Abstract: The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

Abstract: An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device includes an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device, wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.

Abstract: The purpose of the present invention is to provide a cover tape for packaging semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for semiconductor device using the cover tape for packaging semiconductor device. The cover tape for packaging semiconductor device of the present invention has a net-like structure 20 at least in a portion, and the cover tape for packaging semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices so as to cover the pockets. The package for semiconductor device of the present invention contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging semiconductor device of the present invention.

Abstract: An electronic device receiving apparatus having a sealed structure, includes a tape whereby an electronic device is received in the electronic device receiving apparatus. The tape elastically holds the electronic device and runs inside of the electronic device receiving apparatus. An opening part for loading/unloading and a tape extending mechanism are provided inside of the electronic device receiving apparatus. The opening part for loading/unloading is provided above the tape so that the electronic device is loaded onto and unloaded from the tape. The opening part for loading/unloading has an opening part configured to open the electronic device receiving apparatus. The tape extending part extends the tape in a direction substantially perpendicular to a running direction of the tape.

Abstract: A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.

Abstract: A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.

Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.