Abstract: An ECU controls waste heat quantity of an engine according to a required heat quantity in response to a heat-utilize requirement. The ECU controls a valve opening period of an intake valve based on an engine driving condition and an ignition timing based on a most efficient timing at which fuel economy is highest. The ECU determines whether there is an ignition advance margin relative to the most efficient timing. When there is no margin, an actual compression ration of the engine is decreased by advancing or retarding a valve close timing of the intake valve and the ignition timing is advanced relative to the most efficient timing in order to increase the waste heat quantity.

Abstract: A first purge passage is connected to an intake-air passage at a downstream side of a throttle valve. A second purge passage is connected to the intake-air passage at an upstream side of a supercharging device. A first and a second check valve are respectively provided in the first and second purge passages. A control unit determines to which operating condition (from a first to a third operating condition) engine operation corresponds, based on downstream-side and upstream-side pressure of the throttle valve. A change of in-tank pressure of a fuel tank is detected in a condition that an air-communication valve is closed but a purge control valve is opened. The control unit diagnoses which of the valves is not normally operated and whether such valve is fixed to a valve opened or a valve closed position, based on the change of in-tank pressure for each of engine operating conditions.

Abstract: An apparatus is provided for application to a waste heat reuse system that recovers and reuses engine waste heat, and for controlling the amount of waste heat based on a requested heat amount of a heat utilization request. In the apparatus, an overlap angle between a valve-opening period of an intake valve and that of an exhaust valve of the engine is controlled based on an engine driving condition. Ignition timing of the engine is controlled to fall on maximum-efficient timing that minimizes fuel consumption in a current engine driving condition. When a requested heat amount cannot be satisfied, overlap-increase control is performed to increase an overlap angle, and ignition advance control is performed to advance ignition timing with reference to a maximum-efficient timing that corresponds to the increased overlap angle. Waste heat amount of the engine is controlled with the overlap-increase control and the ignition advance control.

Abstract: The waste heat control apparatus is used in a heat recovery system for recovering and reusing waste heat of an engine. The waste heat control apparatus includes a plurality of waste heat amount adjusting sections activated to increase an amount of the waste heat of the engine, and a control section which performs waste heat control in accordance with a heat utilization demand to increase the amount of the waste heat of the engine by activating at least one of the plurality of waste heat amount adjusting sections.

Abstract: An ECU detects a shaft torque in a specified torque detection range defined for each cylinder. The shaft torque is generated due to a combustion of the fuel and is applied to a crankshaft of the engine. The ECU computes a crank angle position as an actual peak position at which a combustion torque is peak. The ECU stores a previously determined maximum torque position which corresponds to a crank angle position at which a combustion torque becomes peak. Based on the actual peak position and the previously stored maximum torque position, an igniter controls an ignition timing.

Abstract: An ECU controls waste heat quantity of an engine according to a required heat quantity in response to a heat-utilize requirement. The ECU controls a valve opening period of an intake valve based on an engine driving condition and an ignition timing based on a most efficient timing at which fuel economy is highest. The ECU determines whether there is an ignition advance margin relative to the most efficient timing. When there is no margin, an actual compression ration of the engine is decreased by advancing or retarding a valve close timing of the intake valve and the ignition timing is advanced relative to the most efficient timing in order to increase the waste heat quantity.

Abstract: An apparatus is provided for application to a waste heat reuse system that recovers and reuses engine waste heat, and for controlling the amount of waste heat based on a requested heat amount of a heat utilization request. In the apparatus, an overlap angle between a valve-opening period of an intake valve and that of an exhaust valve of the engine is controlled based on an engine driving condition. Ignition timing of the engine is controlled to fall on maximum-efficient timing that minimizes fuel consumption in a current engine driving condition. When a requested heat amount cannot be satisfied, overlap-increase control is performed to increase an overlap angle, and ignition advance control is performed to advance ignition timing with reference to a maximum-efficient timing that corresponds to the increased overlap angle. Waste heat amount of the engine is controlled with the overlap-increase control and the ignition advance control.

Abstract: The waste heat control apparatus is used in a heat recovery system for recovering and reusing waste heat of an engine. The waste heat control apparatus includes a plurality of waste heat amount adjusting sections activated to increase an amount of the waste heat of the engine, and a control section which performs waste heat control in accordance with a heat utilization demand to increase the amount of the waste heat of the engine by activating at least one of the plurality of waste heat amount adjusting sections.

Abstract: A scanning type exposure apparatus includes a projection optical system which projects a pattern of a reticle onto a wafer, which is held by a wafer chuck, a scanning stage system which scanningly moves the reticle and the wafer synchronously with respect the projection optical system, and an inspection system which automatically inspects influence of particles on at least one of the wafer and on the wafer chuck. The inspection system includes a focus detector which measures a focus state of the wafer and a calculator which calculates outputs of the focus detector.

