Patents by Inventor Hin Oh

Hin Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7505879
    Abstract: According to the present invention, multivariate analysis model expressions are generated for a plasma processing apparatus 100A and a plasma processing apparatus 100B by executing a multivariate analysis of detection data provided by a plurality of sensors included in each plasma processing apparatus when the plasma processing apparatuses 100A and 100B operate based upon first setting data. Then, when the plasma processing apparatus 100A operates based upon new second setting data, detection data provided by the plurality of sensors in the plasma processing apparatus 100A are used to generate a corresponding multivariate analysis model expression, and by using the new multivariate analysis model expression corresponding to the plasma processing apparatus 100A generated based upon the second setting data and to the plasma processing apparatus 100B, a multivariate analysis model expression corresponding to the new second setting data is generated four the plasma processing apparatus 100B.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: March 17, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Masayuki Tomoyasu, Hin Oh, Hideki Tanaka
  • Patent number: 7101458
    Abstract: In a plasma processing method and apparatus for monitoring an operating status of a plasma processing apparatus and/or a processing status of an object being processed, emission spectra emitted from a plasma is obtained as optical data when the plasma process is performed on the object. Quantitative data of each emission source is obtained from the obtained optical data by using reference data in a database storing therein emission spectra of a plurality of emission source as the reference data. The operating status of the plasma processing apparatus and/or the processing status of the object being processed is estimated based on changes in the quantitative data of each emission source.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: September 5, 2006
    Assignee: Tokyo Electron Limited
    Inventors: Hin Oh, Yuichi Mimura
  • Patent number: 6985215
    Abstract: In a plasma processing method and apparatus for monitoring information on a plasma processing, a multivariate analysis is performed by using as analysis data detection values detected for each object to be processed from a plurality of detection devices disposed in the processing apparatus upon the plasma processing. At that time, for each of sections defined whenever a maintenance of the processing apparatus is carried out, the detection values detected by the detection devices in the respective sections are compensated through a compensation unit, and the compensated detection values are taken as the analysis data.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: January 10, 2006
    Assignee: Tokyo Electron Limited
    Inventors: Hin Oh, Hideaki Sato, Naoki Takayama, Hisanori Sakai, Yuichi Mimura
  • Publication number: 20050146709
    Abstract: In a plasma processing method and apparatus for monitoring information on a plasma processing, a multivariate analysis is performed by using as analysis data detection values detected for each object to be processed from a plurality of detection devices disposed in the processing apparatus upon the plasma processing. At that time, for each of sections defined whenever a maintenance of the processing apparatus is carried out, the detection values detected by the detection devices in the respective sections are compensated through a compensation unit, and the compensated detection values are taken as the analysis data.
    Type: Application
    Filed: February 11, 2005
    Publication date: July 7, 2005
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hin Oh, Hideaki Sato, Naoki Takayama, Hisanori Sakai, Yuichi Mimura
  • Publication number: 20050143952
    Abstract: According to the present invention, multivariate analysis model expressions are generated for a plasma processing apparatus 100A and a plasma processing apparatus 100B by executing a multivariate analysis of detection data provided by a plurality of sensors included in each plasma processing apparatus when the plasma processing apparatuses 100A and 100B operate based upon first setting data. Then, when the plasma processing apparatus 100A operates based upon new second setting data, detection data provided by the plurality of sensors in the plasma processing apparatus 100A are used to generate a corresponding multivariate analysis model expression, and by using the new multivariate analysis model expression corresponding to the plasma processing apparatus 100A generated based upon the second setting data and to the plasma processing apparatus 100B, a multivariate analysis model expression corresponding to the new second setting data is generated four the plasma processing apparatus 100B.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 30, 2005
    Inventors: Masayuki Tomoyasu, Hin Oh, Hideki Tanaka
  • Publication number: 20040235304
    Abstract: A plasma processing apparatus and processing method using same ensures to identify changes in a particular control parameter and/or an apparatus state parameter. The plasma processing apparatus includes a detection unit to detect a plasma reflection parameter representing a plasma state by using a high frequency electric power, a setting unit to set a plurality of control parameters to control the plasma state, a storage unit to store a model equation that predicts at least the control parameters and a number of apparatus state parameters based on the plasma reflection parameter, and a prediction unit for applying to the model equation the plasma reflection parameter obtained when processing an object to be processed to predict at least control parameters and apparatus state parameters during processing.
    Type: Application
    Filed: June 28, 2004
    Publication date: November 25, 2004
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Hin Oh
  • Publication number: 20040200718
    Abstract: In a plasma processing method and apparatus for monitoring an operating status of a plasma processing apparatus and/or a processing status of an object being processed, emission spectra emitted from a plasma is obtained as optical data when the plasma process is performed on the object. Quantitative data of each emission source is obtained from the obtained optical data by using reference data in a database storing therein emission spectra of a plurality of emission source as the reference data. The operating status of the plasma processing apparatus and/or the processing status of the object being processed is estimated based on changes in the quantitative data of each emission source.
    Type: Application
    Filed: December 5, 2003
    Publication date: October 14, 2004
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hin Oh, Yuichi Mimura