Patents by Inventor Hirokazu Yanai

Hirokazu Yanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8670605
    Abstract: A disclosed identification method of identifying a data point distribution area on a coordinate plane includes dividing an area on the coordinate plane into divided areas so that the divided areas radiate from a division center point; selecting, in each of the divided areas, from among the data points in the divided area, a data point having the greatest distance from the division center point as a representative point; determining whether there is an overlapping area where a distribution representative point area overlaps a determination area; and determining, when there is the overlapping area, that the data group to be determined is a relevant data group.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 11, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Patent number: 8655049
    Abstract: A disclosed method of identifying a data point distribution area having data points on a coordinate plane includes dividing a coordinate plane area into plural divided areas using lines; in each divided area, selecting outermost data point data as representative points, and connecting the selected representative points to define a distribution area; comparing the area with a reference area to determine an overlapping area; and determining that the distribution area is a relevant area based on the existence of the overlapping area.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: February 18, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Patent number: 8558831
    Abstract: Disclosed is a method for drawing a distribution area of data points on a coordinate plane. The method includes a step in which a data point is selected as a first representative point; a step in which the data point corresponding to a direction in which a minimum angle is formed with respect to a first direction in a rotation direction is selected as a second representative point; a step in which the data point corresponding to a direction in which a minimum angle is formed with respect to a next direction in the rotation direction is selected as a next representative point, the step repeatedly selecting the next representative point; and a step in which the representative points are connected by a line to draw a distribution area indication line.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: October 15, 2013
    Assignee: Ricoh Company, Ltd.
    Inventors: Hirokazu Yanai, Junichi Konishi
  • Patent number: 8542229
    Abstract: A disclosed identification method of identifying a data point distribution area on a coordinate plane includes selecting a data point as a first representative point, setting the first representative point as an initial reference point, setting a direction passing through the initial reference point as an initial representative point selection direction, selecting an initial data point direction having a smallest angle relative to the initial representative point selection direction in a predetermined rotation direction when viewed from the initial representative point selection direction, selecting a data point corresponding to the initial data point direction as a second representative point of the data point distribution area, and determining whether there is an overlapping area where a distribution representative point area overlaps a determination area.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: September 24, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Patent number: 8440474
    Abstract: A chip quality determination method includes the steps of (a) determining the continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on the wafer test result of determining the acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in the same defective group; (b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from the periphery of the wafer based on the distance from a corresponding one of the defective groups; and (c) determining the quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: May 14, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Patent number: 8442270
    Abstract: An object detecting method includes dividing a standard pattern into two or more areas radially from a central point; selecting, in each divided area of the standard pattern, a standard pattern pixel position at the maximum distance from the area dividing central point as a standard pattern representative point; dividing a determined pattern into two or more areas; selecting, in each divided area of the determine pattern, a determined pattern pixel position at the maximum distance from the area dividing central point as a determined pattern representative point; determining a positional difference between the standard pattern representative point and the determined pattern representative point in the corresponding divided areas; and determining the determined pattern as a target object when the positional differences in all of the divided areas are within a predetermined range.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: May 14, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Patent number: 8372663
    Abstract: In a disclosed good chip classifying method capable of classifying the good chips on a wafer, defective chips are divided into defective groups so that the defective chips contiguous to each other are placed into the same defective group based on the wafer test results; the defective group is judged as a defective chip concentrated distribution area when the number of the defective chips exceeds the prescribed value; a defective chip concentrated distribution nearby area including all the defective chips in the defective chip concentrated distribution area and nearby good chips is formed; and the good chips in the defective chip concentrated distribution nearby area are classified to have a chip index based on four directions (X and Y axis directions) on which the defective chips in the defective chip concentrated distribution area are disposed.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: February 12, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Hirokazu Yanai
  • Publication number: 20110262005
    Abstract: An object detecting method includes dividing a standard pattern into two or more areas radially from a central point; selecting, in each divided area of the standard pattern, a standard pattern pixel position at the maximum distance from the area dividing central point as a standard pattern representative point; dividing a determined pattern into two or more areas; selecting, in each divided area of the determine pattern, a determined pattern pixel position at the maximum distance from the area dividing central point as a determined pattern representative point; determining a positional difference between the standard pattern representative point and the determined pattern representative point in the corresponding divided areas; and determining the determined pattern as a target object when the positional differences in all of the divided areas are within a predetermined range.
