Abstract: A mask blank has a substrate and a pattern-forming thin film formed on the substrate. The pattern-forming thin film is one of a single-layer film containing chromium and nitrogen or a multi-layer film comprising at least one chromium nitride-based layer. An arithmetic mean roughness Sa is 1.0 nm or less and a ratio of a maximum height Sz to the arithmetic mean roughness Sa Sz/Sa is 14 or less in a 1-?m square positioned in a central region on a surface of the pattern-forming thin film with respect to a center of the substrate.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom% or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom % or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: Provided is a mask blank. The mask blank has a structure where a thin film for pattern formation, a first hard mask film, and a second hard mask film are stacked in this order on a main surface of a substrate, the thin film for pattern formation contains a transition metal, the first hard mask film contains oxygen and one or more elements selected from silicon and tantalum, the second hard mask film contains a transition metal, a content of transition metal of the second hard mask film is less than the content of transition metal of the thin film for pattern formation, a region where the first hard mask film is formed on the main surface is smaller than a region where the thin film for pattern formation is formed, and the second hard mask film and the thin film for pattern formation are in contact with each other at least in part.

Abstract: The phase shift film has a function to transmit an exposure light of a KrF excimer laser at a transmittance of 2% or more, and a function to generate a phase difference of 150 degrees or more and 210 degrees or less between the exposure light transmitted through the phase shift film and the exposure light transmitted through the air for a same distance as a thickness of the phase shift film, in which the phase shift film has a structure where a lower layer and an upper layer are stacked in order from a side of the transparent substrate, in which a refractive index nL of the lower layer at a wavelength of the exposure light and a refractive index nU of the upper layer at a wavelength of the exposure light satisfy a relation of nL>nU, in which an extinction coefficient kL of the lower layer at a wavelength of the exposure light and an extinction coefficient kU of the upper layer at a wavelength of the exposure light satisfy a relation of kL>kU; and in which a thickness dL of the lower layer and a thicknes

Abstract: A chirality detector of the present invention for detecting chirality of chiral material, includes: a first electrode and a second electrode that are configured to apply a voltage to a subject containing the chiral material; a spin detection layer configured to be in contact with the subject; a power supply; and a control section. The power supply and the control section are configured to generate an electric field at the subject by applying the voltage between the first electrode and the second electrode. The control section is configured to detect a voltage generated in the spin detection layer in a direction that goes across a direction of the electric field or a voltage generated between the spin detection layer and the subject, and also is configured to detect chirality of the chiral material on the basis of the detected voltage.

Abstract: Provided is a mask blank (100) for manufacturing a phase shift mask, the mask blank enabling formation of a high-precision and fine pattern on a light shielding film.

Abstract: Provided is a mask blank in which a light shielding film which is a single layer film formed of a silicon nitride-based material has high light shielding performance against ArF exposure light and is capable of reducing EMF bias of a pattern of the light shielding film. The mask blank includes the light shielding film on a transparent substrate. The light shielding film has an optical density of 3.0 or greater to ArF exposure light. A refractive index n and an extinction coefficient k of the light shielding film to ArF exposure light simultaneously satisfy relationships defined by Formulas (1) and (2) below. n?0.0733×k2+0.4069×k+1.0083 ??Formula (1) n?29.316×k2?92.292×k+72.

Abstract: A mask blank including a light shielding film pattern having high ArF light fastness. The light shielding film is on a transparent substrate. In the mask blank, the light shielding film is a single layer film formed of a material containing silicon and nitrogen, and the light shielding film has an optical density to an ArF excimer laser exposure light of 2.5 or more, a surface reflectance to the exposure light of 40% or less, a back-surface reflectance to the exposure light of 40% or less, a transmittance to a light having a wavelength of 900 nm of 50% or less, an extinction coefficient to a light having a wavelength of 900 nm of 0.04 or more, and a thickness of 60 nm or less.

