Abstract: The method of manufacturing an ink-jet head of this invention includes the steps of forming plural individual electrodes and plural piezoelectric devices stacked in this order on a supporting substrate; flattening a top surface of the supporting substrate including the individual electrodes and the piezoelectric devices by filling a filler in a portion on the supporting substrate where the individual electrodes and the piezoelectric devices are not formed up to substantially the same level as a level of upper surfaces of the piezoelectric devices; forming a common electrode on the entire flattened top surface of the supporting substrate; fixing a pressure chamber part for forming pressure chambers on the common electrode; and removing the supporting substrate after fixing the pressure chamber part on the common electrode. Thus, the entire plane on which the common electrode is to be formed is flattened before forming the common electrode.

Abstract: The method of manufacturing an ink-jet head of this invention includes the steps of forming plural individual electrodes and plural piezoelectric devices stacked in this order on a supporting substrate; flattening a top surface of the supporting substrate including the individual electrodes and the piezoelectric devices by filling a filler in a portion on the supporting substrate where the individual electrodes and the piezoelectric devices are not formed up to substantially the same level as a level of upper surfaces of the piezoelectric devices; forming a common electrode on the entire flattened top surface of the supporting substrate; fixing a pressure chamber part for forming pressure chambers on the common electrode; and removing the supporting substrate after fixing the pressure chamber part on the common electrode. Thus, the entire plane on which the common electrode is to be formed is flattened before forming the common electrode.

Abstract: The method of manufacturing an ink-jet head of this invention includes the steps of forming plural individual electrodes and plural piezoelectric devices stacked in this order on a supporting substrate; flattening a top surface of the supporting substrate including the individual electrodes and the piezoelectric devices by filling a filler in a portion on the supporting substrate where the individual electrodes and the piezoelectric devices are not formed up to substantially the same level as a level of upper surfaces of the piezoelectric devices; forming a common electrode on the entire flattened top surface of the supporting substrate; fixing a pressure chamber part for forming pressure chambers on the common electrode; and removing the supporting substrate after fixing the pressure chamber part on the common electrode. Thus, the entire plane on which the common electrode is to be formed is flattened before forming the common electrode.