Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Abstract: Disclosed are a method, system and holder for transferring templates during imprint lithography processes. To that end, a method for handling a template, having a patterned mold thereon, in an imprint lithography system having a motion stage with a chucking device coupled thereto, includes providing the template into a template transfer holder. The template transfer holder includes a side coupled to the motion stage and support members extending from the side. The template is disposed within the template transfer holder so as to have the patterned mold facing the side and spaced-apart therefrom. Relative movement is created between the motion stage and an imprint head to place the template transfer holder and the imprint head in superimposition. The template is removed from the template transfer holder, and the template is suspended above the wafer chuck by the imprint head. In another embodiment, a system and a template holder are described that facilitates the method.

Abstract: An aligner is disclosed including a buffer mechanism having a buffer paddle on which wafers may be buffered to increase the throughput of the aligner. The aligner is provided in general to identify a position of a notch, position and read the associated indicial mark and determine the radial runout of the wafer. The aligner includes a rotating support platform in the form of a chuck on which the wafers are received from the robot. A motor rotates the chuck so that the radial runout and notch of the wafer may be identified. According to the present invention, the aligner further includes a buffer mechanism having a buffer paddle and a drive mechanism for vertically translating the buffer paddle. The aligner further includes an analog sensor for determining the notch location, the radial runout and/or the position of the indicial mark on a wafer being rotated on the chuck.