Patents by Inventor Hiroaki Matsuda
Hiroaki Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11912284Abstract: An alighting assistance device D of the present disclosure may be a device moving a driver seat rearward in a case where a determination may be made that an occupant seated on the driver seat of a vehicle alights. The device may include a height changer which changes a height of a steering wheel, a sitting height acquirer which acquires a sitting height of the occupant, and a steering wheel controller 33 as one example of a height controller which controls the height changer such that the height of the steering wheel becomes lower as the sitting height acquired by the sitting height acquirer may be higher in the case where a determination is made that the occupant alights.Type: GrantFiled: January 5, 2022Date of Patent: February 27, 2024Assignee: MAZDA MOTOR CORPORATIONInventors: Yoshito Hirata, Tomonori Ohtsubo, Hiroki Uemura, Kengo Iwata, Masato Maeda, Hiroaki Matsuda, Masahito Kashihara, Chieko Nakagami
-
Publication number: 20240003555Abstract: An electric component unit in an outdoor unit of a refrigeration apparatus, includes: a first electric component; a first chamber that houses the first electric component; a second electric component; and a second chamber that houses the second electric component. The first chamber has a higher degree of hermetic sealing than the second chamber.Type: ApplicationFiled: September 14, 2023Publication date: January 4, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Daiki Hirawa, Katsutoshi Sakurai, Makoto Takayanagi, Taichi Koshiji, Hiroaki Matsuda
-
Patent number: 11773193Abstract: Disclosed is a hydrogenated copolymer obtained by hydrogenating a copolymer which comprises an aromatic vinyl monomer unit and a chain conjugated diene monomer unit. When, among at least two hydrogenated copolymer-derived peaks in an elution curve measured by gel permeation chromatography of a sample containing the hydrogenated product, a hydrogenated copolymer-derived peak exhibiting a peak top with the earliest elution time is defined as a first peak and a hydrogenated copolymer-derived peak exhibiting a peak top with the second earliest elution time is defined as a second peak, the ratio of a standard polystyrene-equivalent molecular weight based on the elution time of the first peak (first peak molecular weight) to a standard polystyrene-equivalent molecular weight based on the elution time of the second peak (second peak molecular weight) is 1.50 or more. The second peak molecular weight is 1,000 or more.Type: GrantFiled: October 8, 2019Date of Patent: October 3, 2023Assignee: ZEON CORPORATIONInventor: Hiroaki Matsuda
-
Patent number: 11772523Abstract: An alighting assistance device D of the present disclosure may be a device moving a driver seat rearward in a case where a determination is made that an occupant seated on the driver seat of a vehicle alights. The device may include a reclining mechanism as one example of an angle changer which changes an angle of a seat back of the driver seat with respect to a horizontal plane, a sitting height acquirer which acquires a sitting height of the occupant, and a seat controller as one example of an angle controller which controls the angle changer such that the angle of the seat back becomes closer to be perpendicular as the sitting height acquired by the sitting height acquirer is higher in the case where a determination is made that the occupant alights.Type: GrantFiled: January 4, 2022Date of Patent: October 3, 2023Assignee: MAZDA MOTOR CORPORATIONInventors: Yoshito Hirata, Tomonori Ohtsubo, Hiroki Uemura, Kengo Iwata, Masato Maeda, Hiroaki Matsuda, Masahito Kashihara, Chieko Nakagami
-
Publication number: 20230253311Abstract: A semiconductor device includes an interconnect including (i) a first layer, and (ii) a second layer provided on the first layer and including copper. The device also includes a plug provided on the interconnect and including (a) a third layer including titanium and nitrogen, and (b) a fourth layer provided on the third layer and including tungsten. A concentration of chlorine in the third layer is less than or equal to 5.0 × 1021 atoms/cm3, and a concentration of oxygen at the interface between the third layer and the fourth layer is less than or equal to 5.0 × 1021 atoms/cm3.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Applicant: Kioxia CorporationInventors: Masayuki KITAMURA, Atsushi KATO, Hiroaki MATSUDA
-
