Abstract: A multilayer ceramic capacitor includes: a multilayer structure having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure, a main component of the plurality of dielectric layers being a ceramic; and a first cover layer and a second cover layer that sandwich the multilayer structure in a stacking direction of the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer includes a first region spaced from the multilayer structure by at least 50 ?m, is thicker than the second cover layer, and has a thickness more than 50 ?m.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including a functional part in which first internal electrodes and second internal electrodes are laminated in a vertical direction, end margin parts provided respectively between a first end surface of the ceramic main body and the second internal electrodes and between a second end surface of the ceramic main body and the first internal electrodes, and side margin parts that respectively cover the functional part from sides. The electronic component further includes external electrodes respectively provided on the first end surface and the second end surface. The end margin parts contain boron (B), and the side margin parts contain silicon (Si) and boron. A concentration of boron in the side margin parts is less than a concentration of boron in the end margin parts.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure, a main component of the plurality of dielectric layers being a ceramic; and a first cover layer and a second cover layer that sandwich the multilayer structure in a stacking direction of the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer includes a first region spaced from the multilayer structure by at least 50 ?m, is thicker than the second cover layer, and has a thickness more than 50 ?m.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including a functional part in which first internal electrodes and second internal electrodes are laminated in a vertical direction, end margin parts provided respectively between a first end surface of the ceramic main body and the second internal electrodes and between a second end surface of the ceramic main body and the first internal electrodes, and side margin parts that respectively cover the functional part from sides. The electronic component further includes external electrodes respectively provided on the first end surface and the second end surface. The end margin parts contain boron (B), and the side margin parts contain silicon (Si) and boron. A concentration of boron in the side margin parts is less than a concentration of boron in the end margin parts.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure; and a first cover layer and a second cover layer that sandwich the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer is thicker than the second cover layer, wherein a concentration of Mn of at least a part of the first cover layer is higher than a concentration of Mn of the dielectric layers in an effective capacity region in which a set of internal electrode layers exposed to a first edge face of the multilayer structure face with another set of internal electrode layers exposed to a second edge face of the multilayer structure.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure; and a first cover layer and a second cover layer that sandwich the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer is thicker than the second cover layer, wherein a concentration of Mn of at least a part of the first cover layer is higher than a concentration of Mn of the dielectric layers in an effective capacity region in which a set of internal electrode layers exposed to a first edge face of the multilayer structure face with another set of internal electrode layers exposed to a second edge face of the multilayer structure.

Abstract: A multi-layer ceramic capacitor has a laminate of dielectric layers and internal electrode layers laminated alternately with one another, as well as cover layers formed as the outermost layers at the top and bottom of the laminate in the laminating direction, wherein the dielectric layers are constituted by a sintered compact containing a barium titanate and a silicon compound, and a fresnoite phase having an average grain size of 1 ?m or less is present in the dielectric layers.

Abstract: A multi-layer ceramic capacitor has a laminate of dielectric layers and internal electrode layers laminated alternately with one another, as well as cover layers formed as the outermost layers at the top and bottom of the laminate in the laminating direction, wherein the dielectric layers are constituted by a sintered compact containing a barium titanate and a silicon compound, and a fresnoite phase having an average grain size of 1 ?m or less is present in the dielectric layers.