Patents by Inventor Hirofumi MUKAE

Hirofumi MUKAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939450
    Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: March 26, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi Mukae, Hirokazu Komori, Masaji Komori, Hideki Kono, Ayane Nakaue
  • Publication number: 20240026043
    Abstract: A method for producing a fluororesin composition for compression molding excluding ram extrusion molding, the method including: mixing a powder of a fluororesin A1 having a history of being heated to a melting point thereof or higher and an aqueous dispersion containing particles of a fluororesin B1 and having a solid concentration of 50% by mass or lower to provide a mixture; and drying the mixture to provide a fluororesin composition.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi Mukae, Yosuke Kishikawa, Taku Yamanaka, Taketo Kato, Ryuo Itoh, Hiroki Kubota
  • Publication number: 20240026141
    Abstract: A fluororesin composition, and a molded article obtained from the fluororesin composition. The fluororesin composition containing: a non-melt-flowable fluororesin A having a history of being heated to a melting point thereof or higher; and a non-melt-flowable fluororesin B having no history of being heated to a melting point thereof or higher. The fluororesin composition contains a tetrafluoroethylene unit and a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene. Further, the fluororesin composition is a powder for compression molding excluding ram extrusion molding.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Yosuke KISHIKAWA, Taku YAMANAKA, Taketo KATO, Ryuo ITOH, Hiroki KUBOTA
  • Publication number: 20240026142
    Abstract: A fluororesin composition and a molded article obtained from the fluororesin composition, the fluororesin composition containing: a non-melt-flowable fluororesin A having a history of being heated to a melting point thereof or higher; and a non-melt-flowable fluororesin B having no history of being heated to a melting point thereof or higher and being prepared by suspension polymerization. Further, the fluororesin composition has an apparent density of 0.42 g/ml or higher and 1.00 g/ml or lower, and is a powder for compression molding excluding ram extrusion molding.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: DAIKIN INDUSTRIES, LTD
    Inventors: Hirofumi MUKAE, Yosuke KISHIKAWA, Taku YAMANAKA, Taketo KATO, Ryuo ITOH, Hiroki KUBOTA
  • Publication number: 20240018349
    Abstract: A fluororesin composition, and a molded article obtained from the fluororesin composition. The fluororesin composition containing: a non-melt-flowable fluororesin A having a history of being heated to a melting point thereof or higher; and a non-melt-flowable fluororesin B having no history of being heated to a melting point thereof or higher and being prepared by suspension polymerization. Further, the fluororesin composition has an apparent density of 0.42 g/ml or higher and 1.00 g/ml or lower, and is in the form of powder.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Yosuke KISHIKAWA, Taku YAMANAKA, Taketo KATO, Ryuo ITOH, Hiroki KUBOTA
  • Publication number: 20240018280
    Abstract: A fluororesin composition having no melt flowability, and a molded article obtained from the fluororesin composition. The fluororesin composition contains: a non-melt-flowable fluororesin A having a history of being heated to a melting point thereof or higher; a melt-flowable fluororesin B; and a non-melt-flowable fluororesin C including a portion having no history of being heated to a melting point thereof or higher.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Yosuke KISHIKAWA, Taku YAMANAKA, Taketo KATO, Atsushi SAKAKURA, Ryuo ITOH, Hiroki KUBOTA, Ayane NAKAUE
  • Publication number: 20230357553
    Abstract: A housing for a livestock sensor, the housing including: a resin having a coefficient of kinetic friction of 0.40 or lower and a coefficient of static friction of 0.10 or lower, and the resin being other than polytetrafluoroethylene. Also disclosed is a livestock sensor including the housing and a detector inside the housing.
    Type: Application
    Filed: June 7, 2023
    Publication date: November 9, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Toshiyuki FUKUSHIMA, Hirofumi Mukae, Kenji Ishii, Yoshito Tanaka, Masaji Komori, Takumi Shimosuki, Akiyoshi Yamauchi, Yosuke Kishikawa, Hirokazu Aoyama
  • Publication number: 20230312777
    Abstract: A seal for a livestock sensor containing a resin, or a rubber free from a chlorine atom. The seal is at least one selected from a packing, an O-ring, and a gasket, and the seal is configured to prevent a body fluid containing an organic acid in livestock from entering a space that contains a detecting portion or a substrate of the livestock sensor. Also disclosed is a livestock sensor including the seal.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kenji ISHII, Yoshito TANAKA, Takumi SHIMOSUKI, Masaji KOMORI, Hirofumi MUKAE, Toshiyuki FUKUSHIMA, Akiyoshi YAMAUCHI, Yosuke KISHIKAWA, Hirokazu AOYAMA
  • Publication number: 20230309514
    Abstract: A housing for a livestock sensor capable of constituting a livestock sensor that has excellent corrosion resistance, has a small size, and can easily be administered orally to livestock, and a livestock sensor including the same. The housing includes a metal housing including a metal surface covered with a thermoplastic resin. Also disclosed is a livestock sensor including the housing.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Masaji Komori, Kenji Ishii, Yoshito Tanaka, Toshiyuki Fukushima, Takumi Shimosuki, Yosuke Kishikawa, Akiyoshi Yamauchi, Hirokazu Aoyama
  • Patent number: 11739206
    Abstract: A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: August 29, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi Mukae, Hideki Kono, Masaji Komori, Hiroshi Ito
  • Publication number: 20230016062
    Abstract: A resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride, wherein the particulate boron nitride is contained in an amount of 30 to 65% by volume.
    Type: Application
    Filed: September 9, 2022
    Publication date: January 19, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Ayane NAKAUE, Hiroshi ITO
  • Publication number: 20220135767
    Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hirokazu KOMORI, Masaji KOMORI, Hideki KONO, Ayane NAKAUE
  • Publication number: 20210332229
    Abstract: Provided are a resin composition having excellent heat dissipation properties as well as excellent moldability, and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.
    Type: Application
    Filed: August 23, 2019
    Publication date: October 28, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Hiroshi ITO
  • Publication number: 20210206970
    Abstract: A resin composition containing a polyarylene sulfide (a); a fluorine-containing copolymer (b); and a reactive functional group-containing compound (c), the polyarylene sulfide (a) and the fluorine-containing copolymer (b) giving a mass ratio (a):(b) of 99:1 to 40:60, the compound (c) being present in an amount of 0.1 to 35 parts by mass relative to 100 parts by mass of a total of the polyarylene sulfide (a) and the fluorine-containing copolymer (b), the resin composition having a tensile elongation at break in accordance with ASTM D 638 of 15% or more.
    Type: Application
    Filed: May 23, 2019
    Publication date: July 8, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshihiro SAIGUSA, Hirofumi MUKAE, Kanako ARAI, Yuimi ISHIHARA, Haruna MATSUMOTO, Hideki KONO