Abstract: A solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element. The solid-state imaging device 10 of the present invention includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

Abstract: A solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

Abstract: Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

Abstract: Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

Abstract: To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

Abstract: To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing element 1 of the present invention contains a long plate-shaped metal substrate 16, a long plate-shaped solid-state image sensing element 4 fixed to the surface of the metal substrate 16 via an adhesive layer 18, and bonding pads 6, formed on the surface of the solid-state image sensing element 4, for electrically connecting to the lead frame via bonding wires 14. The adhesive layer 18 contains a first adhesive layer 18a, and a second adhesive layer 18b of a higher modulus of elasticity than the first adhesive layer 18a, and at the regions directly below the bonding pads 6 provided at both end sections in a longitudinal direction of the solid-state image sensing element 4, the metal substrate 16 and the solid-state image sensing element 4 are fixed via the second adhesive layer 18b.

Abstract: The invention provides a solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element. The solid-state imaging device 10 of the present invention includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

Abstract: Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.

Abstract: To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. A resin molded semiconductor device including a heat sink having a support face with a semiconductor chip mounted thereon electrically connected to a lead frame, a resin molded case forms a space for accommodating the semiconductor chip therein, and has an opening on an upper face thereof defined by side walls including a plurality of linearly arrayed resin projections above a top surface portion of the side walls, and molds the lead frame and heat sink, and a glass cap closing the opening and secured to the resin molded case by a bonding agent layer. The case has a thermal coefficient of expansion matched with that of the heat sink, and mechanical stress between the case and the cap is absorbed by the bonding agent layer having a thickness greater that the height of the linearly arrayed resin projections above the top surface portion of the side walls.

Abstract: To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing element 1 of the present invention contains a long plate-shaped metal substrate 16, a long plate-shaped solid-state image sensing element 4 fixed to the surface of the metal substrate 16 via an adhesive layer 18, and bonding pads 6, formed on the surface of the solid-state image sensing element 4, for electrically connecting to the lead frame via bonding wires 14. The adhesive layer 18 contains a first adhesive layer 18a, and a second adhesive layer 18b of a higher modulus of elasticity than the first adhesive layer 18a, and at the regions directly below the bonding pads 6 provided at both end sections in a longitudinal direction of the solid-state image sensing element 4, the metal substrate 16 and the solid-state image sensing element 4 are fixed via the second adhesive layer 18b.

Abstract: Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.

Abstract: To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

Abstract: To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

Abstract: A one-dimensional CCD sensor has a support structure including an elongate metallic base plate for mounting thereon a CCD chip and a resin housing encircling the metallic base plate at the periphery thereof. A pair of lead frames are electrically connected to the CCD chip and fixed onto the metallic base plate in the vicinities of both the ends of the metallic base plate. The CCD sensor is free from the thermal stress caused by the difference in the coefficient of thermal expansion between the metallic base plate and the lead frames.

Abstract: A solid state pickup device to which the present invention is applicable comprises a base member (1a) and a solid state pickup chip (3) having a bottom surface, a receiving surface for receiving light signal, and a side surface. The solid state pickup chip is glued on the base member by using a first adhesive (7). The solid state pickup device further comprises a solid package (6) formed around the base member and the solid state pickup chip having transparency. Herein, the first adhesive has flexibility. The solid state pickup device still further comprises a covering member (5) formed around the receiving and the side surfaces of the solid state pickup chip having transparency and flexibility.