Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

Abstract: [Object] To provide a laser processing apparatus and a laser processing method which are capable of reducing roughness of a cut surface in laser cutting using laser beams transmitted through optical fibers. [Solution] A laser processing apparatus according to the present invention includes at least one laser oscillator configured to emit laser beams, a plurality of optical fibers configured to transmit the emitted laser beams, and at least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate a surface of a workpiece with the focused laser beams. At output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes.

Abstract: An adhesive composition including an elastomer as a main component, an adhesive layer prepared from the adhesive composition having (i) a storage modulus (G?) of not less than 20,000 Pa at 220° C. and/or (ii) a loss modulus (G?) of not less than 20,000 Pa at 220° C.

Abstract: A processed substrate having a through-hole whose openings in respective surfaces of the processed substrate are matched to each other in size, and a method for easily manufacturing the processed substrate with high efficiency. The processed substrate (1) includes a light transmissive substrate having a plurality of through-holes. Each of the through-holes has a larger opening diameter and a smaller opening, wherein the larger opening diameter is larger in size than the smaller opening diameter by a difference of 5% or less of the size of the larger diameter. As such, a through-hole (6) whose openings in the respective surfaces are matched to each other in size can be provided.

Abstract: A laser apparatus of the present invention has a first laser oscillator that emits a first laser beam; a passive fiber that is a double-clad fiber that transmits the first laser beam through a core; and a second laser oscillator that emits a second laser beam that is coupled into inner cladding of the passive fiber. Additionally, a laser materials processing apparatus of the present invention is provided with the laser apparatus; and an irradiation optical system having a collimating lens and a condenser lens.

Abstract: The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.

Abstract: This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive.

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

Abstract: A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

Abstract: A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.

Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure.

Abstract: An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.

Abstract: An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).

Abstract: An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.

Abstract: An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

Abstract: Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

Abstract: An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

Abstract: An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.).

Abstract: An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.