Abstract: A vacuum process system for semiconductor manufacturing equipment provided with a vacuum chamber for processing semiconductor wafers under a prescribed vacuum pressure, wherein the vacuum process system is provided with an exhaust pipe connected to the vacuum chamber. A pressure control valve and exhaust control valve are provided in series with the exhaust closing valve provided on the exhaust pipe. The interior of the vacuum chamber is exhausted using the exhaust pump and the pressure control valve and exhaust control valve are controlled by the process controller. Thereby, the rising time and exhaust time are both shortened while supplying gas.