    Type: Application
    Filed: April 6, 2011
    Publication date: October 27, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventor: Hirokazu YANAI
  • Publication number: 20110264404
    Abstract: A disclosed identification method of identifying a data point distribution area on a coordinate plane includes selecting a data point as a first representative point, setting the first representative point as an initial reference point, setting a direction passing through the initial reference point as an initial representative point selection direction, selecting an initial data point direction having a smallest angle relative to the initial representative point selection direction in a predetermined rotation direction when viewed from the initial representative point selection direction, selecting a data point corresponding to the initial data point direction as a second representative point of the data point distribution area, and determining whether there is an overlapping area where a distribution representative point area overlaps a determination area.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 27, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventor: Hirokazu YANAI
  • Publication number: 20110249031
    Abstract: Disclosed is a method for drawing a distribution area of data points on a coordinate plane. The method includes a step in which a data point is selected as a first representative point; a step in which the data point corresponding to a direction in which a minimum angle is formed with respect to a first direction in a rotation direction is selected as a second representative point; a step in which the data point corresponding to a direction in which a minimum angle is formed with respect to a next direction in the rotation direction is selected as a next representative point, the step repeatedly selecting the next representative point; and a step in which the representative points are connected by a line to draw a distribution area indication line.
    Type: Application
    Filed: April 8, 2011
    Publication date: October 13, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventors: Hirokazu YANAI, Junichi Konishi
  • Publication number: 20110229011
    Abstract: A disclosed method of identifying a data point distribution area having data points on a coordinate plane includes dividing a coordinate plane area into plural divided areas using lines; in each divided area, selecting outermost data point data as representative points, and connecting the selected representative points to define a distribution area; comparing the area with a reference area to determine an overlapping area; and determining that the distribution area is a relevant area based on the existence of the overlapping area.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 22, 2011
    Applicant: RICOH COMPANY, LTD
    Inventor: Hirokazu YANAI
  • Publication number: 20110231129
    Abstract: A disclosed identification method of identifying a data point distribution area on a coordinate plane includes dividing an area on the coordinate plane into divided areas so that the divided areas radiate from a division center point; selecting, in each of the divided areas, from among the data points in the divided area, a data point having the greatest distance from the division center point as a representative point; determining whether there is an overlapping area where a distribution representative point area overlaps a determination area; and determining, when there is the overlapping area, that the data group to be determined is a relevant data group.
    Type: Application
    Filed: March 10, 2011
    Publication date: September 22, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventor: Hirokazu YANAI
  • Publication number: 20110117683
    Abstract: A chip quality determination method includes the steps of (a) determining the continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on the wafer test result of determining the acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in the same defective group; (b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from the periphery of the wafer based on the distance from a corresponding one of the defective groups; and (c) determining the quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.
    Type: Application
    Filed: July 15, 2009
    Publication date: May 19, 2011
    Applicant: RICOH COMPANY, LTD.
    Inventor: Hirokazu Yanai
  • Publication number: 20100110078
    Abstract: A method for plotting a distribution area of a plurality of data points each having two paired variables in a scatter diagram includes (a) dividing a distribution of data points into at least two division areas in one or more radial directions of the distribution of data points from an arbitrary first central dividing point and selecting a data point having a longest distance from the first central dividing point in each of the division areas as a representative point of the distribution of data points, and (b) plotting a distribution area representing line by sequentially connecting the selected representative points in respective division areas.
    Type: Application
    Filed: October 28, 2009
    Publication date: May 6, 2010
    Applicant: RICOH COMPANY, LTD.
    Inventor: Hirokazu YANAI
  • Publication number: 20090000995
    Abstract: In a disclosed good chip classifying method capable of classifying the good chips on a wafer, defective chips are divided into defective groups so that the defective chips contiguous to each other are placed into the same defective group based on the wafer test results; the defective group is judged as a defective chip concentrated distribution area when the number of the defective chips exceeds the prescribed value; a defective chip concentrated distribution nearby area including all the defective chips in the defective chip concentrated distribution area and nearby good chips is formed; and the good chips in the defective chip concentrated distribution nearby area are classified to have a chip index based on four directions (X and Y axis directions) on which the defective chips in the defective chip concentrated distribution area are disposed.
    Type: Application
    Filed: June 24, 2008
    Publication date: January 1, 2009
    Inventor: Hirokazu Yanai