Abstract: [Problem] Provided are a communication control device, a network device, a communication control system, a communication control method, and an information communication method that make it possible to increase a usage efficiency of a frequency band. [Solution] A communication control device according to the present disclosure includes: a receiving unit that receives a request for radio wave use pertaining to a first wireless communication device; a transmitting unit that, when the request is received, transmits an obtainment request for communication status information indicating a communication status of a second wireless communication device; and a control unit that receives the communication status information of the second wireless communication device after the obtainment request has been transmitted, and determines a condition of the radio wave use by the first wireless communication device based on the communication status information of the second wireless communication device.

Abstract: A ridge filter 100 provided in a particle therapy system includes a repeating structure body 101 having a plurality of extending parts 101c extending along the incident direction P of a proton beam 204, and a bottom plate 102 provided on the lower face 101b side opposite to the incident side of the proton beam 204 of the repeating structure body 101. In addition, the repeating structure body 101 and the bottom plate 102 are integrally formed by a molding method, and each of the repeating structure body 101 and the bottom plate 102 is formed of a laminate of resin.

Abstract: A sensor terminal includes: a vibration sensor; an L-shaped attachment main body portion on which the vibration sensor is mounted and that is detachably attached to a truncated quadrangular pyramid structure portion of a valve cap attached to an opening/closing shaft portion of a water regulating valve provided in a water service pipe; side surface magnets that are provided in the attachment main body portion; and an upper surface magnet that is attached to a lower surface of a base on which the vibration sensor is mounted. Further, the truncated quadrangular pyramid structure portion includes a quadrangular upper surface and four side surfaces, and the attachment main body portion of the sensor terminal is fixed using magnet to each of the upper surface of the truncated quadrangular pyramid structure portion and at least one side surface among the four side surfaces.

Abstract: A ridge filter 100 provided in a particle therapy system includes a repeating structure body 101 having a plurality of extending parts 101c extending along the incident direction P of a proton beam 204, and a bottom plate 102 provided on the lower face 101b side opposite to the incident side of the proton beam 204 of the repeating structure body 101. In addition, the repeating structure body 101 and the bottom plate 102 are integrally formed by a molding method, and each of the repeating structure body 101 and the bottom plate 102 is formed of a laminate of resin.

Abstract: A sensor terminal includes: a vibration sensor; an L-shaped attachment main body portion on which the vibration sensor is mounted and that is detachably attached to a truncated quadrangular pyramid structure portion of a valve cap attached to an opening/closing shaft portion of a water regulating valve provided in a water service pipe; side surface magnets that are provided in the attachment main body portion; and an upper surface magnet that is attached to a lower surface of a base on which the vibration sensor is mounted. Further, the truncated quadrangular pyramid structure portion includes a quadrangular upper surface and four side surfaces, and the attachment main body portion of the sensor terminal is fixed using magnet to each of the upper surface of the truncated quadrangular pyramid structure portion and at least one side surface among the four side surfaces.

Abstract: An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided. An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.

Abstract: An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided. An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.

Abstract: A fixing structure of an optical component is composed of a device chassis; a holder holding an optical component; first and second plate parts for joint to the device chassis and a connecting part of both the plate parts are formed in the holder; a plurality of joint holes are formed in the second plate part; a U-groove into which the connecting part of the holder is fitted and a plurality of through-holes are formed in the device chassis; and an adhesive that is extended in a circular columnar shape and is made by inserting the holder into the U-groove of the device chassis, and applying a UV-curing adhesive in such a manner that the UV-curing adhesive is bonded to the first plate part of the holder and is continuous to the inside of the joint hole via the inside of the through-hole, and radiating UV light along the through-hole.

Abstract: An adhesive structure of an optical component includes a horizontal surface and a vertical surface. In a structure in which an optical component is adhered to a chassis having the horizontal surface and the vertical surface, an adhesive force per unit area of the vertical surface is higher than that per unit area of the horizontal surface.

