Patents by Inventor Hidetoshi Tabata

Hidetoshi Tabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178654
    Abstract: A power cutoff device (20) comprises a power relay (21), a temperature calculation unit (22a), and a determination unit (22b). The power relay (21) includes a drive coil (21a). The temperature calculation unit (22a) calculates the temperature of the drive coil (21a) by calculating the resistance value of a resistor that changes with temperature when the drive coil (21a) included in the power relay (21) is regarded as a resistor. The determination unit (22b) determines whether or not to cut off the power supply on the basis of the temperature of the drive coil (21a) calculated by the temperature calculation unit (22a).
    Type: Application
    Filed: October 20, 2023
    Publication date: May 30, 2024
    Applicant: OMRON CORPORATION
    Inventors: Kenichi TABATA, Daiki ANDO, Hidetoshi YUGEN
  • Patent number: 9280062
    Abstract: An exposure device can exposes a circuit pattern while information data is suitably changed. An exposure device comprises a first light source (20) for irradiating a first light including ultraviolet rays, a projection exposure unit (70) for exposing a circuit pattern drawn on a photomask on a substrate, with the first light, a substrate stage (60) for mounting the substrate, a housing (11) for arranging the substrate stage, a second light source (41) for irradiating a second light including ultraviolet rays, arranged at a position different from the first light source, a spatial light modulation unit (40) for exposing information data formed electrically using the second light on the substrate, and a spatial optical light modulation unit driving means (5) for moving the spatial light modulation unit arranged on the housing (11) in a direction parallel to a moving direction of the substrate stage.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: March 8, 2016
    Assignee: Orc Manufacturing Co., LTD.
    Inventors: Duk Lee, Hidetoshi Tabata
  • Publication number: 20130308111
    Abstract: An exposure device can exposes a circuit pattern while information data is suitably changed. An exposure device comprises a first light source (20) for irradiating a first light including ultraviolet rays, a projection exposure unit (70) for exposing a circuit pattern drawn on a photomask on a substrate, with the first light, a substrate stage (60) for mounting the substrate, a housing (11) for arranging the substrate stage, a second light source (41) for irradiating a second light including ultraviolet rays, arranged at a position different from the first light source, a spatial light modulation unit (40) for exposing information data formed electrically using the second light on the substrate, and a spatial optical light modulation unit driving means (5) for moving the spatial light modulation unit arranged on the housing (11) in a direction parallel to a moving direction of the substrate stage.
    Type: Application
    Filed: November 4, 2011
    Publication date: November 21, 2013
    Applicant: ORC MANUFACTURING CO., LTD.
    Inventors: Duk Lee, Hidetoshi Tabata
  • Patent number: 4645349
    Abstract: An improved method of measuring film thickness of the film layer on a certain material is disclosed. The method is carried out by way of the steps of measuring reflection intensity spectrum, determining extreme values of wavelength relative to the spectrum, preparing an expected value table relative to the reflection interference orders associated with the extreme values of wavelength, calculating a group of expected values of film thickness with reference to the expected value table, calculating deviated values among the values of film thickness in association with the group of expected values, determining the expected orders which minimize absolute values corresponding to deviated values as true interference orders and determining a required film thickness with reference to the thus determined interference orders.
    Type: Grant
    Filed: May 10, 1985
    Date of Patent: February 24, 1987
    Assignee: O R C Manufacturing Co., Ltd.
    Inventor: Hidetoshi Tabata