Patents by Inventor Hiroki Kobayashi

Hiroki Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11914493
    Abstract: Provided is an information processing device which is capable of suppressing a deterioration in accuracy of detecting an anomaly and accuracy of analyzing the anomaly, while suppressing an increase in an amount of data to be stored. The information processing system includes anomaly detection unit that collects event data indicating a predetermined event detected in a process of a device to be monitored, determines whether a predetermined index value related to the event exceeds a preset first threshold, and instructs enhanced monitoring of the device to be monitored and the process related to the event when the index value exceeds the first threshold, and collection instruction unit that determines an additional event being an event to be additionally monitored when the enhanced monitoring is instructed, and instructs the device to be monitored, which is subjected to the enhanced monitoring, to monitor the determined additional event.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: February 27, 2024
    Assignee: NEC CORPORATION
    Inventors: Shuichi Karino, Kazuhiko Isoyama, Yuji Kobayashi, Yoshiaki Sakae, Hiroki Tagato, Masato Yasuda
  • Publication number: 20240053139
    Abstract: A gauge carrier holds an optical fiber having a gauge portion provided in one axial part thereof. A center region has a predefined stiffness and holds the gauge portion. Length in the longitudinal direction of the gauge carrier is equal to or greater than length of the gauge portion. Two split regions each have a stiffness different from that of the center portion, total length of the split regions in the longitudinal direction of the gauge carrier is greater than the length of the center region in the longitudinal direction, one of the split regions is positioned in front of the center region and holds a part of the optical fiber that is in front of the gauge portion, and the other is positioned in back of the center region and holds a part of the optical fiber that is in the back of the gauge portion.
    Type: Application
    Filed: January 25, 2021
    Publication date: February 15, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazunori TAKAGAKI, Yohei ITO, Hiroki KOBAYASHI, Tatsuya KOYAMA, Shigeru UTSUMI
  • Publication number: 20240054450
    Abstract: In an article supply device managing method, arrangement information in a sales area and article information of each article supply device in the sales area is acquired from an article supply device database, which stores the arrangement information relating to a layout of the respective article supply devices arranged in the sales area and the article information relating to an article which can be supplied from each article supply device arranged in the sales area, and a layout image where an object image of each article supply device corresponding to the arrangement of the article supply devices in the predetermined sales area is arranged is displayed on a terminal a user operates, by using the article information and the arrangement information of each article supply devices in the predetermined sales area. The object image includes article information of the article supply device corresponding to the object image.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 15, 2024
    Inventors: Hajime KONDO, Hiroki KOBAYASHI
  • Publication number: 20240046339
    Abstract: A management apparatus comprises a processor and a non-volatile computer readable memory in which a computer code is stored, wherein, based on the computer code stored in the non-volatile memory, the processor manages an inventory status information of items, displays, on a terminal, a purchase screen for purchasing at least one of the items, performs a lottery for the at least one of the items to be provided, by using the inventory status information of the items when an item purchase procedure is completed, determines the at least one of the items to be provided based on a lottery result, and presents an item image of the determined at least one of the items on the terminal.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Inventors: Hajime KONDO, Tatsushi IKARASHI, Kenichi MINAGAWA, Hiroki KOBAYASHI
  • Patent number: 11875042
    Abstract: According to one embodiment, a memory system includes a non-volatile memory, a controller for writing data to the non-volatile memory and reading data from the non-volatile memory, and a power supply circuit. The power supply circuit includes a capacitor. The power supply circuit supplies power to the non-volatile memory and the controller from an external power supply and supplies power to the non-volatile memory and the controller from the capacitor if the external power supply is interrupted. The controller controls the power supply circuit to charge the capacitor when current consumption of the non-volatile memory is less than some first current level.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: January 16, 2024
    Assignee: Kioxia Corporation
    Inventor: Hiroki Kobayashi
  • Patent number: 11865850
    Abstract: A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: January 9, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shingo Tomimatsu, Masahiko Sato, Hiroki Kobayashi, Osamu Yagi, Kenta Ono
  • Patent number: 11862689
    Abstract: Group-III element nitride semiconductor substrate including a first surface and a second surface that are easy to visually distinguish from each other. An end portion is easily detected with an optical sensor, a large effective area (area that can be used in device production) can be secured, and warping of the entirety of the substrate is reduced. A Group-III element nitride semiconductor substrate includes a first surface; and a second surface, wherein the first surface is a mirror surface, the second surface has a second-surface central region and a second-surface outer peripheral region, the second-surface central region is a mirror surface, and the second-surface outer peripheral region is a non-mirror surface.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: January 2, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Katsuhiro Imai, Masahiro Sakai, Hiroki Kobayashi
  • Patent number: 11848519
    Abstract: It is aimed to reduce cost. A female connector (F) includes a female housing (30) to be connected to a male housing (10), a lock functioning portion (57) provided on the female housing (30) and configured to lock the female housing (30) and the male housing (10) in a connected state by being locked to the male housing (10), and a releasing member (63) attachable to and detachable to the female housing (30), the releasing member being a component separate from the female housing (30). The releasing member (63) can displace the lock functioning portion (57) to disengage the lock functioning portion (57) from the male housing (10) while being mounted on the female housing (30).
