Abstract: A capless filler includes a housing, a flap, and a biasing spring. The housing has a fuel hole. The flap includes a supported part, a base, and a protrusion. The supported part is provided at an end part and is supported by the housing. The base extends to the supported part. The protrusion protrudes from the base. The flap is turned on a fulcrum at the supported part between open and closed positions. The biasing spring biases the flap in a direction from the open position to the closed position. The biasing spring pushes the base against an opening rim of the fuel hole at the closed position. The flap is turned in a direction from the closed position to the open position in response to the protrusion being pushed. At least a part of the protrusion is provided as a nozzle guide.

Abstract: An image display element includes micro light emitting elements disposed in an array on a driving circuit substrate. An excitation light emitting element includes a main body including a compound semiconductor, a metal electrode disposed on a side of the main body located closer to the driving circuit substrate, and a transparent electrode disposed on an opposite side to the driving circuit substrate, and a light emission layer included in the main body is disposed on a side opposite to the driving circuit substrate from a center portion of the main body.

Abstract: A micro light-emitting element includes: a micro light-emitting diode (LED) element configured to emit excitation light; and a wavelength conversion portion containing a nano particle configured to absorb the excitation light to emit light having a longer wavelength than the excitation light. The wavelength conversion portion has, on at least a light emitting surface of the wavelength conversion portion, a stack of one or more layers including an oxygen absorption film.

Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: A light emitting device includes a semiconductor light source device including a plurality of semiconductor light emitting elements, a wavelength conversion member that converts a wavelength of irradiation light from the semiconductor light source device, a concentrating lens that concentrates the irradiation light from the semiconductor light source device, and a cylindrical holder. The semiconductor light source device, the wavelength conversion member and the concentrating lens is supported by a support portion provided in an inner diameter portion of the cylindrical holder.

Abstract: An image display element includes micro light emitting elements arranged in an array, a drive circuit substrate that includes a drive circuit for supplying a current to the micro light emitting elements to cause light to be emitted, and an antenna arranged on a light emitting surface of each of the micro light emitting elements, in which the antenna includes isolated convex portions.

Abstract: A light emitting device includes a semiconductor light source device including a plurality of semiconductor light emitting elements, a wavelength conversion member that converts a wavelength of irradiation light from the semiconductor light source device, a concentrating lens that disposed between the semiconductor light source device and the wavelength conversion member and concentrates the irradiation light from the semiconductor light source device, and a cylindrical holder. The semiconductor light source device, the wavelength conversion member and the concentrating lens is supported by a support portion provided in an inner diameter portion of the cylindrical holder.

Abstract: An image display element includes pixels, a driving circuit substrate, a microlens, and an inter-pixel partition. The pixels are disposed in an array, each including a micro light emitting element. The driving circuit substrate includes a driving circuit configured to supply a current to the micro light emitting element and cause the micro light emitting element to emit light. The microlens is disposed for each of the pixels. The inter-pixel partition is disposed between the pixels and extends from a light emitting surface of the micro light emitting element to the microlens.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: A manufacturing method includes: a step of forming a light-emitting element layer by forming a semiconductor layer, a light-emitting layer, and a semiconductor layer in this order from a side with a first substrate on a surface, of the first substrate, on one side; a step of forming a separation trench in the light-emitting element layer to form a plurality of island shape light-emitting element layers; a step of forming a light shielding layer made of a material different from a material of the light-emitting element layer, in the separation trench; and a step of forming a plurality of light-emitting elements each including a corresponding one of the plurality of island shape light-emitting element layers having a height less than a height of the light shielding layer by etching a portion of the semiconductor layers of each of the plurality of island shape light-emitting element layers.

Abstract: A semiconductor module comprises an underlayer substrate on which a drive circuit is formed; a light-emitting element electrically coupled to the drive circuit; and a color conversion layer formed on the light-emitting element and containing a color conversion material that absorbs light emitted from the light-emitting element and converts a luminescent color of the light-emitting element to another luminescent color, wherein the color conversion material contained in the color conversion layer is present more on a light-emitting element side of the color conversion layer than on a side opposite to the light-emitting element side of the color conversion layer.

Abstract: A light-emitting device having four or more LEDs arranged on a substrate includes a first color conversion layer and a second color conversion layer. The first color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs, and the second color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs that are different from the LEDs on which the first color conversion layer is formed.

Abstract: A light source device includes: a driving circuit; a blue light emitting element made of a group III nitride semiconductor which has a light outgoing surface on a side opposite to a side with the driving circuit, is arranged on the driving circuit, and is electrically connected to the driving circuit; and a color conversion layer which is in contact with the light outgoing surface and converts a wavelength of light emitted from the light outgoing surface. The light outgoing surface is made of a group III nitride semiconductor.

Abstract: An image display element includes micro light emitting elements disposed in an array on a driving circuit substrate. An excitation light emitting element includes a main body including a compound semiconductor, a metal electrode disposed on a side of the main body located closer to the driving circuit substrate, and a transparent electrode disposed on an opposite side to the driving circuit substrate, and a light emission layer included in the main body is disposed on a side opposite to the driving circuit substrate from a center portion of the main body.

Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: An image display element includes micro light emitting elements arranged in an array, a drive circuit substrate that includes a drive circuit for supplying a current to the micro light emitting elements to cause light to be emitted, and an antenna arranged on a light emitting surface of each of the micro light emitting elements, in which the antenna includes isolated convex portions.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: A light source device includes a plurality of light emitting elements, phosphor layers provided for each of the plurality of light emitting elements at positions on emission sides of light from the light emitting elements and parts of which are in contact with the light emitting elements, light shielding layers different from the phosphor layers, and reinforcement layers provided between the light emitting elements.

Abstract: Provided is a light source device including: at least one light emitting element of at least one type; at least one far-red phosphor that, when excited by output light from the light emitting element, emits light having a peak in a wavelength range of 680 nm or more to less than 780 nm; and at least one phosphor that, when excited by the output light from the light emitting element, emits light having a peak in a wavelength range different from the wavelength range of the light emitted from the far-red phosphor. The spectrum of light emitted from the light source device has characteristic A below. This light source device has sufficient emission intensity over the entire visible range, i.e., over a wavelength range of from 400 nm to 750 nm inclusive. Characteristic A: The ratio of a minimum emission intensity to a maximum emission intensity in a wavelength range of from 400 nm to 750 nm inclusive is 20% or more.

Abstract: A light-emitting device having four or more LEDs arranged on a substrate includes a first color conversion layer and a second color conversion layer. The first color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs, and the second color conversion layer is continuously formed on light exit surfaces of two or more of the LEDs that are different from the LEDs on which the first color conversion layer is formed.