Abstract: A drive method for an ink ejection device that cancels residual pressure fluctuations using a signal drive power source, wherein at time (b) a positive voltage V from a single power source is applied to an ink chamber 4b1 and other ink chambers 4 are connected to ground. Therefore, the volume of ink chamber 4b1 increases from a natural volume. At time (c), voltage V applied to the ink chamber 4b1 is stopped and a positive voltage V from the single power source is applied to the other ink chambers 4 so that the volume in the ink chamber 4b1 is reduced from the increased volume to an extent beyond the natural volume that causes an ink droplet to be ejected from the nozzle 12 of ink chamber 4b1. At timing (d), application of positive voltage V to the ink chambers 4c0, 4a1, 4c1, 4a2, 4b2, and 4c2 is stopped so that all the ink chambers revert to the natural volume.

Abstract: An ink ejecting device includes ink channels intercommunicating with slits and air channels intercommunicating with another slits. The ink channels and the air channels have a narrow shape with a rectangular cross-section, and all of the ink channels are filled with ink and the air channels are filled with air. An LSI chip applies a voltage V to a pattern conducting to metal electrodes positioned in air channels located at both sides of an ink channel from which the ink is to be ejected and connects the other patterns connected to metal electrodes in other air channels not adjacent the ejecting ink channel and a pattern conducting to the metal electrodes of the non-ejecting ink channels to a ground line. Therefore, the ink ejecting device of the above structure requires no insulation between ink and electrodes as the working electrodes do not contact the ink.

Abstract: An ink ejecting apparatus is composed of a piezoelectric ceramics plate, a cover plate, and a nozzle plate. The piezoelectric ceramics plate is provided with a plurality of grooves. The cover plate is composed of a front plate and a rear plate. The rear plate is provided with a plurality of ink inlet holes and a manifold. The cover plate is bonded to the piezoelectric ceramics plate to define a plurality of ink chambers communicating with the manifold through the ink inlet holes and a plurality of air chambers that do not communicate with the manifold.

Abstract: A process for forming an electroconductive thin-film coil element uses an InNi alloy film which is heated to a temperature above its melting point and melted off together with an electrode used for electroplating.

Abstract: A soft magnetic multilayer film is manufactured by an electroplating process using an electrolyte containing metal ions. The soft magnetic multilayer film includes soft magnetic layers composed of elements, and deteriorated-soft magnetic layers composed of the same elements and alternating with the soft magnetic layers. The soft magnetic layers are preferably different in composition from the deteriorated-soft magnetic layers. In addition, it is preferable that the metal ions contained in the electrolyte include at least two of Ni ion, Co ion, and Fe ion.