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: December 19, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsuya Miyamura, Yutaka Kobayashi, Hiroki Kobayashi, Pipatthana Phatiwuttipat, Teruo Hara
  • Publication number: 20230395373
    Abstract: A Group-III element nitride semiconductor substrate includes: a first surface; and a second surface, wherein warping of a crystal plane of the first surface has a plurality of extremes.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Inventors: Masahiro SAKAI, Katsuhiro IMAI, Hiroki KOBAYASHI
  • Publication number: 20230382122
    Abstract: An inkjet printing method including: discharging ink contained in an ink storage unit, from a nozzle of a nozzle forming surface of a discharging unit; and supplying the ink from the ink storage unit to the discharging unit. The ink includes specific components and satisfies a specific relation between dynamic surface tension and time. The supplying includes: forming a closed space by covering the nozzle forming surface with a lid member, and freely controlling a pressure between the discharging unit and the ink storage unit; and forming an open space by opening the lid member on the nozzle forming surface, and setting the pressure to be the same as atmospheric pressure. A negative pressure difference between the ink storage unit and the discharging unit is 70-120 mmAq before discharge of the ink, 30-80 mmAq during the discharging, and the former is equal to or greater than the latter.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: Ricoh Company, Ltd.
    Inventors: Kenta Hagiwara, Shunsuke Horie, Hiroki Kobayashi
  • Patent number: 11799224
    Abstract: It is aimed to provide a connector capable of suppressing the generation of an excessive stress in a connecting part of a flat cable and a terminal. A connector is provided with a flat cable (60) including a hole (64) serving as a receiving portion, a housing (10) including an installation surface (19) on which the flat cable (60) is arranged and a protrusion (21) projecting from the installation surface (19) and to be inserted into the hole (64), and a terminal (90) to be connected to a conductor (70) of the flat cable (60) and locked to the housing (10). The flat cable (60) includes an extra length portion (66) providing an extra length as compared to flat arrangement on the installation surface (19) in a part surrounding the protrusion (21) or a part arranged between the terminal (90) and the protrusion (21) in an assembled state.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: October 24, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hiroki Kobayashi, Yasuo Omori
  • Publication number: 20230331413
    Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
    Type: Application
    Filed: June 22, 2023
    Publication date: October 19, 2023
    Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
  • Publication number: 20230327362
    Abstract: A surface mount connector 10 is to be mounted on a circuit board 5 having a plate thickness direction oriented in a vertical direction, and provided with a plurality of terminals 11, a plurality of inner housings 20 for holding the plurality of terminals 11, and an outer housing 30 for accommodating the plurality of inner housings 20 in parallel. Leads 13 to be connected to the circuit board 5 are provided on lower end parts of the plurality of terminals 11. Each of the plurality of inner housings 20 is supported independently movably in the vertical direction in the outer housing 30.
