Abstract: The display includes a liquid-crystal panel, a heat-transfer member, and a light-diffusion structure. The liquid-crystal panel includes a display screen. The heat-transfer member is light-transmissive. The heat-transfer member is on an opposite side of the liquid-crystal panel from the display screen. The light-diffusion structure is between the liquid-crystal panel and the heat-transfer member.

Abstract: A vane pump in which noise can be suppressed is provided. A vane pump (1) includes: a housing (2) having a peripheral wall portion (200), a bottom wall portion (201), and a pump chamber (A); a rotor (3) disposed in the pump chamber (A) to be rotatable; a vane (4) disposed to be slidable in the radial direction with respect to the rotor (3) and partitioning the pump chamber (A) into working chambers (A1, A2); and a reed valve (5) that opens and closes a discharge hole (201a) of the bottom wall portion (201). A position at which the sliding direction of the vane (4) with respect to the rotor (3) is inverted from outward in the radial direction to inward is defined as a reference position (?1), and a section of the pump chamber (A) on the discharge hole (201a) side with respect to the reference position (?1) is defined as a discharge section (AD).

Abstract: In one embodiment, a power management apparatus creates a switching plan for switching control of opening/closing of a first switch provided between an energy storage device and a distribution system side, and a second switch provided between the energy storage device and a feeder side, both of which are not closed simultaneously. Further, the power management apparatus determines a switching control content to the first switch and the second switch, according to the created switching plan, and outputs a determined instruction to the first switch and the second switch.

Abstract: An internal combustion engine includes an intake camshaft, a vacuum pump, an oil pump, and an oil feeding passage serving as an oil supplying path. The vacuum pump includes a rotor and a housing. The vacuum pump is formed with a negative pressure chamber that generates a negative pressure, and an oil path connected to the negative pressure chamber. An atmosphere communication hole for supplying air to the negative pressure chamber through the oil feeding passage and the oil path when the vacuum pump is stopped is arranged in the oil feeding passage. The atmosphere communication hole communicates the negative pressure chamber and the atmosphere before an amount of oil in the housing exceeds an allowable oil amount when the vacuum pump is stopped.

Abstract: There is provided a vehicle-interior material, and in particular an instrument panel, which is thin, and which imparts a pleasant tactile sensation. In this integrated-urethane foam molded vehicle-interior material, a urethane foam layer is integrally molded between a resin skin material and a base material. The thickness of the urethane foam layer is 2.5-6.0 mm. The urethane foam layer is a foam body formed from a mixed solution comprising: a polyol mixture (P) which includes a polyol (resin) (A), a water-containing foaming agent (C), and a catalyst (D); and a polyisocyanate component (B). The foaming agent (C) content is 1.5-2.5 wt % when the total weight of (A) is used as a reference. The thickness of the resin skin material is 0.6-1.0 mm. The surface of the skin material is displaced at least 0.40 mm by a load of 10N, and is displaced 1.5-2.5 mm by a load of 40N.

Abstract: A cylinder head located between a cylinder block and a head cover includes a cam chamber arranged in an upper portion of the cylinder head and opening toward the head cover, a projection projecting from a bottom surface of the cam chamber toward the head cover and including an injector insertion hole, and a seating surface arranged in the bottom surface of the cam chamber and receiving a valve spring. The projection includes a top surface defining an injector seal surface around the injector insertion hole. The projection includes a first portion and a second portion separated from the seating surface by different distances along the bottom surface. The distance of the second portion from the seating surface is longer than that of the first portion. A side surface of the first portion is set to have a smaller draft angle than a side surface of the second portion.

Abstract: An electric power management device is an electric power management device that is provided in a facility connected to an electric power system and connects to a mobile unit provided with a power generator and an electricity storage device and includes a receiver operative to accept an instruction for selecting one of a first mode in which generated electric power of the power generator is preferentially supplied to an outside of the mobile unit and a second mode in which the electricity storage device is preferentially charged with the generated electric power of the power generator and control circuitry operative to change a supply destination of the generated electric power of the power generator in accordance with the instruction accepted by the receiver.

Abstract: In one embodiment, a power management apparatus creates a switching plan for switching control of opening/closing of a first switch provided between an energy storage device and a distribution system side, and a second switch provided between the energy storage device and a feeder side, both of which are not closed simultaneously. Further, the power management apparatus determines a switching control content to the first switch and the second switch, according to the created switching plan, and outputs a determined instruction to the first switch and the second switch.

Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: A cermet has a hard phase which contains W and nitrogen, and includes at least one selected from a carbide, nitride and carbonitride of a metal having Ti as a main component, and a binder phase having an iron group metal as a main component. A W amount contained in the whole cermet is 5 to 40% by weight, an interfacial phase including a complex carbonitride with a larger W amount than a W amount of the hard phase being present between grains of the hard phase, and when a W amount contained in the interfacial phase based on the whole metal element is represented by Wb (atomic %), and a W amount contained in the hard phase based on the whole metal element is represented by Wh (atomic %), then, an atomic ratio of Wb to Wh (Wb/Wh) is 1.7 or more. The cermet is excellent in fracture resistance and wear resistance.

Abstract: An injection molding apparatus includes a heating device heating reinforcing fiber assemblies, an injection cylinder to which a thermoplastic resin and the reinforcing fiber assemblies are supplied, a first screw compressing and kneading the thermoplastic resin, a second screw fibrillating the reinforcing fiber assemblies and dispersing reinforcing fibers obtained by the fibrillation into the thermoplastic resin, a resin supply portion supplying the thermoplastic resin to a void formed between the injection cylinder and the first screw, and a reinforcing fiber supply portion supplying the reinforcing fiber assemblies to a void formed between the injection cylinder and the second screw. The second screw serves as one of a non-compression screw and a low compression screw including a low compression ratio by which the reinforcing fibers are inhibited from being excessively broken at a time of receiving a shearing force generated by a rotation of the second screw.

Abstract: A cermet has a WC first hard phase, a second hard phase including one or more of a carbide, nitride and carbonitride of an element(s) of groups 4, 5 and 6 of the Periodic Table including a titanium element, and a mutual solid solution thereof, and a binder phase. In the cermet, a carbon amount CT (% by weight), a tungsten amount CW (% by weight), and a nitrogen amount CN (% by weight) satisfy 0.25<(CN/(CT?0.0653·CW))<6. The cermet has a surface region with a thickness of 5 to 100 ?m which includes the first hard phase and the binder phase, and an inner region which includes the first and second hard phases and the binder phase. In a cross-section of the inner region, a ratio of an area of the first hard phase to an area of the second hard phase is 0.15 to 4.

Abstract: A cermet has a hard phase which contains W and nitrogen, and includes at least one selected from a carbide, nitride and carbonitride of a metal having Ti as a main component, and a binder phase having an iron group metal as a main component. A W amount contained in the whole cermet is 5 to 40% by weight, an interfacial phase including a complex carbonitride with a larger W amount than a W amount of the hard phase being present between grains of the hard phase, and when a W amount contained in the interfacial phase based on the whole metal element is represented by Wb (atomic %), and a W amount contained in the hard phase based on the whole metal element is represented by Wh (atomic %), then, an atomic ratio of Wb to Wh (Wb/Wh) is 1.7 or more. The cermet is excellent in fracture resistance and wear resistance.

Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.

Abstract: A hard powder contains much amount of a complex carbonitride solid solution, which can improve sinterability of a sintered hard alloy and give a uniform structure. The hard powder is a powder containing 90 vol % or more of a complex carbonitride solid solution represented by (Ti1-x,Mx)(C1-y,Ny), wherein M represents at least one element selected from the group consisting of W, Mo, Nb, Zr and Ta, x represents an atomic ratio of M based on the sum of Ti and M, y represents an atomic ratio of N based on the sum of C and N, x and y satisfy 0.05?x?0.5 and 0.01?y?0.75.

Abstract: The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.

Abstract: The present invention relates to a method of manufacturing an electronic part in which on that side of an insulating member sandwiched between conductor film and a lower conductor layer which is adjacent to the conductor film, a conductor portion connected from the lower conductor layer is exposed. In this method, an opening portion having the lower conductor layer as a bottom is formed on the formed area of the conductor portion from the conductor film side, and metal plating is grown from the bottom of the opening portion with the lower conductor layer as an electrode. After this metal plating has reached the conductor film to thereby form a conductor portion in the opening portion, the metal plating is grown on the upper surfaces of the conductor film and the conductor portion with the conductor film and the conductor portion as electrodes, to thereby form a thickness enough to form an upper conductive layer.

Abstract: A method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper surface of the insulating member, whereafter an opening portion having the lower layer wiring as a bottom is formed from the electric power supplying film side. Then metal plating is grown from the edge portion of the electric power supplying film from the opening portion with the electric power supplying film as an electrode, and the opening portion is filled with the metal plating closely contacting with the lower layer wiring to thereby form a conductor portion.

Abstract: The present invention provides a method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper surface of the insulating member, whereafter an opening portion having the lower layer wiring as a bottom is formed from the electric power supplying film side. Then metal plating is grown from the edge portion of the electric power supplying film from the opening portion with the electric power supplying film as an electrode, and the opening portion is filled with the metal plating closely contacting with the lower layer wiring to thereby form a conductor portion.