Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 represents a single bond or an organic group. R4 to R9 each independently represents a hydrogen atom, an organic group, etc., but R6 and R7 are not hydroxyl groups. R10 represents a hydrogen atom or an organic group.

Abstract: Provided are: a novel triepoxy compound capable of forming, through polymerization, a cured article having excellent heat resistance; a production method thereof; a curable composition including the triepoxy compound; and a cured article obtained by curing the curable composition. The triepoxy compound according to the present invention is represented by Formula (1). The triepoxy compound represented by Formula (1) may be obtained typically by oxidizing a compound represented by Formula (2) with an oxidizing agent. In Formulae (1) and (2), R1 to R2° are the same as or different from one another and each represent hydrogen atom, methyl group, or ethyl group.

Abstract: There is provided a diepoxy compound that can be polymerized to form a cured product having thermal stability that has excellent heat resistance, and can maintain excellent mechanical properties even if exposed to a high temperature environment. The saturated diepoxy compound of the present invention is represented by the following formula (1) and can be produced by hydrogenating the unsaturated bond of an unsaturated diepoxy compound represented by the following formula (2). In the following formulas, R1 to R20 are each an independent group and identically or differently represent a hydrogen atom, a methyl group, or an ethyl group.

Abstract: Provided are: a novel triepoxy compound capable of forming, through polymerization, a cured article having excellent heat resistance; a production method thereof; a curable composition including the triepoxy compound; and a cured article obtained by curing the curable composition. The triepoxy compound according to the present invention is represented by Formula (1). The triepoxy compound represented by Formula (1) may be obtained typically by oxidizing a compound represented by Formula (2) with an oxidizing agent. In Formulae (1) and (2), R1 to R2° are the same as or different from one another and each represent hydrogen atom, methyl group, or ethyl group.

Abstract: To provide the mechanical brake actuator enabling to downsize the device and to reduce the manufacturing costs of the parts. The mechanical brake actuator comprises the strut (23) which engages with one brake shoe (12) and has two facing plates (23b) with a strut-bridge (23a) connecting therebetween and the plate-like brake lever (24) which engages with the other brake shoe (13). The brake lever (24) is retained in the space (23c) between the facing strut plates and is pivotally supported on the strut (23), and the inner cable (41) of the brake cable (40) connected to the free end (24e) of the brake lever (24) via the connecting pin (43). The mechanical brake actuator which is operated by pulling the inner cable (41) comprises the clip (70), which rotatably attaches to the strut-bridge (23a) and restricts the rotation of the brake lever (24) in the cable releasing direction.

Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.

Abstract: An ink contains at least a pigment, wherein the pigment is a solid solution of C.I. Pigment Red 202 and C.I. Pigment Violet 19, and a primary particle diameter D (nm) of the pigment and a 50%-cumulative diameter D50 (nm) in particle diameter distribution of the pigment satisfy a relation of D×0.95?(=<)D50?(=<)130, and a 90%-cumulative diameter D90 (nm) in particle diameter distribution of the pigment and the 50%-cumulative diameter D50 (nm) satisfy a relation of 1.5?(=<)D90/D50?(=<)2.2.

Abstract: An ink contains at least a pigment, wherein the pigment is C.I. Pigment Red 282, and a primary particle diameter D (nm) of the pigment and a 50%-cumulative diameter D50 (nm) in particle diameter distribution of the pigment satisfy a relation of D×0.95?D50?150, and a 90%-cumulative diameter D90 (nm) in particle diameter distribution of the pigment and the 50%-cumulative diameter D50 (nm) satisfy a relation of 1.5?D90/D50?2.5.

Abstract: Disclosed is a method for producing a cyclic olefin compound having two or more cyclohexene rings per molecule via intramolecular dehydration of an alicyclic alcohol having two or more hydroxylated cyclohexane rings per molecule. The method includes the step (i) of heating the alicyclic alcohol at a temperature of 130° C. to 230° C. and a pressure greater than 20 Torr in an organic solvent in the presence of a dehydration catalyst, to carry out dehydration of the alicyclic alcohol while distilling off by-product water, which dehydration catalyst is liquid or soluble in a liquid reaction mixture under the reaction conditions; and the subsequent step (ii) of heating the resulting reaction mixture at a temperature of 50° C. to 220° C. and a pressure of 200 Torr or less to recover the cyclic olefin compound as a distillate.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3?,4?-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3?,4?-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3?,4?-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3?,4?-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3?,4?-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3?,4?-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.

Abstract: A liquid epoxy resin composition of an epoxy resin, a curing agent, and a curing accelerator, where the epoxy resin is an alicyclic epoxy compound present in an amount from 100 to 30% by weight. The alicyclic epoxy compound is preferably produced by using a percarboxylic acid having a water content of 2% by weight. The curing agent is preferably a liquid acid anhydride.

Abstract: An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. A cured product thereof shows useful physical properties for uses in coatings, inks, adhesives, sealants, and encapsulants, etc. It is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. A stabilizer for an electrical insulating oil (the alicyclic diepoxy compound or an electrical insulting oil containing the compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. A cured product obtained by curing a casting epoxy resin composition for electrical insulation has excellent properties such as high bending strength, high Tg, and low permittivity.

Abstract: An ink contains at least a pigment, wherein the pigment is C.I. Pigment Red 282, and a primary particle diameter D (nm) of the pigment and a 50%-cumulative diameter D50 (nm) in particle diameter distribution of the pigment satisfy a relation of D×0.95?D50?150, and a 90%-cumulative diameter D90 (nm) in particle diameter distribution of the pigment and the 50%-cumulative diameter D50 (nm) satisfy a relation of 1.5?D90/D50?2.5.

Abstract: An ink contains at least a pigment, wherein the pigment is a solid solution of C.I. Pigment Red 202 and C.I. Pigment Violet 19, and a primary particle diameter D (nm) of the pigment and a 50%-cumulative diameter D50 (nm) in particle diameter distribution of the pigment satisfy a relation of D×0.95?(=<)D50?(=<)130, and a 90%-cumulative diameter D90 (nm) in particle diameter distribution of the pigment and the 50%-cumulative diameter D50 (nm) satisfy a relation of 1.5?(=<)D90/D50?(=<)2.2.

Abstract: A high-purity cycloaliphatic diepoxy compound of General Formula (II) is an epoxidized product of a cycloaliphatic diolefinic compound of General Formula (I) having an isomer content as detected in gas chromatography (GC) of 15% or less: wherein X represents a bivalent group selected from the group consisting of, for example, O, S, —SO—, —SO2—, —CH2—, and —C(CH3)2—; and R1 to R18 may be the same as or different from each other and each represent hydrogen atom, a halogen atom, a hydrocarbon group which may contain oxygen atom or a halogen atom, or an alkoxy group which may be substituted. Such a high-purity cycloaliphatic diepoxy compound is prepared by producing the cycloaliphatic diolefinic compound through distillation, epoxidizing the compound with an aliphatic percarboxylic acid containing substantially no water, carrying out desolvation, and further purifying the epoxidized compound through distillation.

Abstract: An ink contains at least a pigment, wherein the pigment is a solid solution of C.I. Pigment Red 202 and C.I. Pigment Violet 19, and a primary particle diameter D (nm) of the pigment and a 50%-cumulative diameter D50 (nm) in particle diameter distribution of the pigment satisfy a relation of D×0.95?(=<)D50?(=<)130, and a 90%-cumulative diameter D90 (nm) in particle diameter distribution of the pigment and the 50%-cumulative diameter D50 (nm) satisfy a relation of 1.5?(=<)D90/D50?(=<)2.2.