Patents by Inventor Hiroaki Ikeba

Hiroaki Ikeba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin molding material for sealing and electronic component device
    Patent number: 8084130
    Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: December 27, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa
  • EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20090326100
    Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
    Type: Application
    Filed: September 25, 2007
    Publication date: December 31, 2009
    Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa