Abstract: A compound represented by Formula (1), Formula (2), or Formula (3), or a salt thereof, or a solvate thereof: wherein R1, R2, and R3 are the same or different and each represent a hydrazine group, an N-hydroxy-acetylamino group, or an N-hydroxy-formylamino group.

Abstract: A copper chelating agent that contains at least one compound selected from the group consisting of a compound represented by Formula (1), a compound represented by Formula (2), a compound represented by Formula (3), a compound represented by Formula (4), a salt thereof, and a solvate thereof:

Abstract: An input device includes a touch panel having an operation surface and configured to receive a touch input and a hover input by an operation body; a display device configured to display a plurality of selection items; a memory; and a processor coupled to the memory. The processor is configured to highlight a selection item, a selection of the selection item being made by the hover input from the plurality of selection items, confirm the selection of the selection item by the hover input in a case where a duration during which the selection item is selected by the hover input reaches a first predetermined threshold, and confirm a selection of the selection item by the touch input in a case where the touch input is detected on the selection item before the duration reaches the first predetermined threshold.

Abstract: The present invention aims to provide an antimicrobial and antiviral agent which comprises a naturally occurring component as an active ingredient and is effective against microbes including various classes of fungi and viruses. In one aspect of the present invention, provided is an antimicrobial and antiviral agent comprising Lactobacillus derived from Artemisia indica var. maximowiczii.

Abstract: An antifungal agent derived from an Acidipila bacterium, wherein the antifungal agent inhibits the growth of a filamentous fungus and/or yeast. The Acidipila bacterium may be selected from Acidipila sp. MT3 strain, deposited as NITE BP-03614; Acidipila sp. MT4 strain, deposited as NITE BP-03615; Acidipila sp. MT5 strain, deposited as NITE BP-03616; and Acidipila sp. MT6 strain, deposited as NITE BP-03617.

Abstract: A lead has a thick part having a thickness of 0.2 mm and a thin part having a thickness of 0.1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0.03 mm to 0.05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

Abstract: A lead has a thick part having a thickness of 0.2 mm and a thin part having a thickness of 0.1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0.03 mm to 0.05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.