Patents by Inventor Hideya SEKIGUCHI

Hideya SEKIGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Foam and method for producing same
    Patent number: 11945927
    Abstract: [Problem] An object of the present invention is to provide a foam including a thermoplastic resin and rubber as a main component, in which a micronized product of a cellulose fiber is uniformly dispersed, and uniformity and mechanical properties are excellent. [Solution] A foam includes a modified cellulose fiber (A) covalently bonded with a diene-based polymer, a thermoplastic resin and/or rubber (B), and a diene-based polymer (C) having a functional group capable of covalently bonding with a cellulose fiber, in which the fiber (A) is micronized, the fiber (A) has a content of 0.05 to 20% by mass, and the thermoplastic resin and/or rubber (B) has a glass transition point of ?130° C. to 120° C.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: April 2, 2024
    Assignee: SEIKO PMC CORPORATION
    Inventors: Ryo Miyamori, Daisuke Kuroki, Hideya Sekiguchi, Akihiro Sato
  • FOAM AND METHOD FOR PRODUCING SAME
    Publication number: 20220025142
    Abstract: [Problem] An object of the present invention is to provide a foam including a thermoplastic resin and rubber as a main component, in which a micronized product of a cellulose fiber is uniformly dispersed, and uniformity and mechanical properties are excellent. [Solution] A foam includes a modified cellulose fiber (A) covalently bonded with a diene-based polymer, a thermoplastic resin and/or rubber (B), and a diene-based polymer (C) having a functional group capable of covalently bonding with a cellulose fiber, in which the fiber (A) is micronized, the fiber (A) has a content of 0.05 to 20% by mass, and the thermoplastic resin and/or rubber (B) has a glass transition point of ?130° C. to 120° C.
    Type: Application
    Filed: February 26, 2020
    Publication date: January 27, 2022
    Inventors: Ryo MIYAMORI, Daisuke KUROKI, Hideya SEKIGUCHI, Akihiro SATO