Patents by Inventor Hiroki Aritomo

Hiroki Aritomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170337940
    Abstract: A manufacturing method for a magnetic head forms a leading shield having a top surface. The top surface of the leading shield includes first and second portions. The second portion is located farther from a medium facing surface than is the first portion, and recessed from the first portion. A first gap layer is then formed on the first portion. Then, a magnetic layer including an initial first side shield, an initial second side shield and a coupling section connecting them is formed using a mold. The mold is then removed. The coupling section is then removed by etching the magnetic layer. A second gap layer and a main pole are then formed in this order.
    Type: Application
    Filed: May 23, 2016
    Publication date: November 23, 2017
    Applicant: TDK CORPORATION
    Inventors: Hiroki ARITOMO, Atsushi YAMAGUCHI, Michitaka NISHIYAMA, Yumiko YOKOYAMA, Koichi OTANI
  • Patent number: 9824700
    Abstract: A manufacturing method for a magnetic head forms a leading shield having a top surface. The top surface of the leading shield includes first and second portions. The second portion is located farther from a medium facing surface than is the first portion, and recessed from the first portion. A first gap layer is then formed on the first portion. Then, a magnetic layer including an initial first side shield, an initial second side shield and a coupling section connecting them is formed using a mold. The mold is then removed. The coupling section is then removed by etching the magnetic layer. A second gap layer and a main pole are then formed in this order.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 21, 2017
    Assignee: TDK CORPORATION
    Inventors: Hiroki Aritomo, Atsushi Yamaguchi, Michitaka Nishiyama, Yumiko Yokoyama, Koichi Otani
  • Patent number: 7974042
    Abstract: The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: July 5, 2011
    Assignee: TDK Corporation
    Inventors: Takahide Masuda, Masashi Sano, Hiroki Aritomo
  • Patent number: 7867060
    Abstract: Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and having the surface to be polished. The polishing method uses a retainer ring made of a ceramic material containing AlTiC.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: January 11, 2011
    Assignee: TDK Corporation
    Inventors: Hiroki Aritomo, Tetsuji Hori, Akira Miyasaka, Youji Hirao
  • Publication number: 20090247060
    Abstract: Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and having the surface to be polished. The polishing method uses a retainer ring made of a ceramic material containing AlTiC.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 1, 2009
    Applicants: TDK CORPORATION, MARUSHIN-INDUSTRY CO., LTD.
    Inventors: Hiroki Aritomo, Tetsuji Hori, Akira Miyasaka, Youji Hirao
  • Publication number: 20080261079
    Abstract: The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 23, 2008
    Applicant: TDK CORPORATION
    Inventors: Takahide MASUDA, Masashi Sano, Hiroki Aritomo