Patents by Inventor Hiroaki Ota
Hiroaki Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983586Abstract: A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.Type: GrantFiled: March 25, 2021Date of Patent: May 14, 2024Assignee: DENKA COMPANY LIMITEDInventors: Daisuke Goto, Hiroaki Ota
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Patent number: 11912489Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.Type: GrantFiled: November 6, 2019Date of Patent: February 27, 2024Assignee: DENKA COMPANY LIMITEDInventors: Hiroaki Ota, Yosuke Ishihara, Daisuke Goto
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Patent number: 11831100Abstract: The terminal structure includes an electric wire including a core wire and a terminal member attached to the electric wire. The terminal member includes a joining portion to which the core wire is joined and the sealing portion surrounding the joining portion and including an opening portion having the joining portion exposed therethrough. The core wire is joined to the joining portion through the opening portion and is in close contact with the sealing portion annularly around the opening portion.Type: GrantFiled: February 25, 2022Date of Patent: November 28, 2023Assignee: HONDA MOTOR CO., LTD.Inventors: Hiroaki Ota, Yasunori Mukumoto, Masataka Ohashi, Kotaro Tagami
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Publication number: 20230303461Abstract: A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes’ principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.Type: ApplicationFiled: February 16, 2022Publication date: September 28, 2023Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Patent number: 11763960Abstract: A wire harness includes a first electric wire member including a first flexible wire and a hard wire electrically connected to the first flexible wire, a second electric wire member including a second flexible wire, and a tubular member through which the first and second electric wire members extend. The wire harness also includes a tubular holder that is attached to a longitudinal end portion of the tubular member and holds the first and second electric wire members therein. The holder has a first housing recess that is located in an inner surface of the holder and houses the second electric wire member.Type: GrantFiled: February 25, 2022Date of Patent: September 19, 2023Assignees: SUMITOMO WIRING SYSTEMS, LTD., HONDA MOTOR CO., LTD.Inventors: Takuji Iwama, Kotaro Tagami, Hiroaki Ota, Masataka Ohashi
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Publication number: 20230187983Abstract: A power transmitting apparatus included in the contactless power feeding apparatus includes a power supply circuit that supplies AC power having a predetermined drive frequency to a transmission coil for supplying power to a power receiving apparatus, a first coil and a first capacitor that are connected between the power supply circuit and the transmission coil, a second capacitor that is connected at first end to the first capacitor and is connected at a second end to the second end of the transmission coil, and a control circuit. Also, the power receiving apparatus includes a receiver coil for receiving power, and a resonant circuit that includes a resonance capacitor that resonates together with the receiver coil. Also, the control circuit of the power transmitting apparatus controls the power supply circuit such that the predetermined drive frequency falls within a predetermined frequency range including a resonance frequency of the resonant circuit.Type: ApplicationFiled: November 22, 2022Publication date: June 15, 2023Applicant: OMRON CorporationInventors: Goro NAKAO, Hiroaki OTA, Yuki ITO, Kenichi TABATA, Atsushi NOMURA, Daiki ANDO, Ken ONOZAKA, Yusuke KAWAI, Mitsunori SUGIURA
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Publication number: 20230187982Abstract: A power transmitting apparatus included in a contactless power feeding apparatus includes a power supply circuit that supplies AC power having a predetermined drive frequency to a transmission coil for supplying power to a power receiving apparatus, a power receiving circuit that receives returning power transmitted from the power receiving apparatus, a control circuit that controls, according to a voltage of the returning power, the power supply circuit such that an output voltage of the power receiving apparatus is in a predetermined allowable range. Also, the power receiving apparatus includes a resonant circuit for receiving power via the transmission coil of the power transmitting apparatus, a rectifier circuit that rectifies power received via the resonant circuit, and a power transmitting circuit that transmits the returning power according to a voltage of power output from the rectifier circuit to the power transmitting apparatus.Type: ApplicationFiled: November 21, 2022Publication date: June 15, 2023Applicant: OMRON CorporationInventors: Goro NAKAO, Hiroaki OTA, Ken ONOZAKA, Yuki ITO, Taichi MISHIMA, Yusuke KAWAI
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Publication number: 20230156966Abstract: An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 ?m or less.Type: ApplicationFiled: March 11, 2021Publication date: May 18, 2023Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Publication number: 20230042932Abstract: A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.Type: ApplicationFiled: March 25, 2021Publication date: February 9, 2023Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Publication number: 20220369499Abstract: Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P1 and P2 of the curve is l1, a point at which a distance to l1 on the curve is maximum is Pmax, an intersection point between l1 and a perpendicular drawn from Pmax to l1 is P3, a middle point of a line segment P1P3 is P4, an intersection point between the curve and a straight line that passes through P4 and is perpendicular to l1 is Pmid, a length of the line segment P1P3 is L, a length of a line segment P3Pmax is H, and a length of a line segment P4Pmax is h, (2 h/L)/(H/L) is 1.1 or more.Type: ApplicationFiled: January 29, 2020Publication date: November 17, 2022Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Publication number: 20220320791Abstract: The terminal structure includes an electric wire including a core wire and a terminal member attached to the electric wire. The terminal member includes a joining portion to which the core wire is joined and the sealing portion surrounding the joining portion and including an opening portion having the joining portion exposed therethrough. The core wire is joined to the joining portion through the opening portion and is in close contact with the sealing portion annularly around the opening portion.Type: ApplicationFiled: February 25, 2022Publication date: October 6, 2022Inventors: Hiroaki OTA, Yasunori MUKUMOTO, Masataka OHASHI, Kotaro TAGAMI