Abstract: A scanning type exposure apparatus includes a projection optical system which projects a pattern of a reticle onto a wafer, which is held by a wafer chuck, a scanning stage system which scanningly moves the reticle and the wafer synchronously with respect the projection optical system, and an inspection system which automatically inspects influence of particles on at least one of the wafer and on the wafer chuck. The inspection system includes a focus detector which measures a focus state of the wafer and a calculator which calculates outputs of the focus detector.

Abstract: A scan exposure apparatus according to this invention determines a scan velocity and a focus measurement position from process conditions and the like and determines a threshold ? of the focus measurement position on the basis of the scan velocity. The scan exposure apparatus executes focus measurement if a stage position falls within the range of the threshold ?.

Abstract: A scanning type exposure apparatus includes a projection optical system which projects a pattern of a reticle onto a wafer, which is held by a wafer chuck, a scanning stage system which scanningly moves the reticle and the wafer synchronously with respect the projection optical system, and an inspection system which automatically inspects influence of particles on at least one of the wafer and on the wafer chuck. The inspection system includes a focus detector which measures a focus state of the wafer and a calculator which calculates outputs of the focus detector.

Abstract: A scan exposure apparatus includes a stage which moves while mounting a substrate thereon, a projection optical system which projects a pattern on the stage, a horizontal position measurement unit which measures a horizontal position of the stage, and a measurement unit which measures a plane position of the substrate. A controller controls the stage so as to make an image plane of the projection optical system and a plane of the substrate coincide with each other on the basis of a measurement result by the measurement unit if a deviation of the horizontal position of the stage measured by the horizontal position measurement unit during scan exposure from a predetermined position falls within a tolerance. The tolerance is determined on the basis of a scan velocity of the stage.

Abstract: A scan exposure apparatus according to this invention determines a scan velocity and a focus measurement position from process conditions and the like and determines a threshold ? of the focus measurement position on the basis of the scan velocity. The scan exposure apparatus executes focus measurement if a stage position falls within the range of the threshold ?.

Abstract: A scanning type exposure apparatus includes a projection optical system which projects a pattern of a reticle onto a wafer, which is held by a wafer chuck, a scanning stage system which scanningly moves the reticle and the wafer synchronously with respect the projection optical system, and an inspection system which automatically inspects influence of particles on at least one of the wafer and on the wafer chuck. The inspection system includes a focus detector which measures a focus state of the wafer and a calculator which calculates outputs of the focus detector.

Abstract: A scanning type exposure apparatus includes a projection optical system which projects a pattern of a reticle onto a wafer, which is held by a wafer chuck, a scanning stage system which scanningly moves the reticle and the wafer synchronously with respect the projection optical system, and an inspection system which automatically inspects influence of particles on at least one of the wafer and on the wafer chuck. The inspection system includes a focus detector which measures a focus state of the wafer and a calculator which calculates outputs of the focus detector.

Abstract: A fine (short-stroke) stage is mounted on an XY slider and is capable of being moved over a minute range in the XY directions. Though the XY slider is moved along the X direction by a Y guide bar, movement along the X direction is decided by an X guide bar. If the relative angle between the direction of the X guide bar and the surface of a bar mirror of the fine stage is represented by ?, then the X guide bar will be moved by ?x when the XY slider has been moved by x along the X direction by the Y guide bar. After the fine stage is thus positioned, the relative positional relationship between the fine stage and the XY slider is held constant.

Abstract: A fine (short-stroke) stage is mounted on an XY slider and is capable of being moved over a minute range in the XY directions. Though the XY slider is moved along the X direction by a Y guide bar, movement along the X direction is decided by an X guide bar. If the relative angle between the direction of the X guide bar and the surface of a bar mirror of the fine stage is represented by &agr;, then the X guide bar will be moved by &agr;x when the XY slider has been moved by x along the X direction by the Y guide bar. After the fine stage is thus positioned, the relative positional relationship between the fine stage and the XY slider is held constant.

Abstract: A scanning type exposure apparatus includes a substrate stage for holding a substrate and for moving the substrate in at least one of a scanning direction and a rotational direction, an original stage for holding an original and for moving the original in at least one of the scanning direction and the rotational direction, an optical system for transferring a pattern of the original onto the substrate, and a controller for controlling movements of the substrate stage and the original stage. The controller synchronously controls the substrate stage and the original stage in the scanning direction, and independently controls the substrate stage and the original stage in the rotational direction.

Abstract: A moving apparatus according to this invention absorbs a reaction force generated upon driving a movable portion (3) by actuators (8, 8′) which has movable elements (2, 2′) and stators (1, 1′) by moving the left and right stators (1, 1′). The actuators (8, 8′) are controlled such that the moving distance of the movable portion (3) and that of the stators (1, 1′) have a predetermined relationship. With this operation, a moving apparatus which can move at high precision without transmitting vibrations to the outside in driving a stage, and an exposure apparatus using the same can be provided.