Patent number: 11692748Abstract: A heat exchanger includes: flat pipes disposed in multiple stages in a stage direction corresponding to an up-down direction; and fins that partition a space between adjacent two of the flat pipes into air flow passages through which air flows. Each of the flat pipes includes a passage for a refrigerant inside thereof. The flat pipes are divided into heat exchange paths arrayed in multiple stages in the stage direction. One of the heat exchange paths that includes a lowermost one of the flat pipes is defined as a first heat exchange path. A length of the passage from a first end to a second end of a flow of the refrigerant in each of the heat exchange paths is defined as a path effective length.Type: GrantFiled: September 20, 2018Date of Patent: July 4, 2023Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Ken Satou, Masanori Jindou, Yoshio Oritani, Kouju Yamada, Hiroaki Matsuda
-
Patent number: 11658110Abstract: A semiconductor device includes an interconnect including (i) a first layer, and (ii) a second layer provided on the first layer and including copper. The device also includes a plug provided on the interconnect and including (a) a third layer including titanium and nitrogen, and (b) a fourth layer provided on the third layer and including tungsten. A concentration of chlorine in the third layer is less than or equal to 5.0×1021 atoms/cm3, and a concentration of oxygen at the interface between the third layer and the fourth layer is less than or equal to 5.0×1021 atoms/cm3.Type: GrantFiled: February 24, 2021Date of Patent: May 23, 2023Assignee: KIOXIA CORPORATIONInventors: Masayuki Kitamura, Atsushi Kato, Hiroaki Matsuda
-
Publication number: 20230082318Abstract: A pressure vessel provided on a refrigerant circuit, includes: a vessel body made of iron; an inlet pipe causing a refrigerant to flow into the vessel body; and an outlet pipe causing the refrigerant to flow out of the vessel body. A pipe includes one or both of the inlet pipe and the outlet pipe. The pipe includes: a first portion made of stainless steel; a second portion made of a material whose main component is copper; and a brazed portion connecting the first portion and the second portion. An end of the first portion on a first side in a pipe axial direction of the pipe is disposed outside the vessel body. An end of the first portion on a second side in the pipe axial direction is connected to the second portion. The second portion is connected to the vessel body.Type: ApplicationFiled: November 18, 2022Publication date: March 16, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Junichi Hamadate, Masanori Jindou, Hiroaki Matsuda, Ayumi Komaki
-
Patent number: 11407121Abstract: A proximity sensor apparatus has a detection electrode that forms an electrostatic capacitance between the detection electrode and an object to be detected. The detection electrode is fitted to an electrode base plate. The detection section detects electrostatic capacitance based on output of the detection electrode. The electrode base plate is supported by a push-button switch. When the object to be detected approaches the detection electrode, the electrostatic capacitance changes. Approach of the object to be detected can be detected by a change in electrostatic capacitance. When the object to be detected contacts the detection electrode, the push-button switch is turned on. The push-button switch is turned on, and thereby contact of the object to be detected can be detected.Type: GrantFiled: April 24, 2019Date of Patent: August 9, 2022Assignee: LIFE ROBOTICS INC.Inventors: Woo-Keun Yoon, Hiroaki Matsuda
-
Publication number: 20220212572Abstract: An alighting assistance device D of the present disclosure may be a device moving a driver seat rearward in a case where a determination is made that an occupant seated on the driver seat of a vehicle alights. The device may include a reclining mechanism as one example of an angle changer which changes an angle of a seat back of the driver seat with respect to a horizontal plane, a sitting height acquirer which acquires a sitting height of the occupant, and a seat controller as one example of an angle controller which controls the angle changer such that the angle of the seat back becomes closer to be perpendicular as the sitting height acquired by the sitting height acquirer is higher in the case where a determination is made that the occupant alights.Type: ApplicationFiled: January 4, 2022Publication date: July 7, 2022Applicant: Mazda Motor CorporationInventors: Yoshito HIRATA, Tomonori OHTSUBO, Hiroki UEMURA, Kengo IWATA, Masato MAEDA, Hiroaki MATSUDA, Masahito KASHIHARA, Chieko NAKAGAMI
-
