Abstract: A thin-film transistor element including a gate layer, an oxide semiconductor thin-film, a gate insulating film disposed between the gate layer and the oxide semiconductor thin-film, a pair of source-drain electrodes electrically connected to the oxide semiconductor thin-film, and a resin film covering the oxide semiconductor thin-film is provided. The oxide semiconductor thin-film contains two or more metal elements selected from indium, gallium, zinc, and tin. The resin film is in contact with the oxide semiconductor thin-film. The resin film may include a compound that contains a SiH group. The resin film may be formed by applying a composition including a SiH group-containing compound onto the oxide semiconductor thin-film, and heating the composition.

Abstract: The present disclosure is directed to a light-shielding colored resin layer formed on a substrate, and a patterned protective layer formed on the colored resin layer. By removing the colored resin layer exposed in an opening of the protective layer by dry etching, thereby patterning the colored resin layer, a partition wall in which the protective layer is provided on a patterned colored resin layer is formed. This partition wall partitions the display surface of an image display device into a plurality of regions; and an image display device is formed by filling spaces, which are partitioned by the partition wall, with a color developing material.

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention provides a (meth)acrylic resin composition comprising a carboxylic acid group produced by heating a (meth)acrylic-based resin (C), wherein the (meth)acrylic-based resin (C) is obtained by polymerizing a monomer mixture (A) containing 80 to 99 wt % of a linear alkyl (meth)acrylate and 1 to 20 wt % of tertiary-butyl (meth)acrylate, in the presence of an acrylic acid ester-based crosslinked elastic particle (B) that is obtained by mixing and polymerizing 0.5 to 5 parts by weight of a polyfunctional monomer having at least two non-conjugated double bonds per molecule, with respect to 100 parts by weight of a monomer mixture containing 50 to 100 wt % of an alkyl acrylate monomer and 0 to 50 wt % of an alkyl methacrylate monomer. This composition can be used to produce a film having excellent chemical resistance (in particular, sun-screening agent resistance).

Abstract: The present invention provides a (meth)acrylic resin composition comprising a carboxylic acid group produced by heating a (meth)acrylic-based resin (C), wherein the (meth)acrylic-based resin (C) is obtained by polymerizing a monomer mixture (A) containing 80 to 99 wt % of a linear alkyl (meth)acrylate and 1 to 20 wt % of tertiary-butyl (meth)acrylate, in the presence of an acrylic acid ester-based crosslinked elastic particle (B) that is obtained by mixing and polymerizing 0.5 to 5 parts by weight of a polyfunctional monomer having at least two non-conjugated double bonds per molecule, with respect to 100 parts by weight of a monomer mixture containing 50 to 100 wt % of an alkyl acrylate monomer and 0 to 50 wt % of an alkyl methacrylate monomer. This composition can be used to produce a film having excellent chemical resistance (in particular, sun-screening agent resistance).

Abstract: The present invention provides a (meth)acrylic resin composition comprising a carboxylic acid group produced by heating a (meth)acrylic-based resin (C), wherein the (meth)acrylic-based resin (C) is obtained by polymerizing a monomer mixture (A) containing 80 to 99 wt % of a linear alkyl (meth)acrylate and 1 to 20 wt % of tertiary-butyl (meth)acrylate, in the presence of an acrylic acid ester-based crosslinked elastic particle (B) that is obtained by mixing and polymerizing 0.5 to 5 parts by weight of a polyfunctional monomer having at least two non-conjugated double bonds per molecule, with respect to 100 parts by weight of a monomer mixture containing 50 to 100 wt % of an alkyl acrylate monomer and 0 to 50 wt % of an alkyl methacrylate monomer. This composition can be used to produce a film having excellent chemical resistance (in particular, sun-screening agent resistance).

Abstract: The present invention provides a (meth)acrylic resin composition comprising a carboxylic acid group produced by heating a (meth)acrylic-based resin (C), wherein the (meth)acrylic-based resin (C) is obtained by polymerizing a monomer mixture (A) containing 80 to 99 wt % of a linear alkyl (meth)acrylate and 1 to 20 wt % of tertiary-butyl(meth)acrylate, in the presence of an acrylic acid ester-based crosslinked elastic particle (B) that is obtained by mixing and polymerizing 0.5 to 5 parts by weight of a polyfunctional monomer having at least two non-conjugated double bonds per molecule, with respect to 100 parts by weight of a monomer mixture containing 50 to 100 wt % of an alkyl acrylate monomer and 0 to 50 wt % of an alkyl methacrylate monomer. This composition can be used to produce a film having excellent chemical resistance (in particular, sun-screening agent resistance).