Patents by Inventor Hirofumi BABA

Hirofumi BABA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11101388
    Abstract: A semiconductor device of an embodiment includes a semiconductor layer having a first plane, a second plane, and a through hole penetrating from the first plane to the second plane; an insulating layer on a side of the second plane of the semiconductor layer; a first conductive layer in the insulating layer; a silicon oxide layer on a side of the first plane and in the through hole; a silicon nitride layer provided on the side of the first plane and in the through hole, the silicon oxide layer being interposed between the silicon nitride layer and the semiconductor layer; and a second conductive layer on the side of the first plane and in the through hole, the silicon oxide layer and the silicon nitride layer being interposed between the second conductive layer and the semiconductor layer, and the second conductive layer electrically connected to the first conductive layer.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: August 24, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Hirofumi Baba
  • Publication number: 20200303566
    Abstract: A semiconductor device of an embodiment includes a semiconductor layer having a first plane, a second plane, and a through hole penetrating from the first plane to the second plane; an insulating layer on a side of the second plane of the semiconductor layer; a first conductive layer in the insulating layer; a silicon oxide layer on a side of the first plane and in the through hole; a silicon nitride layer provided on the side of the first plane and in the through hole, the silicon oxide layer being interposed between the silicon nitride layer and the semiconductor layer; and a second conductive layer on the side of the first plane and in the through hole, the silicon oxide layer and the silicon nitride layer being interposed between the second conductive layer and the semiconductor layer, and the second conductive layer electrically connected to the first conductive layer.
    Type: Application
    Filed: September 16, 2019
    Publication date: September 24, 2020
    Inventor: Hirofumi Baba
  • Patent number: 9987673
    Abstract: The present invention aims to provide a manufacturing device for heat exchanger fins that is capable of adjusting for differences between a number of punches and a number of through-holes or cutaway portions in an actual product without causing a metal strip to sag or having punches punch the same positions twice.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: June 5, 2018
    Assignee: HIDAKA SEIKI KABUSHIKI KAISHA
    Inventors: Masanao Karasawa, Hirofumi Baba, Toshiyuki Nanaarashi
  • Publication number: 20160325339
    Abstract: The present invention aims to provide a manufacturing device for heat exchanger fins that is capable of adjusting for differences between a number of punches and a number of through-holes or cutaway portions in an actual product without causing a metal strip to sag or having punches punch the same positions twice.
    Type: Application
    Filed: March 28, 2014
    Publication date: November 10, 2016
    Applicant: HIDAKA SEIKI KABUSHIKI KAISHA
    Inventors: Masanao KARASAWA, Hirofumi BABA, Toshiyuki NANAARASHI
  • Patent number: 9192978
    Abstract: A flattened tube fin manufacturing apparatus includes: a press apparatus; an inter-row slit apparatus forming metal strips of a product width that are arranged in the width direction; a first feeding apparatus feeding the metal strips cut by the inter-row slit apparatus downstream; a cutoff apparatus that cuts the metal strips formed by the inter-row slit apparatus into predetermined lengths to form flattened tube fins; and a second feeding apparatus that feeds the flattened tube fins downstream. The plurality of metal strips outputted from the inter-row slit apparatus advance into the cutoff apparatus after entering a downwardly sagging state. The flattened tube fin manufacturing apparatus further includes a control unit controlling a feeding amount of the second feeding apparatus based on a feeding amount of the first feeding apparatus.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: November 24, 2015
    Assignee: HIDAKA SEIKI KABUSHIKI KAISHA
    Inventors: Hirofumi Baba, Yasuhiro Endo, Kazuyuki Tominaga
  • Publication number: 20140115881
    Abstract: A flattened tube fin manufacturing apparatus includes: a press apparatus; an inter-row slit apparatus forming metal strips of a product width that are arranged in the width direction; a first feeding apparatus feeding the metal strips cut by the inter-row slit apparatus downstream; a cutoff apparatus that cuts the metal strips formed by the inter-row slit apparatus into predetermined lengths to form flattened tube fins; and a second feeding apparatus that feeds the flattened tube fins downstream. The plurality of metal strips outputted from the inter-row slit apparatus advance into the cutoff apparatus after entering a downwardly sagging state. The flattened tube fin manufacturing apparatus further includes a control unit controlling a feeding amount of the second feeding apparatus based on a feeding amount of the first feeding apparatus.
    Type: Application
    Filed: April 24, 2013
    Publication date: May 1, 2014
    Applicant: HIDAKA SEIKI KABUSHIKI KAISHA
    Inventors: Hirofumi BABA, Yasuhiro ENDO, Kazuyuki TOMINAGA