Publication number: 20220212674Abstract: An alighting assistance device D of the present disclosure may be a device moving a driver seat rearward in a case where a determination may be made that an occupant seated on the driver seat of a vehicle alights. The device may include a height changer which changes a height of a steering wheel, a sitting height acquirer which acquires a sitting height of the occupant, and a steering wheel controller 33 as one example of a height controller which controls the height changer such that the height of the steering wheel becomes lower as the sitting height acquired by the sitting height acquirer may be higher in the case where a determination is made that the occupant alights.Type: ApplicationFiled: January 5, 2022Publication date: July 7, 2022Applicant: Mazda Motor CorporationInventors: Yoshito HIRATA, Tomonori OHTSUBO, Hiroki UEMURA, Kengo IWATA, Masato MAEDA, Hiroaki MATSUDA, Masahito KASHIHARA, Chieko NAKAGAMI
-
Publication number: 20220154856Abstract: A refrigerant pipe that constitutes a refrigerant circuit of a refrigeration apparatus includes: a first pipe; and a second pipe. The first pipe includes: a first pipe body, made of stainless steel; and a first connection, made of a material different from stainless steel, disposed at an end of the first pipe body in a pipe axial direction of the first pipe body. The second pipe includes: a second pipe body, made of stainless steel; and a second connection, made of a material identical to the material of the first connection, disposed at an end of the second pipe body in a pipe axial direction of the second pipe body. The first connection is connected to the second connection.Type: ApplicationFiled: January 28, 2022Publication date: May 19, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Junichi Hamadate, Masanori Jindou, Yoshihiro Teramoto, Hiroaki Matsuda, Masato Okuno
-
Publication number: 20220146161Abstract: A refrigerant pipe of a refrigeration apparatus includes: a first pipe, made of stainless steel, through which a refrigerant flows; a joint pipe, made of a material different from stainless steel, disposed on an outer peripheral surface of the first pipe; and a second pipe, having a diameter smaller than a diameter of the first pipe, connected to the outer peripheral surface of the first pipe via the joint pipe. A surface of the second pipe at which the second pipe is connected to the joint pipe is made of a material identical to the material of the joint pipe.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Junichi Hamadate, Masanori Jindou, Yoshihiro Teramoto, Hiroaki Matsuda, Masato Okuno
-
Publication number: 20220146159Abstract: A refrigeration apparatus includes: a casing that houses a compressor therein; a four-way switching valve; an accumulator; a first pipe that causes a refrigerant to flow between the four-way switching valve and a discharge portion of the compressor; and a second pipe that causes a refrigerant to flow between the four-way switching valve and the accumulator. The four-way switching valve, the first pipe, and the second pipe are all made of stainless steel.Type: ApplicationFiled: January 27, 2022Publication date: May 12, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Junichi Hamadate, Masanori Jindou, Yoshihiro Teramoto, Hiroaki Matsuda, Masato Okuno
-
Publication number: 20220146162Abstract: A refrigerant pipe that constitutes a refrigerant circuit of a refrigeration apparatus includes: a first pipe; and a second pipe. The first pipe includes a pipe body made of stainless steel; and a connection pipe, made of a material different from stainless steel, disposed at an end of the pipe body in a pipe axial direction. The connection pipe includes a protrusion protruding in the pipe axial direction from the end of the pipe body. The second pipe includes: a second-pipe large diameter portion, made of a material that is a same as the material of the connection pipe, disposed at an end in the pipe axial direction; a second-pipe small diameter portion having a smaller diameter than the second-pipe large diameter portion; and a step portion disposed between the second-pipe large diameter portion and the second-pipe small diameter portion.Type: ApplicationFiled: January 27, 2022Publication date: May 12, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Junichi Hamadate, Yoshihiro Teramoto, Masanori Jindou, Hiroaki Matsuda, Masato Okuno
-
Publication number: 20220076965Abstract: A semiconductor device includes a stacked body including a plurality of conductive layers insulated from each other, a semiconductor layer extending into the stacked body, and a charge storage layer located between one of the conductive layers and the semiconductor layer. The conductive layer contains tungsten and an auxiliary material. An amount of the auxiliary material is smaller than an amount of tungsten, and an oxide free energy of the auxiliary material is smaller than an oxide free energy of tungsten.Type: ApplicationFiled: March 3, 2021Publication date: March 10, 2022Inventors: Hiroaki MATSUDA, Masayuki KITAMURA
-
Publication number: 20210388125Abstract: Disclosed is a hydrogenated copolymer obtained by hydrogenating a copolymer which comprises an aromatic vinyl monomer unit and a chain conjugated diene monomer unit. When, among at least two hydrogenated copolymer-derived peaks in an elution curve measured by gel permeation chromatography of a sample containing the hydrogenated product, a hydrogenated copolymer-derived peak exhibiting a peak top with the earliest elution time is defined as a first peak and a hydrogenated copolymer-derived peak exhibiting a peak top with the second earliest elution time is defined as a second peak, the ratio of a standard polystyrene-equivalent molecular weight based on the elution time of the first peak (first peak molecular weight) to a standard polystyrene-equivalent molecular weight based on the elution time of the second peak (second peak molecular weight) is 1.50 or more. The second peak molecular weight is 1,000 or more.Type: ApplicationFiled: October 8, 2019Publication date: December 16, 2021Applicant: ZEON CORPORATIONInventor: Hiroaki MATSUDA
-
Patent number: 11181328Abstract: A heat exchanger including: a header; flat tubes connected to the header and disposed in line along a longitudinal direction of the header; a first partition that partitions an inner space of the header into a first space on a side where the flat tubes are connected and a second space on a side opposite to the first space; and a second partition that partitions the inner space of the header into a first side and a second side. The first side is one side of the header in the longitudinal direction and the second side is opposite to the first side. The first partition has a common opening. The common opening includes an insertion opening and a refrigerant opening. A refrigerant moves between the first space and the second space via the refrigerant opening. The second partition is inserted into the insertion opening.Type: GrantFiled: March 27, 2018Date of Patent: November 23, 2021Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Ken Satou, Tomohiko Sakamaki, Kouju Yamada, Masanori Jindou, Tomoya Yamaguchi, Satoshi Inoue, Shun Yoshioka, Yoshio Oritani, Hiroaki Matsuda
-
Patent number: 11137184Abstract: A refrigerant distributor includes a first refrigerant pipe, a plurality of second refrigerant pipes, a body, a first plate, and a second plate. The body is made of aluminum or aluminum alloy. The body is configured to distribute a refrigerant from the first refrigerant pipe into the second refrigerant pipes or merge the refrigerant flowing from each of the second refrigerant pipes into the first refrigerant pipe. The body has a first surface connected to the first refrigerant pipe and a second surface connected to the second refrigerant pipes. The first plate is joined to the first surface, and has an outer surface exposed to atmosphere and provided with a first sacrificial anode layer for the body. The second plate is joined to the second surface, and has an outer surface exposed to atmosphere and provided with a second sacrificial anode layer for the body.Type: GrantFiled: January 31, 2019Date of Patent: October 5, 2021Assignee: Daikin Industries, Ltd.Inventors: Kouju Yamada, Masanori Jindou, Ken Satou, Hiroaki Matsuda, Kohei Shiomi, Tomoki Yamayoshi
-
Publication number: 20210265266Abstract: A semiconductor device includes an interconnect including (i) a first layer, and (ii) a second layer provided on the first layer and including copper. The device also includes a plug provided on the interconnect and including (a) a third layer including titanium and nitrogen, and (b) a fourth layer provided on the third layer and including tungsten. A concentration of chlorine in the third layer is less than or equal to 5.0×1021 atoms/cm3, and a concentration of oxygen at the interface between the third layer and the fourth layer is less than or equal to 5.0×1021 atoms/cm3.Type: ApplicationFiled: February 24, 2021Publication date: August 26, 2021Applicant: Kioxia CorporationInventors: Masayuki KITAMURA, Atsushi KATO, Hiroaki MATSUDA