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Publication number: 20220285045Abstract: A wire harness includes a first electric wire member including a first flexible wire and a hard wire electrically connected to the first flexible wire, a second electric wire member including a second flexible wire, and a tubular member through which the first and second electric wire members extend. The wire harness also includes a tubular holder that is attached to a longitudinal end portion of the tubular member and holds the first and second electric wire members therein. The holder has a first housing recess that is located in an inner surface of the holder and houses the second electric wire member.Type: ApplicationFiled: February 25, 2022Publication date: September 8, 2022Applicants: SUMITOMO WIRING SYSTEMS, LTD., HONDA MOTOR CO., LTD.Inventors: Takuji IWAMA, Kotaro TAGAMI, Hiroaki OTA, Masataka OHASHI
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Publication number: 20220142337Abstract: The backpack encompasses a box-shaped storage-compartment having first and second main surfaces opposite to each other and a triple-sided surface whereby triple continuous sides of the first main surface and triple sides of the second main surface opposite thereto are connected to each other, and a back plate encompassing a joint plane opposite to the first main surface and a backrest plane opposite to the joint plane. A convex element is disposed on one of the first main surface or the joint plane, and an insertion hole with a structure matching the convex element is disposed on a position on the other of the first main surface or the joint plane corresponding to the convex element. The storage-compartment and the back plate can be freely attached to and detached from each other by placing the convex element into the insertion hole and separating the convex element from the insertion hole.Type: ApplicationFiled: January 22, 2022Publication date: May 12, 2022Inventor: Hiroaki OTA
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Publication number: 20220104400Abstract: A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f2, f2 is less than f1 by 10 ?m or more.Type: ApplicationFiled: January 29, 2020Publication date: March 31, 2022Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Publication number: 20220017282Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.Type: ApplicationFiled: November 6, 2019Publication date: January 20, 2022Applicant: DENKA COMPANY LIMITEDInventors: Hiroaki OTA, Yosuke ISHIHARA, Daisuke GOTO
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Publication number: 20210269697Abstract: A metal-silicon carbide-based composite material including: a composite part including a silicon carbide-based porous body constituted by a plurality of silicon carbide particles, and a metal that is infiltrated in the silicon carbide-based porous body; and first and second surface layers which contain a metal, and coat both main surfaces of the composite part. The metal contains at least one kind selected from the group consisting of aluminum and magnesium, and the amount of particles having a particle size of 300 ?m or more in the plurality of silicon carbide particles is 5% by volume or less.Type: ApplicationFiled: July 11, 2019Publication date: September 2, 2021Applicant: DENKA COMPANY LIMITEDInventors: Daisuke GOTO, Hiroaki OTA
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Patent number: 10823042Abstract: An air blowing fan device includes an electric motor including a rotation shaft, and an air blowing fan including an attachment portion, a boss portion, and an outer circumferential side air blowing blades. The attachment portion is attached to the rotation shaft. The boss portion includes a tubular portion that is positioned radially outward of the attachment portion and of which the outer diameter dimension is larger than the outer diameter dimension of the electric motor, and a linkage portion. The electric motor is disposed in the tubular portion, the outer circumferential side air blowing blade extends radially outward from an outer circumferential surface of the tubular portion, the linkage portion includes a ventilation hole, and an area occupied by the electric motor and an area occupied by the outer circumferential side air blowing blade partially overlap each other in the direction in which the rotation shaft extends.Type: GrantFiled: November 15, 2018Date of Patent: November 3, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshifumi Nishio, Hiroaki Ota, Akifumi Fujimoto
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Patent number: 10751912Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element.Type: GrantFiled: October 11, 2016Date of Patent: August 25, 2020Assignee: DENKA COMPANY LIMITEDInventors: Hiroaki Ota, Takeshi Miyakawa, Yosuke Ishihara
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Patent number: 10541189Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 ?m and 55-195 ?m, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 ?m and 45-205 ?m is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.Type: GrantFiled: November 24, 2017Date of Patent: January 21, 2020Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Hiroaki Ota, Hideo Tsukamoto
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Publication number: 20190341330Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 ?m and 55-195 ?m, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 ?m and 45-205 ?m is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.Type: ApplicationFiled: November 24, 2017Publication date: November 7, 2019Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Hiroaki OTA, Hideo TSUKAMOTO