar supports 184 fixed onto a base 186 is coupled to a motor 182 by a coupling 183. The shaft 181 is inserted into a part of a frame 185 between the two columnar supports 184 such that the frame 185 and the transparent plate 187 are turnable about the shaft 181. Therefore, the whole of the frame 185 is opened and closed in a Z-direction about the shaft 181, and a wafer 1 on the placement table 34 can be covered with the frame 185 and the transparent plate 187.Type: GrantFiled: October 3, 2008Date of Patent: July 9, 2013Assignee: Hitachi High-Technologies CorporationInventors: Sachio Uto, Hidetoshi Nishiyama, Minori Noguchi
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Patent number: 8467594Abstract: In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto.Type: GrantFiled: December 6, 2010Date of Patent: June 18, 2013Assignee: Hitachi High-Technologies CorporationInventors: Kaoru Sakai, Shunji Maeda, Hisae Shibuya, Hidetoshi Nishiyama
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Patent number: 8467048Abstract: A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.Type: GrantFiled: June 28, 2012Date of Patent: June 18, 2013Assignee: Hitachi High-Technologies CorporationInventors: Hidetoshi Nishiyama, Kei Shimura, Sachio Uto, Minori Noguchi
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Patent number: 8435594Abstract: An evaporation apparatus that is capable of stably forming a good quality thin film and is highly suitable for mass production is provided. The evaporation apparatus include an evaporation source discharging an evaporation material by heating, a retention member retaining an evaporation object, and a heat shield member that is located between the evaporation source and the evaporation object retained by the retention member, has an opening for passing the evaporation material in a state of vapor phase from the evaporation source to the evaporation object, and shields the evaporation object from part of radiation heat of the evaporation source. The heat shield member is located closer to the evaporation source than to the retention member.Type: GrantFiled: August 25, 2008Date of Patent: May 7, 2013Assignee: Sony CorporationInventors: Isamu Konishiike, Chisato Okina, Keisuke Tanabe, Atsuhiro Abe, Hidetoshi Nishiyama, Kenichi Kawase, Shunsuke Kurasawa, Koichi Matsumoto
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Patent number: 8410460Abstract: The pattern defect inspection apparatus and its method of the present invention comprises: a recipe setting unit for setting an inspection recipe and/or a review recipe; an illumination optical system including: a laser light source for emitting ultraviolet laser light; a quantity-of-light adjusting unit for adjusting a quantity of the ultraviolet laser light emitted from the laser light source; and an illumination range forming unit for forming on a sample an illumination range of the ultraviolet laser light; a coherence reducing system; and a detection optical system including: a condensing optical system; a diffracted-light control optical system; and a detecting unit.Type: GrantFiled: April 17, 2007Date of Patent: April 2, 2013Assignee: Hitachi High-Technologies CorporationInventors: Minoru Yoshida, Shunji Maeda, Hidetoshi Nishiyama, Masahiro Watanabe
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Publication number: 20130002849Abstract: According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.Type: ApplicationFiled: September 10, 2012Publication date: January 3, 2013Inventors: Kaoru SAKAI, Shunji MAEDA, Hidetoshi NISHIYAMA
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Publication number: 20120312104Abstract: A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.Type: ApplicationFiled: August 23, 2012Publication date: December 13, 2012Inventors: Akira HAMAMATSU, Minori Noguchi, Yoshimasa Ohshima, Hidetoshi Nishiyama, Kenji Oka, Takanori Ninomiya, Maki Tanaka, Kenji Watanabe, Tetsuya Watanabe, Yoshio Morishige
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Publication number: 20120268734Abstract: A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.Type: ApplicationFiled: June 28, 2012Publication date: October 25, 2012Inventors: Hidetoshi NISHIYAMA, Kei SHIMURA, Sachio UTO, Minori NOGUCHI