Abstract: A mask blank including a light shielding film pattern having high ArF light fastness. The light shielding film is on a transparent substrate. In the mask blank, the light shielding film is a single layer film formed of a material containing silicon and nitrogen, and the light shielding film has an optical density to an ArF excimer laser exposure light of 2.5 or more, a surface reflectance to the exposure light of 40% or less, a back-surface reflectance to the exposure light of 40% or less, a transmittance to a light having a wavelength of 900 nm of 50% or less, an extinction coefficient to a light having a wavelength of 900 nm of 0.04 or more, and a thickness of 60 nm or less.

Abstract: Provided is a mask blank including a phase shift film. The mask blank includes a phase shift film on a main surface of a transparent substrate, the phase shift film contains silicon, oxygen, and nitrogen, a ratio of a nitrogen content [atom %] to a silicon content [atom %] in the phase shift film is 0.20 or more and 0.52 or less, a ratio of an oxygen content [atom %] to a silicon content [atom %] in the phase shift film is 1.16 or more and 1.70 or less, a refractive index n of the phase shift film to a wavelength of an exposure light of an ArF excimer laser is 1.7 or more and 2.0 or less, and an extinction coefficient k is 0.05 or less.

Abstract: Provided is a mask blank, including a phase shift film. The phase shift film has a structure where a first layer and a second layer are stacked in this order from a side of the transparent substrate. The first layer is provided in contact with a surface of the transparent substrate. Refractive indexes n1 and n2 of the first layer and the second layer, respectively, at a wavelength of an exposure light of an ArF excimer laser satisfy the relation n1<n2. Extinction coefficients k1 and k2 of the first layer and the second layer, respectively, at a wavelength of the exposure light satisfy the relation k1<k2. Film thicknesses d1 and d2 of the first layer and the second layer, respectively, satisfy the relation d1<d2.

Abstract: In the present invention, an etching stopper film (2), a light-blocking film (3) comprising a material containing one or more elements selected from among silicon and tantalum, and a hard mask film (4) are laminated in that order on a translucent substrate (1). The etching stopper film is made of a material containing chromium, oxygen and carbon, the chromium content is 50 atom % or more, the maximum peak in a N1s narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy is below the detection limit, and a Cr2p narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy has a maximum peak at a bond energy of 574 eV or less.

Abstract: A mask blank 100 has a structure in which a pattern-forming thin film 3 and a hard mask film 4 are formed on a transparent substrate 1 in this order. An Si2p narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of at least 103 eV. An N1s narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak below a detection lower limit value. In the hard mask film 4, a content ratio (atomic %) of silicon and oxygen is Si:O=1:less than 2.

Abstract: A chirality detector of the present invention for detecting chirality of chiral material, includes: a first electrode and a second electrode that are configured to apply a voltage to a subject containing the chiral material; a spin detection layer configured to be in contact with the subject; a power supply; and a control section. The power supply and the control section are configured to generate an electric field at the subject by applying the voltage between the first electrode and the second electrode. The control section is configured to detect a voltage generated in the spin detection layer in a direction that goes across a direction of the electric field or a voltage generated between the spin detection layer and the subject, and also is configured to detect chirality of the chiral material on the basis of the detected voltage.

Abstract: Provided is a mask blank in which a light shielding film which is a single layer film formed of a silicon nitride-based material has high light shielding performance against ArF exposure light and is capable of reducing EMF bias of a pattern of the light shielding film. The mask blank includes the light shielding film on a transparent substrate. The light shielding film has an optical density of 3.0 or greater to ArF exposure light. A refractive index n and an extinction coefficient k of the light shielding film to ArF exposure light simultaneously satisfy relationships defined by Formulas (1) and (2) below. n?0.0733×k2+0.4069×k+1.0083 ??Formula (1) n?29.316×k2?92.292×k+72.

Abstract: A mask blank has a structure in which a pattern-forming thin film and a hard mask film are formed on a substrate in this order. The hard mask film is made of a material containing silicon, oxygen, and nitrogen. The hard mask film has a nitrogen content of at least 2% and at most 18%. An Si2p narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of at least 103 eV.

Abstract: A light shielding film made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film made up of a material containing chromium, oxygen, and carbon are laminated on a transparent substrate. The hard mask film is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for Nis in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film have a 50 atom % or more chromium content, and the maximum peak for Cr2p in a narrow spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.

Abstract: A mask blank including a phase shift film.