Abstract: There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 ?m or less.

Abstract: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

Abstract: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

Abstract: An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor device 1 includes a semiconductor chip 20 and a substrate 10 that are molded with a mold resin layer 40. The semiconductor device 1 includes a resin layer 50 having a thickness of 200 nm or less different from the mold resin layer 40 between the cured mold resin layer 40 and the substrate 10. The resin layer 50 present between the mold resin layer 40 and the substrate 10 is preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.

Abstract: There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 ?m or less.

Abstract: An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.

Abstract: An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor device 1 includes a semiconductor chip 20 and a substrate 10 that are molded with a mold resin layer 40. The semiconductor device 1 includes a resin layer 50 having a thickness of 200 nm or less different from the mold resin layer 40 between the cured mold resin layer 40 and the substrate 10. The resin layer 50 present between the mold resin layer 40 and the substrate 10 is preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.

Abstract: Provided are a filled syringe and a method for storing a resin composition, which can suppress generation of a void between the resin composition and an inner surface of the syringe. A filled syringe 1 includes a syringe 10, a plunger 20, and a resin composition 30. When a longitudinal direction of the syringe 10 is a vertical direction and the plunger 20 is above the resin composition 30, a ratio of a cross-sectional area 25 of the plunger at a position of a liquid level 31 at top of the resin composition to a cross-sectional area 35 enclosed by an inner surface 11 of the syringe at the same position as the liquid level 31 at the top of the resin composition is 95% or less.

Abstract: An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.