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Publication number: 20120268742Abstract: Provided is a pattern defect inspecting apparatus wherein inspection performance is stabilized. The defect inspecting apparatus, which has a plurality of configuration units and inspects defects on the surface of a sample, is provided with a means for monitoring time-dependent changes and failures of some of or all of the configuration units, and a means for notifying the user of the results of the monitoring. Furthermore, a unit which can perform correction is provided with a correcting means, and also a means for replacing a failure component with a spare component which has been prepared in the device.Type: ApplicationFiled: June 21, 2010Publication date: October 25, 2012Inventors: Hisashi Hatano, Hiroyuki Yamashita, Hidetoshi Nishiyama
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Publication number: 20120262709Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.Type: ApplicationFiled: June 21, 2012Publication date: October 18, 2012Inventors: Sachio Uto, Minori Noguchi, Hidetoshi Nishiyama, Yoshimasa Ohshima, Akira Hamamatsu, Takahiro Jingu, Toshihiko Nakata, Masahiro Watanabe
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Patent number: 8274651Abstract: A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.Type: GrantFiled: September 16, 2011Date of Patent: September 25, 2012Assignees: Hitachi, Ltd., Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Hidetoshi Nishiyama, Kenji Oka, Takanori Ninomiya, Maki Tanaka, Kenji Watanabe, Tetsuya Watanabe, Yoshio Morishige
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Patent number: 8270700Abstract: According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.Type: GrantFiled: November 12, 2009Date of Patent: September 18, 2012Assignee: Hitachi High-Technologies CorporationInventors: Kaoru Sakai, Shunji Maeda, Hidetoshi Nishiyama
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Patent number: 8269959Abstract: The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.Type: GrantFiled: January 10, 2012Date of Patent: September 18, 2012Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Hidetoshi Nishiyama, Yoshimasa Ohshima, Takahiro Jingu, Sachio Uto
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Patent number: 8254662Abstract: A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom.Type: GrantFiled: September 13, 2011Date of Patent: August 28, 2012Assignee: Hitachi High-Technologies CorporationInventors: Hidetoshi Nishiyama, Minori Noguchi, Tetsuya Watanabe, Takuaki Sekiguchi
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Patent number: 8233145Abstract: A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.Type: GrantFiled: May 17, 2010Date of Patent: July 31, 2012Assignee: Hitachi High-Technologies CorporationInventors: Hidetoshi Nishiyama, Kei Shimura, Sachio Uto, Minori Noguchi
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Patent number: 8228495Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.Type: GrantFiled: August 31, 2011Date of Patent: July 24, 2012Assignee: Hitachi High-Technologies CorporationInventors: Sachio Uto, Minori Noguchi, Hidetoshi Nishiyama, Yoshimasa Ohshima, Akira Hamamatsu, Takahiro Jingu, Toshihiko Nakata, Masahiro Watanabe
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Patent number: 8218138Abstract: A defect inspection apparatus and method includes utilizing an irradiation optical system that focuses a beam flux emitted from a laser light source and formed into a slit-shaped beam so as to irradiate the beam onto the surface of the substrate to be inspected, utilizing a detection optical system that detects light from the substrate that has been irradiated with the slit-shaped beam, and utilizing a signal processor that processes a signal output from the detection optical system. The irradiation optical system includes a cylindrical lens for focusing the beam that has been emitted from the laser light source onto the substrate to be inspected, as the slit-shaped beam, wherein the cylindrical lens is disposed so as to obtain a distance between an incidence surface or emitting surface thereof and the slit-shaped beam upon the substrate to be inspected to be equal to a focal distance of the cylindrical lens.Type: GrantFiled: June 29, 2011Date of Patent: July 10, 2012Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Nakano, Akira Hamamatsu, Sachio Uto, Yoshimasa Oshima, Hidetoshi Nishiyama, Yuta Urano, Shunji Maeda
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Publication number: 20120133929Abstract: The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.Type: ApplicationFiled: January 10, 2012Publication date: May 31, 2012Inventors: Akira HAMAMATSU, Minori NOGUCHI, Hidetoshi NISHIYAMA, Yoshimasa OHSHIMA, Takahiro JINGU, Sachio UTO