Abstract: A radiation imaging system includes a radiation imaging apparatus that can be in a start-up state where acquisition processing to acquire internal information is executed and in a standby state where the acquisition processing is not executed, and a control apparatus, wherein the control apparatus transmits a start-up signal to the radiation imaging apparatus, wherein the radiation imaging apparatus transitions from the standby state to the start-up state in response to receipt of the start-up signal, execute the acquisition processing, and transmit the internal information to the control apparatus, and wherein, in a case where the internal information received from the radiation imaging apparatus is internal information corresponding to a normal state of the radiation imaging apparatus, the control apparatus provides notification external to the radiation imaging system of information indicating that operation of the radiation imaging apparatus is normal.

Abstract: A radiation imaging apparatus for use in a radiation imaging system including a radiation source and a camera includes one or more controllers that acquire state information of the radiation imaging apparatus and perform, in response to acquisition of state information corresponding to an abnormality of the radiation imaging apparatus, communication to cause the camera to perform image capturing on a range including the radiation imaging apparatus.

Abstract: For example, deterioration in image quality due to end-surface vignetting is suppressed. A light emitting device includes at least two light emitting elements provided on a substrate, and a transparent resin part provided so as to cover the light emitting elements, in which in a sectional view, when the size of the width of the light emitting element positioned at an end part is a (?m), a surface distance between the light emitting element and a surface of the transparent resin part is x (?m), an end surface distance between the light emitting element and an end surface of the transparent resin part closest to the light emitting element is y (?m), and the refractive index of the transparent resin part is ?m, an expression (1) below or expressions (2) and (3) below are satisfied. y<(1.44?m?0.76)×x+(0.08?m?0.04)×a?0.02?m?0.47??(Expression 1) y<(1.44?m?0.76)×x+(0.08?m?0.04)×a?0.02?m?0.47??(Expression 2) y<(1.44?m?0.76)×x+(0.15?m?0.08)×a?0.06?m?0.

Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.

Abstract: There are provided a color correction filter for a white organic electroluminescent light source including a resin and 0.1 part by mass or more of a coloring agent having an absorption maximum wavelength in a range of 560 to 620 nm or 460 to 520 nm with respect to 100 parts by mass of the resin, and having a moisture content of 0.5% by mass or less, and an organic EL display device having this filter.

Abstract: Provided are a resin composition including a compound represented by Formula (1) and a resin, a film and a filter including the resin composition, a liquid crystal display device and a solid-state imaging element including the filter, and a compound suitable as a light absorbing component of the resin composition and the filter. In Formula (1), Dye represents a colorant structural part obtained by removing n1 hydrogen atoms from a squarylium compound having a specific structure. Q1 is a structural part in which energy levels of a highest occupied molecular orbital and a lowest unoccupied molecular orbital satisfy a specific condition. L1 represents a divalent linking group and n1 represents an integer of 1 to 4.

Abstract: Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.

Abstract: The present invention provides an optically clear adhesive sheet that has excellent flexibility and prevents delay bubbles in high temperature and high humidity environments. The optically clear adhesive sheet of the present invention sequentially includes a first surface-adhesive layer, an intermediate adhesive layer, and a second surface-adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a higher storage elastic modulus at 85° C. than the intermediate adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a storage elastic modulus at 85° C. of 3.0×104 Pa or higher and 30.0×104 Pa or lower. The intermediate adhesive layer has a storage elastic modulus at 85° C. of 1.0×104 Pa or higher and 15.0×104 Pa or lower. The intermediate adhesive layer contains polyurethane.

Abstract: A light-emitting device assembly includes a light-emitting device including a light-emitting layer, a first electrode, and a second electrode, and a first connecting portion and a second connecting portion provided on a base, in which the first connecting portion and the second connecting portion are separated from each other by a separation portion, the base is exposed from the separation portion, a wide portion is on a first connecting portion side of the separation portion, the first electrode includes a first portion and a second portion, the second portion of the first electrode is connected to the first connecting portion, the first portion of the first electrode extends from the second portion of the first electrode, and an orthographic projection image of the first portion of the first electrode with respect to the base and the wide portion of the separation portion overlap with each other at least in part.

Abstract: A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.

Abstract: A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.

Abstract: A light-emitting device assembly includes: a light-emitting device 11 including a light-emitting layer, a first electrode 31, and a second electrode 32; and a first connecting portion 41 and a second connecting portion 42 provided on a base 40, in which the first connecting portion 41 and the second connecting portion 42 are separated from each other by a separation portion 43, the base 40 being exposed from the separation portion 43, a wide portion 44 is provided on a first connecting portion side of the separation portion 43, the first electrode 31 includes a first portion 31A and a second portion 31B, the second portion 31B of the first electrode is connected to the first connecting portion 41, the first portion 31A of the first electrode extends from the second portion 31B of the first electrode, and an orthographic projection image of the first portion 31A of the first electrode with respect to the base 40 and the wide portion 44 of the separation portion 43 overlap with each other at least in part.

Abstract: A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: The present invention provides an optically clear adhesive sheet that has excellent flexibility and prevents delay bubbles in high temperature and high humidity environments. The optically clear adhesive sheet of the present invention sequentially includes a first surface-adhesive layer, an intermediate adhesive layer, and a second surface-adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a higher storage elastic modulus at 85° C. than the intermediate adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a storage elastic modulus at 85° C. of 3.0×104 Pa or higher and 30.0×104 Pa or lower. The intermediate adhesive layer has a storage elastic modulus at 85° C. of 1.0×104 Pa or higher and 15.0×104 Pa or lower. The intermediate adhesive layer contains polyurethane.

Abstract: The present invention provides an optically clear adhesive sheet preventing whitening and delay bubbles during storage in a high-humidity environment using a heat-cured polyurethane that has excellent flexibility and is capable of giving a thick film. The optically clear adhesive sheet of the present invention contains a heat-cured polyurethane, the heat-cured polyurethane being a cured product of a thermosetting polyurethane composition containing a polyol component and a polyisocyanate component, the polyisocyanate component containing both a polyisocyanate having a hydrophilic unit and a polyisocyanate having no hydrophilic unit, the optically clear adhesive sheet showing a moisture absorption coefficient of 3600 ppm or lower after being subjected to a test in which the sheet is left in a high-temperature, high-humidity environment with a temperature of 85° C. and a humidity of 85% for three hours.

Abstract: A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.

Abstract: A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.

Abstract: A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.