Patents by Inventor Hikoichiro Yamada

Hikoichiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5096644
    Abstract: A molded article is produced by metathesis polymerization of a mixture containing at least one metathesis polymerizable monomer, a metathesis polymerization catalyst and an organic or inorganic filler material which has been treated with a vinyl-substituted silane coupler having at least one hydrolyzable group in addition to the vinyl group.
    Type: Grant
    Filed: June 23, 1989
    Date of Patent: March 17, 1992
    Assignee: Hercules Incorporated
    Inventors: Zenichiro Endo, Shigeyoshi Hara, Paul A. Silver, Hikoichiro Yamada
  • Patent number: 5055499
    Abstract: A method is disclosed for preparing filled shaped articles of metathesis polymerized poly(cycloolefins) wherein an inorganic filler material is treated with a norbornene-substituted silane coupling agent. The norbornene moiety copolymerizes with the metathesis polymerizable monomer and the silane moiety creates a bond with the filler. Products are characterized by improved physical properties.
    Type: Grant
    Filed: January 5, 1990
    Date of Patent: October 8, 1991
    Assignee: Hercules Incorporated
    Inventors: Zenichiro Endo, Shigeyoshi Hara, Paul A. Silver, Hikoichiro Yamada
  • Patent number: 3948666
    Abstract: A support for use in preparing a printing plate using a liquid photosensitive resin. The support includes a flexible self-supporting base plate and an adhesive layer thereon for applying a layer of a photosensitive resin. The adhesive layer is a layer of a cross-linked polyester-polyurethane resin formed by reacting (A) a linear polyester-polyurethane resin with (B) a polyfunctional isocyanate on the surface of the base plate.This invention relates to a flexible support for use in preparing a printing plate consisting of the support and a layer of a liquid photosensitive resin applied in situ to the support and solidified upon exposure, especially to a support including an adhesive layer for firmly bonding the solidified photosensitive resin layer to the support.
    Type: Grant
    Filed: April 4, 1974
    Date of Patent: April 6, 1976
    Assignee: Teijin Limited
    Inventors: Yasuhisa Kitanishi, Hikoichiro Yamada