    Type: Application
    Filed: July 29, 2021
    Publication date: October 12, 2023
    Inventors: Hiroki KOBAYASHI, Shinji NOZAKI
  • Patent number: 11780243
    Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: October 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Haruhisa Uezawa, Hiroki Kobayashi, Katsuhiro Okubo, Kentaro Murakami, Takahiro Kanegae, Shingo Tomimatsu
  • Publication number: 20230299535
    Abstract: A connector 10 of the present disclosure is provided with a plurality of terminals 30, a plurality of wires 20, a plurality of sub-housings 60, 70 and a lock member 80. The terminal 30 includes a locked portion. The sub-housings 60, 70 include cavities 61, 71 for accommodating the terminals 30 and locking portions for retaining the terminals 30 by locking the locked portions from behind. The plurality of wires 20 are respectively pulled out rearward from the plurality of terminals 30. The plurality of sub-housings 60, 70 are assembled with each other with the locked portions of the terminals 30 facing in the same direction, and held in an assembled state by the lock member 80.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 21, 2023
    Inventors: Hiroki KOBAYASHI, Hajime MATSUI
  • Publication number: 20230282711
    Abstract: Group-III element nitride semiconductor substrate including a first surface and a second surface that are easy to visually distinguish from each other. An end portion is easily detected with an optical sensor, a large effective area (area that can be used in device production) can be secured, and warping of the entirety of the substrate is reduced. A Group-III element nitride semiconductor substrate includes a first surface; and a second surface, wherein the first surface is a mirror surface, the second surface has a second-surface central region and a second-surface outer peripheral region, the second-surface central region is a mirror surface, and the second-surface outer peripheral region is a non-mirror surface.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 7, 2023
    Inventors: Katsuhiro IMAI, Masahiro SAKAI, Hiroki KOBAYASHI
  • Patent number: 11749933
    Abstract: A joint connector 10 to be connected to wires 11 includes a lower housing 30 and an upper cover 60. The lower housing 30 accommodates terminals 12 to be respectively connected to front end parts in an extending direction of the wires 11. The upper cover 60 is assembled to close an upper surface of the lower housing 30. The lower housing 30 or the upper cover 60 includes a lower guide portion 36 or an upper guide portion 69 for bending the wires 11 by contacting the wires 11 with the lower housing 30 and the upper cover 60 assembled.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: September 5, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hiroki Kobayashi, Hajime Kawase, Masaaki Tabata, Teruo Hara, Hajime Matsui
  • Publication number: 20230267794
    Abstract: An article supply apparatus capable of supplying an article, comprises an accommodation unit in which articles are accommodated; a supply unit which supplies at least one of the articles accommodated in the accommodation unit; an operation unit capable of performing an operation in order to supply the at least one of the articles from the supply unit; a lock unit which locks the operation unit so as to make the operation to the operation unit unavailable; a control unit which releases a lock of the lock unit; and a notification control unit, capable of notifying a first state where the lock of the lock unit and a second state where the operation of the operation unit is completed, wherein a way of notification of the first state is different from that of the second state.
    Type: Application
    Filed: February 21, 2023
    Publication date: August 24, 2023
    Inventors: Hajime KONDO, Hiroki KOBAYASHI, Akira MIZUSHINA
  • Patent number: 11729959
    Abstract: Disclosed is a mounting substrate manufacturing system including: a component mounting system including: a component mounting device; a housing body stocker that stores a housing body; a component supply device that pulls out a carrier tape from the housing body stored in the housing body stocker and transports the carrier tape to the component mounting device; and a replacement device that includes an end effector for holding the housing body, and replaces the housing body stored in the housing body stocker, wherein the housing body stocker includes at least a pair of partition members that partition a storage space for storing the housing body, at least one of the partition members adjacent to each other includes an assist portion that assists a replacement operation of replacing the housing body, and the replacement device recognizes a position for a replacement operation by bringing the end effector or the housing body held thereby into contact with the assist portion.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: August 15, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroki Kobayashi, Ryouji Eguchi
  • Patent number: D1000397
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: October 3, 2023
    Assignee: Molex, LLC
    Inventors: Ayako Matsumoto, Hiroki Kobayashi, Kensuke Yamada