Abstract: A main power supply having a large capacity and a backup power supply having a small capacity are switchable by a power supply switching determination unit in a system. A motor control device drives a motor by the main power supply or the backup power supply. A drive control unit outputs a drive signal, calculated by feedback control of the current detection value with respect to the current command value, to an inverter circuit. When the power supply switching determination unit switches from the main power supply to the backup power supply, the drive control unit moves from a normal control using the main power supply to a backup control that restricts an electric power consumption and prevents the backup power supply from stopping.

Abstract: The hermetic terminal includes a metal base that is provided with at least one sealing hole, a lead that is inserted in the sealing hole provided on the metal base, an insulating material that hermetically seals the metal base and the lead, and a heat insulating member that is provided to cover at least a partial surface of the hermetic terminal which is located inside a pressure-resistant container after the hermetic terminal is fixed to the pressure-resistant container and comes into contact with refrigerant sealed in the pressure-resistant container.

Abstract: A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.

Abstract: A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture ratio of the openings in an outer peripheral portion of the ground conductor is less than an aperture ratio of the openings in an inner peripheral portion of the ground conductor.

Abstract: A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.

Abstract: A cooling system for a battery pack which can reduce the number of components, manufacturing cost and an installation space, is provided. The battery pack includes high-voltage electrically conductive paths connected to a positive electrode and a negative electrode thereof, respectively. The high-voltage electrically conductive path connected to the positive electrode serves as a cooling member. The high-voltage electrically conductive path connected to the positive electrode is arranged along the battery pack to absorb heat generated at the battery pack and dissipate the absorbed heat at a location distant from the battery pack. The invention takes an advantage of the superior heat conductivity of the high-voltage electrically conductive path to cool down the battery pack.

Abstract: A cooling system for a battery pack which can reduce the number of components, manufacturing cost and an installation space, is provided. The battery pack includes high-voltage electrically conductive paths connected to a positive electrode and a negative electrode thereof, respectively. The high-voltage electrically conductive path connected to the positive electrode serves as a cooling member. The high-voltage electrically conductive path connected to the positive electrode is arranged along the battery pack to absorb heat generated at the battery pack and dissipate the absorbed heat at a location distant from the battery pack. The invention takes an advantage of the superior heat conductivity of the high-voltage electrically conductive path to cool down the battery pack.