Patents by Inventor Hideyuki Wakabayashi
Hideyuki Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230058756Abstract: An object is to provide a novel saccharide-reduced fruit beverage having an improved flavor. According to the present invention, provided is a fruit beverage containing citrus fruit and having a sucrose concentration of 1.4 g/100 mL or less in terms of Brix 11°, in which the beverage has an ethyl ester concentration of 25 to 50 ppb and/or a monoterpene derivative concentration of 600 to 3,000 ppb. The citrus fruit in the present invention can be selected from the group consisting of oranges, grapefruit, and Unshu mikan, and a proportion of a fruit juice in the beverage can be set to 30% or more.Type: ApplicationFiled: December 18, 2020Publication date: February 23, 2023Applicant: KIRIN HOLDINGS KABUSHIKI KAISHAInventors: Akira HORIE, Chiaki NISHIYAMA, Hideyuki WAKABAYASHI
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Patent number: 10568345Abstract: To provide a bottled carbonated drink containing indigestible dextrin, capable of reducing exuding of a dissolved carbon dioxide. The bottled carbonated drink containing indigestible dextrin, including a caramel pigment and a high-intensity sweetener is provided.Type: GrantFiled: September 3, 2012Date of Patent: February 25, 2020Assignee: KIRIN BEVERAGE COMPANY, LIMITEDInventors: Hideyuki Wakabayashi, Yuko Yotsumoto, Hiroyuki Naganuma, Kenichiro Yamamoto
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Patent number: 10568347Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.Type: GrantFiled: April 18, 2018Date of Patent: February 25, 2020Assignees: KIRIN HOLDINGS KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHAInventors: Hiroyuki Naganuma, Kenichiro Yamamoto, Yuko Yotsumoto, Hideyuki Wakabayashi
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Publication number: 20180303132Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.Type: ApplicationFiled: April 18, 2018Publication date: October 25, 2018Applicants: KIRIN KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHAInventors: Hiroyuki NAGANUMA, Kenichiro YAMAMOTO, Yuko YOTSUMOTO, Hideyuki WAKABAYASHI
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Publication number: 20160183584Abstract: To provide a bottled carbonated drink including a sweetener and a caramel composition, wherein the drink contains an indigestible dextrin and the amount of 4-methylimidazole in the drink is less than 200 ppb. The drink is a bottled carbonated drink of which foam is stabilized.Type: ApplicationFiled: February 18, 2014Publication date: June 30, 2016Applicants: KIRIN KABUSHIKI KAISHA, KIRIN BEVERAGE KABUSHIKI KAISHAInventors: Hiroyuki NAGANUMA, Kenichiro YAMAMOTO, Yuko YOTSUMOTO, Hideyuki WAKABAYASHI
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Publication number: 20150181919Abstract: To provide a bottled carbonated drink containing indigestible dextrin, capable of reducing exuding of a dissolved carbon dioxide. The bottled carbonated drink containing indigestible dextrin, including a caramel pigment and a high-intensity sweetener is provided.Type: ApplicationFiled: September 3, 2012Publication date: July 2, 2015Applicant: KIRIN BEVERAGE COMPANY, LIMITEDInventors: Hideyuki Wakabayashi, Yuko Yotsumoto, Hiroyuki Naganuma, Kenichiro Yamamoto
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Patent number: 8043514Abstract: When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.Type: GrantFiled: December 28, 2007Date of Patent: October 25, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Publication number: 20080218188Abstract: In a jig for inspection for inspecting a printed substrate in which a wiring part is formed on at least one surface, the jig comprises a base part which has a surface area larger than a surface area of at least the printed substrate targeted for inspection and is arranged as opposed to one surface of the printed substrate, and plural probe pins aligned and arranged at a predetermined distance mutually, any top end of the probe pin abutting on the wiring part of the printed substrate.Type: ApplicationFiled: March 7, 2008Publication date: September 11, 2008Applicant: Shinko Electric Industries Co., Ltd.Inventors: Koji ARAI, Hideyuki Wakabayashi, Atsushi Maruyama, Tomofumi Kikuchi
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Publication number: 20080116079Abstract: When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.Type: ApplicationFiled: December 28, 2007Publication date: May 22, 2008Applicant: Shinko Electric Industries Co., Ltd.Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Patent number: 7347949Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.Type: GrantFiled: June 7, 2005Date of Patent: March 25, 2008Assignee: Shinko Electric Industries, Co., Ltd.Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Publication number: 20070045847Abstract: The invention is characterized in a printed wiring board having a wiring pattern including a pad for mounting a solder ball as a connection terminal, wherein the pad is constituted by laminating a conductive layer constituting the wiring pattern, a lower layer plating layer, and an upper layer plating layer in this order; an immediate vicinity region surrounding the pad is constituted by laminating the conductive layer, at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer, and a solder resist layer in the order; a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and a height of an upper face of the pad does not exceed a height of an upper face of the immediate vicinity region.Type: ApplicationFiled: August 30, 2006Publication date: March 1, 2007Inventors: Koji Arai, Tomofumi Kikuchi, Atsushi Maruyama, Hideyuki Wakabayashi
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Publication number: 20060088513Abstract: The object of the present invention is to provide an antiallergic composition useful to prevention/treatment of allergy, its preparation method, and its use as foods or drinks or the like. As for means for solving the object, it is to provide an antiallergic composition comprising as active ingredients the lactic acid bacteria showing equal interleukin 12 production level compared to when Lactobacillus paracasei KW 3110 strain is used as the lactic acid bacteria to be tested, or showing 60% or more of interleukin 12 production level compared to when Lactobacillus paracasei KW 3110 strain is used, and showing less than 50% of interleukin 4 production level of a control wherein the lactic acid bacteria are not added, in case lymphocytes derived from mouse spleen sensitized with ovalbumin are suspended in a medium containing ovalbumin, and cultured by adding the lactic acid bacteria to be tested.Type: ApplicationFiled: February 27, 2004Publication date: April 27, 2006Inventors: Sayo Inoue, Toshio Fujii, Daisuke Fujiwara, Akira Saiki, Minoru Takahashi, Koichiro Yamauchi, Masami Gotou, Satoshi Nishida, Keiji Deuchi, Hideyuki Wakabayashi, Toshihiro Komeda
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Publication number: 20060016779Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.Type: ApplicationFiled: June 7, 2005Publication date: January 26, 2006Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTDInventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Patent number: 6919082Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily. A yeast cell wall fraction, which comprises yeast extracts residue and being superior in water dispersibility and swelling properties, is used as an active constituent. As a yeast cell wall fraction, a yeast cell wall fraction obtained with a simple operation of water cleansing of yeast cell after alkali processing yields superior effects for preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, as well as such yeast cell wall fraction without foreign taste and odor characteristic to autolysis and suitable for ingestion.Type: GrantFiled: October 10, 2002Date of Patent: July 19, 2005Assignee: Kirin Beer Kabushiki KaishaInventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi
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Publication number: 20030118607Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily.Type: ApplicationFiled: October 10, 2002Publication date: June 26, 2003Inventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi
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Publication number: 20020155126Abstract: The present invention provides a pharmacological composition as a composition as a raw material capable of preventing or treating the symptoms of inflammatory bowel diseases such as ulcerative colitis, constipation, allergic diseases such as atopic dermatitis, and so on, and which has little side effect and thereby safe, high water dispersibility, and can be ingested easily.Type: ApplicationFiled: February 13, 2001Publication date: October 24, 2002Inventors: Yoshiharu Shirasu, Tomohiko Nakamura, Hideyuki Wakabayashi