Abstract: A fixing structure of an optical component is composed of a device chassis; a holder holding an optical component; first and second plate parts for joint to the device chassis and a connecting part of both the plate parts are formed in the holder; a plurality of joint holes are formed in the second plate part; a U-groove into which the connecting part of the holder is fitted and a plurality of through-holes are formed in the device chassis; and an adhesive that is extended in a circular columnar shape and is made by inserting the holder into the U-groove of the device chassis, and applying a UV-curing adhesive in such a manner that the UV-curing adhesive is bonded to the first plate part of the holder and is continuous to the inside of the joint hole via the inside of the through-hole, and radiating UV light along the through-hole.

Abstract: In an optical pickup device for use in recording and reproducing on an optical recording medium, such as a CD or DVD, banks are formed on both sides of an adhesive agent application position for adhering an optical device, such as a photodetector or a laser diode, in an optical pickup case. At this time, a bank on the side of an optical path is formed higher than a height of an outer bank, and an adhesive agent is poured between the banks, to adhere the optical pickup case and the optical device.

Abstract: In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.

Abstract: In an optical pickup device for use in recording and reproducing on an optical recording medium, such as a CD or DVD, banks are formed on both sides of an adhesive agent application position for adhering an optical device, such as a photodetector or a laser diode, in an optical pickup case. At this time, a bank on the side of an optical path is formed higher than a height of an outer bank, and an adhesive agent is poured between the banks, to adhere the optical pickup case and the optical device.

Abstract: The optical pickup device includes a light-emitting element that emits light, an objective lens that converges light emitted by the light-emitting element on an external optical recording medium, a light-receiving element that receives the light returned from the optical recording medium via the objective lens, a holder that holds the light-emitting element or the light-receiving element, and a casing to which the holder is secured with an adhesive interposed therebetween. The holder has a holder's bonding surface to be bonded to the casing, while the casing has a case's bonding surface facing the holder's bonding surface and to be bonded to the holder. The holder's or casing's bonding surface is provided with adjoining sidewalls that have wall faces forming an angle with the holder's or casing's bonding surface. The holder and casing are adhesively secured to each other with a UV-curable adhesive applied on the holder's or casing's bonding surface.

Abstract: To provide an optical pickup device adapted such that for adhesion fixing of a holder for holding an LD or a light-receiving element to an optical pickup casing via an ultraviolet-curable adhesive, curing shrinkage during ultraviolet irradiation can be reduced and adhesion fixing achieved with high positioning accuracy. In a structure for adhesion fixing of a holder for holding an LD or a light-receiving element to an optical pickup casing via an ultraviolet-curable adhesive, since protrusions are provided at peripheral sections (UV irradiation light source side) on a bonding surface of the holder, a section exposed to strong UV light is first cured, then after the adhesive has moved from an uncured section, the amount of shrinkage of the first cured section in a Z-direction is reduced, and the uncured section is cured.

Abstract: To provide a reliable optical pickup device, a pickup case and an optical component including a lens are fixed by laser welding to increase the welding strength and reduce the positional displacement due to environmental changes. In a laser welded portion between a pickup case and an optical component including a lens, the optical component is provided with a joint portion having a convex protrusion at a portion to be joined to the pickup case. Laser beam irradiation is performed extending longer than the protrusion to form a thick welded portion at an end of the protrusion, in order to increase welding strength between the optical component and the pickup case.

Abstract: A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover film formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover film, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover film. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.

Abstract: In laser welding an optical part to a pickup case of an optical pickup device, outgas deposition on a lens surface can be inhibited, and positional shifting of the optical part can be reduced. The optical part has a lens surface facing in an optical axis direction and a protruding part formed, to be joined to the pickup case, at an end portion thereof in a direction perpendicular to the optical axis. A joint surface between the protruding part and the pickup case extends in a direction parallel to the optical axis, and the joint surface is fixed by a weld portion formed by laser irradiation. The joint surface is parallel to a bottom surface of the pickup case, and the height from the bottom surface is approximately equal to the height of the center of the lens surface.

Abstract: An optical pickup device includes a holder which holds an LD and a light-receiving element and an optical pickup case on which the holder is adhesively fixed via an ultraviolet cure adhesive, and is provided with a through hole on a bonding surface of the holder in order to reduce shrinkage when ultraviolet light is irradiated and to form a blind portion on which the ultraviolet light is not irradiated from a specific direction for adhesively fixing with high position accuracy.

Abstract: In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.