Abstract: Behind an electronic circuit, a backing member is provided. The backing member is composed of an auxiliary backing having a first thermal anisotropic property, and a main backing having a second thermal anisotropic property different from the first thermal anisotropic property. The auxiliary backing exhibits a heat diffusion effect in an X direction. The main backing exhibits a heat transfer effect in a Y direction.

Abstract: Behind an electronic circuit, an auxiliary backing having a first thermal anisotropic property is provided. A main backing having a second thermal anisotropic property different from the first thermal anisotropic property is provided behind the auxiliary backing. In the main backing, each of two outer surfaces perpendicular to a Y direction functions as a heat output surface. Heat is transferred from these two outer surfaces to a shell, which is a heat absorbing member.

Abstract: Behind an electronic circuit, a thermally anisotropic main backing is provided. The main backing has two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. In a first gap located adjacent to one of the outer surfaces, an FPC and a first group of electric components are arranged. In a second gap located adjacent to the other one of the outer surfaces, the FPC and a second group of electric components are arranged.

Abstract: Behind an electronic circuit, a main backing is provided. The main backing has two outer surfaces (high thermal conductivity surfaces) perpendicular to a Y direction, and two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. The two outer surfaces perpendicular to the Y direction are joined to a shell head, which is a heat absorbing member. A temperature sensor is provided on a specific one of the outer surfaces perpendicular to the Y direction. The shell head has a recess in which the temperature sensor is received.

Abstract: The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A backing 20 includes a lead array 24a that electrically connects each vibration element 12 and a plurality of ICs 32. Each bump 42 provided at a lower end portion of each lead 24 is connected to a conductor pad on an upper side surface of a relay substrate 26, and a ball-shaped terminal 44 of each IC 32 is connected to a lower surface of the relay substrate 26. The lower end portions of the leads 24 are grouped into a plurality of dense groups 46 corresponding to each IC 32 in a longitudinal direction (X-axis direction) by wiring patterns of the leads.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A body-cavity-insertion-type probe wherein an internal unit (internal assembly) has an oscillator unit, a relay board, and electronic circuit board, and a backing member. The backing member is retained in a state of being housed inside a backing case, and the backing case is retained by two recesses formed in an inside surface of a heat dissipation shell as a probe head case. An exhaust heat sheet is joined to a peripheral region of a back surface of the electronic circuit board. A rear wing and a front wing of the exhaust heat sheet are joined to the backing case.

Abstract: A probe that is inserted into a body cavity, wherein an inner unit (inner assembly) comprises an oscillator unit, an intermediate substrate, an electronic circuit substrate, and a backing member. An exhaust heat sheet is joined to an area at the perimeter of the rear surface of the electronic circuit substrate. The exhaust heat sheet comprises a main body part and a plurality of wings that extend to the outside from the main body part. The plurality of wings include a right wing and a left wing. The wings are inserted into two slits formed in a probe head case (heat radiating shell), and the end parts of the wings are accommodated in and adhered to two recessed sections formed in the outer surface of the probe head case. Thus, heat generated inside the probe head case can be directly transferred to the outer surface of the probe head case.

Abstract: A body-cavity-insertion-type probe wherein an internal unit (internal assembly) has an oscillator unit, a relay board, and electronic circuit board, and a backing member. The backing member is retained in a state of being housed inside a backing case, and the backing case is retained by two recesses formed in an inside surface of a heat dissipation shell as a probe head case. An exhaust heat sheet is joined to a peripheral region of a back surface of the electronic circuit board. A rear wing and a front wing of the exhaust heat sheet are joined to the backing case.

Abstract: A probe that is inserted into a body cavity, wherein an inner unit (inner assembly) comprises an oscillator unit, an intermediate substrate, an electronic circuit substrate, and a backing member. An exhaust heat sheet is joined to an area at the perimeter of the rear surface of the electronic circuit substrate. The exhaust heat sheet comprises a main body part and a plurality of wings that extend to the outside from the main body part. The plurality of wings include a right wing and a left wing. The wings are inserted into two slits formed in a probe head case (heat radiating shell), and the end parts of the wings are accommodated in and adhered to two recessed sections formed in the outer surface of the probe head case. Thus, heat generated inside the probe head case can be directly transferred to the outer surface of the probe head case.