Patents by Inventor Hideyuki Wakabayashi

Hideyuki Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230058756
    Abstract: An object is to provide a novel saccharide-reduced fruit beverage having an improved flavor. According to the present invention, provided is a fruit beverage containing citrus fruit and having a sucrose concentration of 1.4 g/100 mL or less in terms of Brix 11°, in which the beverage has an ethyl ester concentration of 25 to 50 ppb and/or a monoterpene derivative concentration of 600 to 3,000 ppb. The citrus fruit in the present invention can be selected from the group consisting of oranges, grapefruit, and Unshu mikan, and a proportion of a fruit juice in the beverage can be set to 30% or more.
    Type: Application
    Filed: December 18, 2020
    Publication date: February 23, 2023
    Applicant: KIRIN HOLDINGS KABUSHIKI KAISHA
    Inventors: Akira HORIE, Chiaki NISHIYAMA, Hideyuki WAKABAYASHI
  • Patent number: 10568345
    Abstract: To provide a bottled carbonated drink containing indigestible dextrin, capable of reducing exuding of a dissolved carbon dioxide. The bottled carbonated drink containing indigestible dextrin, including a caramel pigment and a high-intensity sweetener is provided.
    Type: Grant
    Filed: September 3, 2012
    Date of Patent: February 25, 2020
    Assignee: KIRIN BEVERAGE COMPANY, LIMITED
    Inventors: Hideyuki Wakabayashi, Yuko Yotsumoto, Hiroyuki Naganuma, Kenichiro Yamamoto
  • Patent number: 10568347
    Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: February 25, 2020
    Assignees: KIRIN HOLDINGS KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHA
    Inventors: Hiroyuki Naganuma, Kenichiro Yamamoto, Yuko Yotsumoto, Hideyuki Wakabayashi
  • Publication number: 20180303132
    Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.
    Type: Application
    Filed: April 18, 2018
    Publication date: October 25, 2018
    Applicants: KIRIN KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHA
    Inventors: Hiroyuki NAGANUMA, Kenichiro YAMAMOTO, Yuko YOTSUMOTO, Hideyuki WAKABAYASHI
  • Publication number: 20160183584
    Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 30, 2016
    Applicants: KIRIN KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHA
    Inventors: Hiroyuki NAGANUMA, Kenichiro YAMAMOTO, Yuko YOTSUMOTO, Hideyuki WAKABAYASHI
  • Publication number: 20150181919
    Abstract: To provide a bottled carbonated drink containing indigestible dextrin, capable of reducing exuding of a dissolved carbon dioxide. The bottled carbonated drink containing indigestible dextrin, including a caramel pigment and a high-intensity sweetener is provided.
    Type: Application
    Filed: September 3, 2012
    Publication date: July 2, 2015
    Applicant: KIRIN BEVERAGE COMPANY, LIMITED
    Inventors: Hideyuki Wakabayashi, Yuko Yotsumoto, Hiroyuki Naganuma, Kenichiro Yamamoto
  • Patent number: 8043514
    Abstract: When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: October 25, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
  • Publication number: 20080218188
    Abstract: In a jig for inspection for inspecting a printed substrate in which a wiring part is formed on at least one surface, the jig comprises a base part which has a surface area larger than a surface area of at least the printed substrate targeted for inspection and is arranged as opposed to one surface of the printed substrate, and plural probe pins aligned and arranged at a predetermined distance mutually, any top end of the probe pin abutting on the wiring part of the printed substrate.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 11, 2008
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Koji ARAI, Hideyuki Wakabayashi, Atsushi Maruyama, Tomofumi Kikuchi
  • Publication number: 20080116079
    Abstract: When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.
    Type: Application
    Filed: December 28, 2007
    Publication date: May 22, 2008
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
  • Patent number: 7347949
    Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: March 25, 2008
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
  • Publication number: 20070045847
    Abstract: The invention is characterized in a printed wiring board having a wiring pattern including a pad for mounting a solder ball as a connection terminal, wherein the pad is constituted by laminating a conductive layer constituting the wiring pattern, a lower layer plating layer, and an upper layer plating layer in this order; an immediate vicinity region surrounding the pad is constituted by laminating the conductive layer, at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer, and a solder resist layer in the order; a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and a height of an upper face of the pad does not exceed a height of an upper face of the immediate vicinity region.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 1, 2007
    Inventors: Koji Arai, Tomofumi Kikuchi, Atsushi Maruyama, Hideyuki Wakabayashi
  • Publication number: 20060088513
    Abstract: The object of the present invention is to provide an antiallergic composition useful to prevention/treatment of allergy, its preparation method, and its use as foods or drinks or the like. As for means for solving the object, it is to provide an antiallergic composition comprising as active ingredients the lactic acid bacteria showing equal interleukin 12 production level compared to when Lactobacillus paracasei KW 3110 strain is used as the lactic acid bacteria to be tested, or showing 60% or more of interleukin 12 production level compared to when Lactobacillus paracasei KW 3110 strain is used, and showing less than 50% of interleukin 4 production level of a control wherein the lactic acid bacteria are not added, in case lymphocytes derived from mouse spleen sensitized with ovalbumin are suspended in a medium containing ovalbumin, and cultured by adding the lactic acid bacteria to be tested.
    Type: Application
    Filed: February 27, 2004
    Publication date: April 27, 2006
    Inventors: Sayo Inoue, Toshio Fujii, Daisuke Fujiwara, Akira Saiki, Minoru Takahashi, Koichiro Yamauchi, Masami Gotou, Satoshi Nishida, Keiji Deuchi, Hideyuki Wakabayashi, Toshihiro Komeda
  • Publication number: 20060016779
    Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.
    Type: Application
    Filed: June 7, 2005
    Publication date: January 26, 2006
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD
    Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
  • Patent number: 6919082
    Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily. A yeast cell wall fraction, which comprises yeast extracts residue and being superior in water dispersibility and swelling properties, is used as an active constituent. As a yeast cell wall fraction, a yeast cell wall fraction obtained with a simple operation of water cleansing of yeast cell after alkali processing yields superior effects for preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, as well as such yeast cell wall fraction without foreign taste and odor characteristic to autolysis and suitable for ingestion.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: July 19, 2005
    Assignee: Kirin Beer Kabushiki Kaisha
    Inventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi
  • Publication number: 20030118607
    Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily.
    Type: Application
    Filed: October 10, 2002
    Publication date: June 26, 2003
    Inventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi
  • Publication number: 20020155126
    Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily.
    Type: Application
    Filed: February 13, 2001
    Publication date: October 24, 2002
    Inventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi