Abstract: A method for inserting a wire into a contact pin utilizes a wire insertion tool. The wire insertion tool includes a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed, a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed, and a division block positioning guide. When the first and second division blocks are fitted together by fitting the first and second wire insertion guide ditch forming planes, the first and second wire insertion guide ditches form a wire insertion guide hole. The division block positioning guide guides one of the blocks linearly to the other block such that these planes approach each other or separate from each other.

Abstract: The wire insertion tool by the present invention includes: a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed; a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed; and a division block positioning guide. When the first division block and the second division block form a coupling unit by fitting the first wire insertion guide ditch forming plane and the second wire insertion guide ditch forming plane, the first wire insertion guide ditch and the second wire insertion guide ditch form a wire insertion guide hole. The division block positioning guide guides one of these blocks linearly to the other such that these planes approach to each other or separate from each other.

Abstract: The wire insertion tool includes a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed, a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed, and a division block positioning guide. When the first division block and the second division block form a coupling unit by fitting the first wire insertion guide ditch forming plane and the second wire insertion guide ditch forming plane, the first wire insertion guide ditch and the second wire insertion guide ditch form a wire insertion guide hole. The division block positioning guide guides one of these blocks linearly to the other such that these planes approach to each other or separate from each other.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Abstract: The wire insertion tool by the present invention includes: a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed; a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed; and a division block positioning guide. When the first division block and the second division block form a coupling unit by fitting the first wire insertion guide ditch forming plane and the second wire insertion guide ditch forming plane, the first wire insertion guide ditch and the second wire insertion guide ditch form a wire insertion guide hole. The division block positioning guide guides one of these blocks linearly to the other such that these planes approach to each other or separate from each other.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.

Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.

Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.

Abstract: An inspection contact sheet for electronic device inspection comprises a three-layer base sheet formed by laminating protective films to both the surfaces of an insulating rubber layer, conductive rubber parts having rubber elasticity and penetrating the base sheet perpendicularly to the surfaces of the base sheet. One of the surfaces of the base sheet is provided with contact pads to be brought into contact with the terminals of the electronic device, and the other surface of the base sheet is provided with contact pads to be brought into direct contact with the terminals of an electronic circuit inspecting circuit member or wiring lines. The terminal pads or the wiring lines have an area greater than the sectional area of the conductive rubber parts.