Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Abstract: Provided is a laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, one of a plurality of optical lenses is a conical lens, wherein an incident surface or a emitting surface of the conical lens is a conical surface, and a central portion of the conical lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the conical lens, and the conical lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: A laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, a portion of a plurality of optical lenses is a corn lens, wherein an incident surface or a emitting surface of the corn lens is a conical surface, and a central portion of the corn lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the corn lens, and the corn lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: Herein disclosed is a method of coating an automobile body with a chipping-resisting paint, which comprises the steps of: applying and drying that portion of a top-painted automobile body, which is susceptible to the stone chipping, with a chipping-resisting paint containing, as a chief material, 10 to 20 parts of urethane lacquer and, as a solvent, 60 to 75 parts of isopropyl alcohol, 7 to 12 parts of toluene and 7 to 10 parts of ethyl acetate, to have a dry film thickness of at least 30 .mu.m; stripping the applied and dried coating film of the chipping-resisting paint after lapse of a predetermined period; and applying and drying the stripped portion again with the chipping-resisting paint. These steps are repeated.