Patents by Inventor Hiizu Ootorii
Hiizu Ootorii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11719896Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.Type: GrantFiled: April 4, 2022Date of Patent: August 8, 2023Assignee: Sony Group CorporationInventor: Hiizu Ootorii
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Publication number: 20220234126Abstract: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.Type: ApplicationFiled: April 15, 2022Publication date: July 28, 2022Inventors: Hiizu OOTORII, Kiwamu ADACHI, Takeshi MIZUNO
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Publication number: 20220229249Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventor: Hiizu Ootorii
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Patent number: 11370047Abstract: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.Type: GrantFiled: May 6, 2014Date of Patent: June 28, 2022Assignee: Sony Semiconductor Solutions CorporationInventors: Hiizu Ootorii, Kiwamu Adachi, Takeshi Mizuno
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Patent number: 11300739Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.Type: GrantFiled: August 21, 2020Date of Patent: April 12, 2022Assignee: Sony Group CorporationInventor: Hiizu Ootorii
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Publication number: 20220035103Abstract: Provided is a connector including: an electric transmitter; an optical transmitter including a lens at an end of an optical transmission path; a housing that is allowed to contain the optical transmitter; and a slide mechanism that attaches the lens to a connected unit at a position exposed from a front surface of the housing.Type: ApplicationFiled: October 14, 2021Publication date: February 3, 2022Inventor: HIIZU OOTORII
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Patent number: 11181698Abstract: Provided is a connector including: an electric transmitter; an optical transmitter including a lens at an end of an optical transmission path; a housing that is allowed to contain the optical transmitter; and a slide mechanism that attaches the lens to a connected unit at a position exposed from a front surface of the housing.Type: GrantFiled: April 19, 2017Date of Patent: November 23, 2021Assignee: Sony Semiconductor Solutions CorporationInventor: Hiizu Ootorii
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Patent number: 10965831Abstract: Provided is an optical head that includes a base substrate and a line head. The line head includes a plurality of sub-line heads electrically independent of one another and arranged on the base substrate in parallel with a first direction. Each of the plurality of sub-line heads includes a circuit substrate unit that constitutes a portion of the base substrate, and an optical-element array that includes a plurality of optical elements each arranged on the circuit substrate unit at least in parallel with a second direction that is a direction of a length of each of the plurality of sub-line heads.Type: GrantFiled: March 19, 2018Date of Patent: March 30, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Hiizu Ootorii
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Patent number: 10948654Abstract: An optical waveguide sheet according to the present technology includes a core and a cladding. The core is extending in a first direction and including a maximum diameter portion in a plane parallel to a second direction orthogonal to the first direction and a third direction orthogonal to the second direction is maximum, a minimum diameter portion in the plane parallel to the second direction and the third direction is minimum, and a taper portion in which widths of the core in both directions of the second direction and the third direction gradually change in the first direction between the maximum diameter portion and the minimum diameter portion, the core being provided such that the maximum diameter portion and the minimum diameter portion are alternately arranged in the first direction with the taper portion therebetween. The cladding is provided around the core.Type: GrantFiled: December 13, 2016Date of Patent: March 16, 2021Assignee: SONY CORPORATIONInventor: Hiizu Ootorii
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Patent number: 10931847Abstract: Provided is an optical head that includes a base substrate and a line head. The line head includes a plurality of sub-line heads electrically independent of one another and arranged on the base substrate in parallel with a first direction. Each of the plurality of sub-line heads includes a circuit substrate unit that constitutes a portion of the base substrate, and an optical-element array that includes a plurality of optical elements each arranged on the circuit substrate unit at least in parallel with a second direction that is a direction of a length of each of the plurality of sub-line heads.Type: GrantFiled: March 19, 2018Date of Patent: February 23, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Hiizu Ootorii
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Publication number: 20200386958Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.Type: ApplicationFiled: August 21, 2020Publication date: December 10, 2020Inventor: Hiizu Ootorii
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Patent number: 10830972Abstract: An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.Type: GrantFiled: December 20, 2016Date of Patent: November 10, 2020Assignee: Sony CorporationInventors: Eiji Otani, Shuichi Oka, Hiizu Ootorii
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Patent number: 10805547Abstract: Imaging device including an elongated bendable section, a reinforcing section that is arranged on an end portion of the bendable section in an elongated direction in which the bendable section extends, the reinforcing section having higher rigidity than the bendable section, and an imaging section capable of capturing an image in the elongated direction with respect to the reinforcing section. The bendable section is able to store a power source in at least a part of the bendable section.Type: GrantFiled: February 7, 2019Date of Patent: October 13, 2020Assignee: Sony CorporationInventor: Hiizu Ootorii
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Patent number: 10782491Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.Type: GrantFiled: March 14, 2019Date of Patent: September 22, 2020Assignee: Sony CorporationInventor: Hiizu Ootorii
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Patent number: 10775574Abstract: To provide an optical connector and an optical transmission module that are suitable for a plurality of optical transmission paths two-dimensionally arranged. An optical connector according to the present technology is an optical connector for a plurality of optical transmission paths arranged in a two-dimensional array and includes a first lens, a second lens, a third lens, and a fourth lens. The first lens reflects emitted light from a first optical transmission path of the plurality of optical transmission paths. The second lens reflects emitted light from a second optical transmission path of the plurality of optical transmission paths. The third lens collimates light reflected by the first lens. The fourth lens collimates light reflected by the second lens.Type: GrantFiled: December 13, 2016Date of Patent: September 15, 2020Assignee: Sony CorporationInventor: Hiizu Ootorii
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Publication number: 20200215754Abstract: An optical head (50) according an embodiment includes a light source unit (20) and a regulator (30). The regulator includes an outer surface (32) including a regulation surface (32a), and an internal space (35) in which the light source unit is arranged, the regulator supporting the light source unit, the regulator regulating a level of a liquid of a material (Q) using the regulation surface, the material being hardened by being irradiated with light by the light source unit.Type: ApplicationFiled: May 17, 2018Publication date: July 9, 2020Inventor: HIIZU OOTORII
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Publication number: 20200186664Abstract: [Solving Means] An optical head includes a base substrate and a line head. The line head includes a plurality of sub-line heads electrically independent of one another and arranged on the base substrate in parallel with a first direction. Each of the plurality of sub-line heads includes a circuit substrate unit that constitutes a portion of the base substrate, and an optical-element array that includes a plurality of optical elements each arranged on the circuit substrate unit at least in parallel with a second direction that is a direction of a length of each of the plurality of sub-line heads.Type: ApplicationFiled: March 19, 2018Publication date: June 11, 2020Inventor: HIIZU OOTORII
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Patent number: 10670813Abstract: A photoelectric connector includes a plug and a receptacle. The plug includes a plug housing 200, a first guide pin 220, a first signal transmitting/receiving member 230, a first electrode unit 260, and a plug housing biasing means 250. The receptacle includes a receptacle housing 300, a second signal transmitting/receiving member 330, a second electrode unit 360, and a second signal transmitting/receiving member biasing means 321.Type: GrantFiled: March 30, 2016Date of Patent: June 2, 2020Assignee: SONY CORPORATIONInventor: Hiizu Ootorii
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Patent number: 10663604Abstract: An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.Type: GrantFiled: March 6, 2017Date of Patent: May 26, 2020Assignee: Sony Semiconductor Solutions CorporationInventors: Hiizu Ootorii, Norihisa Shirota, Haruo Togashi
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Patent number: 10634862Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: November 26, 2018Date of Patent: April 28, 2020Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii